IC,MICROPROCESSOR SLICE,LS-TTL,QUIP,48PIN,CERAMIC
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | Texas Instruments |
package instruction | QIP, QUIP48A,.6/.8 |
Reach Compliance Code | not_compliant |
JESD-30 code | R-XQIP-P48 |
Number of terminals | 48 |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
Package body material | CERAMIC |
encapsulated code | QIP |
Encapsulate equivalent code | QUIP48A,.6/.8 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
Certification status | Not Qualified |
surface mount | NO |
technology | TTL |
Temperature level | MILITARY |
Terminal form | PIN/PEG |
Terminal pitch | 1.27 mm |
Terminal location | QUAD |
uPs/uCs/peripheral integrated circuit type | BIT-SLICE MICROPROCESSOR |
SN54LS481JQ | SN74LS481JQP4 | SN74LS481JQ4 | SN74LS481JQ | SN74LS481N3 | SN74LS481NP1 | SN74LS481NP3 | SN74LS481N1 | |
---|---|---|---|---|---|---|---|---|
Description | IC,MICROPROCESSOR SLICE,LS-TTL,QUIP,48PIN,CERAMIC | IC,MICROPROCESSOR SLICE,LS-TTL,QUIP,48PIN,CERAMIC | IC,MICROPROCESSOR SLICE,LS-TTL,QUIP,48PIN,CERAMIC | IC,MICROPROCESSOR SLICE,LS-TTL,QUIP,48PIN,CERAMIC | IC,MICROPROCESSOR SLICE,LS-TTL,DIP,48PIN,PLASTIC | IC,MICROPROCESSOR SLICE,LS-TTL,DIP,48PIN,PLASTIC | IC,MICROPROCESSOR SLICE,LS-TTL,DIP,48PIN,PLASTIC | IC,MICROPROCESSOR SLICE,LS-TTL,DIP,48PIN,PLASTIC |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
Maker | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
package instruction | QIP, QUIP48A,.6/.8 | QIP, QUIP48A,.6/.8 | QIP, QUIP48A,.6/.8 | QIP, QUIP48A,.6/.8 | DIP, DIP48,.6 | DIP, DIP48,.6 | DIP, DIP48,.6 | DIP, DIP48,.6 |
Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
JESD-30 code | R-XQIP-P48 | R-XQIP-P48 | R-XQIP-P48 | R-XQIP-P48 | R-PDIP-T48 | R-PDIP-T48 | R-PDIP-T48 | R-PDIP-T48 |
Number of terminals | 48 | 48 | 48 | 48 | 48 | 48 | 48 | 48 |
Maximum operating temperature | 125 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
Package body material | CERAMIC | CERAMIC | CERAMIC | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | QIP | QIP | QIP | QIP | DIP | DIP | DIP | DIP |
Encapsulate equivalent code | QUIP48A,.6/.8 | QUIP48A,.6/.8 | QUIP48A,.6/.8 | QUIP48A,.6/.8 | DIP48,.6 | DIP48,.6 | DIP48,.6 | DIP48,.6 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
surface mount | NO | NO | NO | NO | NO | NO | NO | NO |
technology | TTL | TTL | TTL | TTL | TTL | TTL | TTL | TTL |
Temperature level | MILITARY | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
Terminal form | PIN/PEG | PIN/PEG | PIN/PEG | PIN/PEG | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
Terminal location | QUAD | QUAD | QUAD | QUAD | DUAL | DUAL | DUAL | DUAL |
uPs/uCs/peripheral integrated circuit type | BIT-SLICE MICROPROCESSOR | BIT-SLICE MICROPROCESSOR | BIT-SLICE MICROPROCESSOR | BIT-SLICE MICROPROCESSOR | BIT-SLICE MICROPROCESSOR | BIT-SLICE MICROPROCESSOR | BIT-SLICE MICROPROCESSOR | BIT-SLICE MICROPROCESSOR |
Base Number Matches | - | 1 | 1 | 1 | 1 | 1 | 1 | 1 |