Standard SRAM, 64KX16, 35ns, CMOS, PDSO44, 18.4 X 10.2 MM, TSOP2-44
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | ALSC [Alliance Semiconductor Corporation] |
Parts packaging code | TSOP2 |
package instruction | SOP, TSOP44,.46,32 |
Contacts | 44 |
Reach Compliance Code | unknown |
ECCN code | EAR99 |
Maximum access time | 35 ns |
I/O type | COMMON |
JESD-30 code | R-PDSO-G44 |
JESD-609 code | e0 |
memory density | 1048576 bit |
Memory IC Type | STANDARD SRAM |
memory width | 16 |
Number of functions | 1 |
Number of terminals | 44 |
word count | 65536 words |
character code | 64000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 64KX16 |
Output characteristics | 3-STATE |
Package body material | PLASTIC/EPOXY |
encapsulated code | SOP |
Encapsulate equivalent code | TSOP44,.46,32 |
Package shape | RECTANGULAR |
Package form | SMALL OUTLINE |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | 240 |
power supply | 1.8 V |
Certification status | Not Qualified |
Maximum standby current | 4e-7 A |
Minimum standby current | 1.2 V |
Maximum slew rate | 0.025 mA |
Maximum supply voltage (Vsup) | 1.95 V |
Minimum supply voltage (Vsup) | 1.65 V |
Nominal supply voltage (Vsup) | 1.8 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | GULL WING |
Terminal pitch | 0.8 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED |
AS7C181026LL-35TC | AS7C181026LL-35BC | AS7C181026LL-35TI | |
---|---|---|---|
Description | Standard SRAM, 64KX16, 35ns, CMOS, PDSO44, 18.4 X 10.2 MM, TSOP2-44 | Standard SRAM, 64KX16, 35ns, CMOS, PBGA48, 8 X 6 MM, 0.75 MM PITCH, CSP, BGA-48 | Standard SRAM, 64KX16, 35ns, CMOS, PDSO44, 18.4 X 10.2 MM, TSOP2-44 |
Is it Rohs certified? | incompatible | incompatible | incompatible |
Parts packaging code | TSOP2 | BGA | TSOP2 |
package instruction | SOP, TSOP44,.46,32 | BGA, BGA48,6X8,30 | SOP, TSOP44,.46,32 |
Contacts | 44 | 48 | 44 |
Reach Compliance Code | unknown | unknown | unknown |
ECCN code | EAR99 | EAR99 | EAR99 |
Maximum access time | 35 ns | 35 ns | 35 ns |
I/O type | COMMON | COMMON | COMMON |
JESD-30 code | R-PDSO-G44 | R-PBGA-B48 | R-PDSO-G44 |
JESD-609 code | e0 | e0 | e0 |
memory density | 1048576 bit | 1048576 bit | 1048576 bit |
Memory IC Type | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
memory width | 16 | 16 | 16 |
Number of functions | 1 | 1 | 1 |
Number of terminals | 44 | 48 | 44 |
word count | 65536 words | 65536 words | 65536 words |
character code | 64000 | 64000 | 64000 |
Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
Maximum operating temperature | 70 °C | 70 °C | 85 °C |
organize | 64KX16 | 64KX16 | 64KX16 |
Output characteristics | 3-STATE | 3-STATE | 3-STATE |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | SOP | BGA | SOP |
Encapsulate equivalent code | TSOP44,.46,32 | BGA48,6X8,30 | TSOP44,.46,32 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | SMALL OUTLINE | GRID ARRAY | SMALL OUTLINE |
Parallel/Serial | PARALLEL | PARALLEL | PARALLEL |
Peak Reflow Temperature (Celsius) | 240 | NOT SPECIFIED | 240 |
power supply | 1.8 V | 1.8 V | 1.8 V |
Certification status | Not Qualified | Not Qualified | Not Qualified |
Maximum standby current | 4e-7 A | 4e-7 A | 4e-7 A |
Minimum standby current | 1.2 V | 1.2 V | 1.2 V |
Maximum slew rate | 0.025 mA | 0.025 mA | 0.025 mA |
Maximum supply voltage (Vsup) | 1.95 V | 1.95 V | 1.95 V |
Minimum supply voltage (Vsup) | 1.65 V | 1.65 V | 1.65 V |
Nominal supply voltage (Vsup) | 1.8 V | 1.8 V | 1.8 V |
surface mount | YES | YES | YES |
technology | CMOS | CMOS | CMOS |
Temperature level | COMMERCIAL | COMMERCIAL | INDUSTRIAL |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | GULL WING | BALL | GULL WING |
Terminal pitch | 0.8 mm | 0.75 mm | 0.8 mm |
Terminal location | DUAL | BOTTOM | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
Maker | ALSC [Alliance Semiconductor Corporation] | - | ALSC [Alliance Semiconductor Corporation] |