EEWORLDEEWORLDEEWORLD

Part Number

Search

TKJ0C10A98LSD

Description
MIL Series Connector, 6 Contact(s), Aluminum Alloy, Female, Solder Terminal, Receptacle
CategoryThe connector    The connector   
File Size107KB,2 Pages
ManufacturerITT
Websitehttp://www.ittcannon.com/
Download Datasheet Parametric View All

TKJ0C10A98LSD Overview

MIL Series Connector, 6 Contact(s), Aluminum Alloy, Female, Solder Terminal, Receptacle

TKJ0C10A98LSD Parametric

Parameter NameAttribute value
MakerITT
Reach Compliance Codecompliant
ECCN codeEAR99
Other featuresSTANDARD: MIL-DTL-38999
Back shell typeSOLID
Body/casing typeRECEPTACLE
Connector typeMIL SERIES CONNECTOR
Contact to complete cooperationGOLD
Contact completed and terminatedGOLD OVER NICKEL
Contact point genderFEMALE
Coupling typeBAYONET
DIN complianceNO
empty shellNO
Filter functionYES
IEC complianceNO
JESD-609 codee4
MIL complianceYES
Manufacturer's serial numberTKJ0
Plug informationMULTIPLE MATING PARTS AVAILABLE
Mixed contactsNO
Installation typePANEL
OptionsGENERAL PURPOSE
Shell surfaceCADMIUM PLATED
Shell materialALUMINUM ALLOY
Housing size10
Termination typeSOLDER
Total number of contacts6
MIL-DTL-38999 Series II Filter Connectors
Wall Mounting Receptacle
TKJ0
POLARIZING
KEYWAY
.322 (8.17) MAX.
1.066
(27.08)
MAX.
T THREAD
.322 (8.17) MAX.
TKJ
1.600
(40.64)
MAX.
T THREAD
J MAX.
M
N
A
DIA.
A
D
P DIA.
BLUE BAND
(INDICTATES REAR
RELEASE CONTACT
RETENTION SYSTEM)
.069 (1.74) MAX.
.069 (1.74)
MAX.
.090 (2.29)
MAX.
Crimp Piggyback
Wall Mounting Receptacle (Back Panel)
TKJ3
.477 (11.35) MAX.
P DIA.
POLARIZING
KEYWAY
J DIA.
M
N
.322 (8.17) MAX.
T THREAD
1.066
(27.08)
MAX.
.477 (11.35) MAX.
.322 (8.17) MAX.
T THREAD
1.600
(40.64)
MAX.
A
DIA.
C
DIA.
BLUE BAND
(INDICATES REAR
RELEASE CONTACT
RETENTION SYSTEM)
A
C
D
.069 (1.74) MAX.
.069 (1.74) MAX.
.090 (2.29)
MAX.
Crimp Piggyback
P
+.005 (0.13)
N
-.010 (0.25)
T.P
.594 (15.09) .125 (3.18)
.719 (18.26) .125 (3.18)
.812 (20.62) .125 (3.18)
.906 (23.01) .125 (3.18)
.969 (24.61) .125 (3.18)
1.062 (26.97) .125 (3.18)
1.156 (27.36) .125 (3.18)
1.250 (31.76) .125 (3.18)
1.375 (34.92) .152 (3.86)
Shell
Size
8
10
12
14
16
18
20
22
24
A
Dia. Max.
.474 (12.04)
.591 (15.01)
.751 (19.08)
.876 (22.25)
1.001 (25.43)
1.126 (28.60)
1.251 (31.78)
1.376 (34.95)
1.501 (38.13)
C
Dia. Max.
.547 (13.89)
.672 (17.06)
.844 (21.43)
.969 (24.61)
1.094 (27.78)
1.219 (30.96)
1.344 (34.13)
1.469 (37.31)
1.594 (40.48)
D
Dia. Max.
.299 (7.59)
.427 (10.85)
.541 (13.74)
.666 (16.92)
.791 (20.09)
.880 (22.35)
1.005 (25.52)
1.130 (28.70)
1.255 (31.88)
G
Dia. Max.
.562 (14.27)
.594 (15.08)
.720 (13.28)
.844 (21.43)
.969 (24.61)
1.063 (27.00)
1.188 (30.17)
1.313 (33.35)
1.438 (36.52)
J
Dia. Max.
.563 (14.30)
.680 (17.27)
.859 (21.82)
.984 (24.99)
1.108 (28.14)
1.233 (31.32)
1.358 (34.49)
1.483 (37.67)
1.610 (40.89)
M
Max.
.828 (21.03)
.954 (24.23)
1.047 (26.59)
1.141 (28.98)
1.234 (31.34)
1.328 (33.73)
1.453 (36.91)
1.578 (39.08)
1.703 (43.26)
T
Thread
.5625-24UNEF-2A
11/16-24UNEF-2A
13/16-20UNEF-2A
15/16-20UNEF-2A
1-1/16-18UNEF-2A
1-1/16-18UNEF-2A
1-3/16-18UNEF-2A
1-5/16-18UNEF-2A
1-7/16-18UNEF-2A
Dimensions shown in inch (mm)
Specifications and dimensions subject to change
www.ittcannon.com
27
Misalignment issues between 3D packaging and planar packaging
[If you don't understand, ask] The previous post said that the mismatch between 3D package and 2D can be solved by changing the XYZ angle of the 3D model [url]https://en.eeworld.com/bbs/forum.php?mod=...
shaorc PCB Design
EEWORLD University Hall ----Embedded Systems and Experiments Xiamen University
Embedded Systems and Experiments Xiamen University : https://training.eeworld.com.cn/course/5444This course is a core basic course for the major of electronic information science and technology, and i...
Lemontree MCU
Storage DDR SAMSUNG MICRON
Storage DDR SAMSUNG MICRON MT47H256M8EB-25E:CMT40A256M16GE-083EIT:BMT41K64M16TW-107:JMT41K128M16JT-125:KMT41K128M16JT-125 IT:KMT41K256M8DA-125IT:KMT41K256M16TW-107:PMT41K512M8DA-107IT:P K4E6E304EB-EGC...
深圳市嘉伟亿科技-邹S MCU
Near Field Communication (NFC) Transceiver Reference Design
This Near Field Communication (NFC) reference design outlines the required components and layout considerations, and provides firmware examples to illustrate how to implement NFC into an application t...
Jacktang RF/Wirelessly
In electromagnetic field simulation, what are the advantages and disadvantages of FDTD and FEM algorithms?
[p=null, 0, center][color=rgb(62, 62, 62)][font=-apple-system-font, BlinkMacSystemFont, "][size=17px][/size][/font][/color][/p] [p=null, 2, left][color=rgb(62, 62, 62)][font=-apple-system-font, BlinkM...
btty038 RF/Wirelessly
X-NUCLEO-IKS01A3 sensor driver transplantation based on STM8S-DISCOVERY
[i=s]This post was last edited by sylar^z on 2019-7-30 17:43[/i]This porting of the X-NUCLEO-IKS01A3 sensor driver is based on the STM8S-DISCOVERY development board, using the official en.x-cube-mems1...
sylar^z ST Sensors & Low Power Wireless Technology Forum

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号