350mA, 60V, N-CHANNEL, Si, SMALL SIGNAL, MOSFET, TO-92
Parameter Name | Attribute value |
Is it Rohs certified? | conform to |
Maker | Microchip |
package instruction | CYLINDRICAL, O-PBCY-T3 |
Reach Compliance Code | compliant |
ECCN code | EAR99 |
Other features | LOGIC LEVEL COMPATIBLE |
Configuration | SINGLE WITH BUILT-IN DIODE |
Minimum drain-source breakdown voltage | 60 V |
Maximum drain current (ID) | 0.35 A |
Maximum drain-source on-resistance | 3 Ω |
FET technology | METAL-OXIDE SEMICONDUCTOR |
Maximum feedback capacitance (Crss) | 8 pF |
JEDEC-95 code | TO-92 |
JESD-30 code | O-PBCY-T3 |
JESD-609 code | e3 |
Number of components | 1 |
Number of terminals | 3 |
Operating mode | ENHANCEMENT MODE |
Package body material | PLASTIC/EPOXY |
Package shape | ROUND |
Package form | CYLINDRICAL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
Polarity/channel type | N-CHANNEL |
Certification status | Not Qualified |
surface mount | NO |
Terminal surface | MATTE TIN |
Terminal form | THROUGH-HOLE |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | NOT SPECIFIED |
transistor applications | SWITCHING |
Transistor component materials | SILICON |
TN0106N3-GP013 | TN0106N3-GP003 | TN0106N3-GP005 | TN0106N3-GP014 | |
---|---|---|---|---|
Description | 350mA, 60V, N-CHANNEL, Si, SMALL SIGNAL, MOSFET, TO-92 | SMALL SIGNAL, FET | SMALL SIGNAL, FET | SMALL SIGNAL, FET |
Maker | Microchip | Microchip | Microchip | Microchip |
package instruction | CYLINDRICAL, O-PBCY-T3 | CYLINDRICAL, O-PBCY-T3 | ROHS COMPLIANT PACKAGE-3 | ROHS COMPLIANT PACKAGE-3 |
Reach Compliance Code | compliant | compliant | compliant | compliant |
ECCN code | EAR99 | EAR99 | EAR99 | EAR99 |
Configuration | SINGLE WITH BUILT-IN DIODE | SINGLE WITH BUILT-IN DIODE | SINGLE WITH BUILT-IN DIODE | SINGLE WITH BUILT-IN DIODE |
Minimum drain-source breakdown voltage | 60 V | 60 V | 60 V | 60 V |
Maximum drain current (ID) | 0.35 A | 0.35 A | 0.35 A | 0.35 A |
Maximum drain-source on-resistance | 3 Ω | 3 Ω | 3 Ω | 3 Ω |
FET technology | METAL-OXIDE SEMICONDUCTOR | METAL-OXIDE SEMICONDUCTOR | METAL-OXIDE SEMICONDUCTOR | METAL-OXIDE SEMICONDUCTOR |
Maximum feedback capacitance (Crss) | 8 pF | 8 pF | 8 pF | 8 pF |
JEDEC-95 code | TO-92 | TO-92 | TO-92 | TO-92 |
JESD-30 code | O-PBCY-T3 | O-PBCY-T3 | O-PBCY-T3 | O-PBCY-T3 |
Number of components | 1 | 1 | 1 | 1 |
Number of terminals | 3 | 3 | 3 | 3 |
Operating mode | ENHANCEMENT MODE | ENHANCEMENT MODE | ENHANCEMENT MODE | ENHANCEMENT MODE |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
Package shape | ROUND | ROUND | ROUND | ROUND |
Package form | CYLINDRICAL | CYLINDRICAL | CYLINDRICAL | CYLINDRICAL |
Polarity/channel type | N-CHANNEL | N-CHANNEL | N-CHANNEL | N-CHANNEL |
surface mount | NO | NO | NO | NO |
Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
Terminal location | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
transistor applications | SWITCHING | SWITCHING | SWITCHING | SWITCHING |
Transistor component materials | SILICON | SILICON | SILICON | SILICON |
Is it Rohs certified? | conform to | conform to | conform to | - |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |