D87C75PF-200V10 datasheet, PDF

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D87C75PF-200V10: DescriptionParallel IO Port, 8-Bit, CMOS, CDIP40; CategoryThe embedded processor and controller Microcontrollers and processors; File Size2MB，23 Pages; ManufacturerIntel; Websitehttp://www.intel.com/

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D87C75PF-200V10 Overview

Parallel IO Port, 8-Bit, CMOS, CDIP40

D87C75PF-200V10 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Intel
package instruction	DIP, DIP40,.6
Reach Compliance Code	unknown
JESD-30 code	R-XDIP-T40
JESD-609 code	e0
Number of digits	8
Number of terminals	40
Maximum operating temperature	70 °C
Minimum operating temperature
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP40,.6
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	5 V
Certification status	Not Qualified
Nominal supply voltage	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL

D87C75PF-200V10 Related Products

	D87C75PF-200V10	N87C75PF-250V05	N87C75PF-200V10	N87C75PF-200V05	N87C75PF-250V10	D87C75PF-250V05	D87C75PF-200V05	D87C75PF-250V10
Description	Parallel IO Port, 8-Bit, CMOS, CDIP40	Parallel IO Port, 8-Bit, CMOS, PQCC44	Parallel IO Port, 8-Bit, CMOS, PQCC44	Parallel IO Port, 8-Bit, CMOS, PQCC44	Parallel IO Port, 8-Bit, CMOS, PQCC44	IC,I/O PORT,8-BIT,CMOS,DIP,40PIN,CERAMIC	Parallel IO Port, 8-Bit, CMOS, CDIP40	Parallel IO Port, 8-Bit, CMOS, CDIP40
Maker	Intel	Intel	Intel	Intel	Intel	Intel	Intel	Intel
package instruction	DIP, DIP40,.6	QCCJ, LDCC44,.7SQ	QCCJ, LDCC44,.7SQ	QCCJ, LDCC44,.7SQ	QCCJ, LDCC44,.7SQ	DIP, DIP40,.6	DIP, DIP40,.6	DIP, DIP40,.6
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
JESD-30 code	R-XDIP-T40	S-PQCC-J44	S-PQCC-J44	S-PQCC-J44	S-PQCC-J44	R-XDIP-T40	R-XDIP-T40	R-XDIP-T40
JESD-609 code	e0	e0	e0	e0	e0	e0	e0	e0
Number of digits	8	8	8	8	8	8	8	8
Number of terminals	40	44	44	44	44	40	40	40
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
Package body material	CERAMIC	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC	CERAMIC	CERAMIC
encapsulated code	DIP	QCCJ	QCCJ	QCCJ	QCCJ	DIP	DIP	DIP
Encapsulate equivalent code	DIP40,.6	LDCC44,.7SQ	LDCC44,.7SQ	LDCC44,.7SQ	LDCC44,.7SQ	DIP40,.6	DIP40,.6	DIP40,.6
Package shape	RECTANGULAR	SQUARE	SQUARE	SQUARE	SQUARE	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER	IN-LINE	IN-LINE	IN-LINE
power supply	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Nominal supply voltage	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	YES	YES	YES	YES	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	J BEND	J BEND	J BEND	J BEND	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	QUAD	QUAD	QUAD	QUAD	DUAL	DUAL	DUAL
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	-	incompatible	incompatible

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