7485DCQR datasheet, PDF - EEWORLD Datasheet

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7485DCQR: DescriptionMagnitude Comparator, TTL, CDIP16; Categorylogic logic; File Size258KB，6 Pages; ManufacturerFairchild; Websitehttp://www.fairchildsemi.com/

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7485DCQR Overview

Magnitude Comparator, TTL, CDIP16

7485DCQR Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Fairchild
package instruction	DIP, DIP16,.3
Reach Compliance Code	unknown
JESD-30 code	R-XDIP-T16
JESD-609 code	e0
Logic integrated circuit type	MAGNITUDE COMPARATOR
Number of terminals	16
Maximum operating temperature	70 °C
Minimum operating temperature
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP16,.3
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	TTL
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL

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Description	Magnitude Comparator, TTL, CDIP16	Magnitude Comparator, TTL, CDFP16,	Magnitude Comparator, TTL, CDFP16	Magnitude Comparator, TTL, CDIP16,	Magnitude Comparator, TTL, PDIP16,	Magnitude Comparator, TTL, PDIP16	Magnitude Comparator, TTL, PDIP16	Magnitude Comparator, TTL, CDFP16,
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
package instruction	DIP, DIP16,.3	DFP, FL16,.3	DFP, FL16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DFP, FL16,.3
Reach Compliance Code	unknown	compliant	unknown	compliant	unknown	unknown	unknown	unknown
JESD-30 code	R-XDIP-T16	R-XDFP-F16	R-XDFP-F16	R-XDIP-T16	R-PDIP-T16	R-PDIP-T16	R-PDIP-T16	R-XDFP-F16
JESD-609 code	e0	e0	e0	e0	e0	e0	e0	e0
Logic integrated circuit type	MAGNITUDE COMPARATOR	MAGNITUDE COMPARATOR	MAGNITUDE COMPARATOR	MAGNITUDE COMPARATOR	MAGNITUDE COMPARATOR	MAGNITUDE COMPARATOR	MAGNITUDE COMPARATOR	MAGNITUDE COMPARATOR
Number of terminals	16	16	16	16	16	16	16	16
Maximum operating temperature	70 °C	125 °C	70 °C	125 °C	70 °C	70 °C	70 °C	125 °C
Package body material	CERAMIC	CERAMIC	CERAMIC	CERAMIC	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC
encapsulated code	DIP	DFP	DFP	DIP	DIP	DIP	DIP	DFP
Encapsulate equivalent code	DIP16,.3	FL16,.3	FL16,.3	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3	FL16,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	FLATPACK	FLATPACK	IN-LINE	IN-LINE	IN-LINE	IN-LINE	FLATPACK
power supply	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	YES	YES	NO	NO	NO	NO	YES
technology	TTL	TTL	TTL	TTL	TTL	TTL	TTL	TTL
Temperature level	COMMERCIAL	MILITARY	COMMERCIAL	MILITARY	COMMERCIAL	COMMERCIAL	COMMERCIAL	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	FLAT	FLAT	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	FLAT
Terminal pitch	2.54 mm	1.27 mm	1.27 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Certification status	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	-	Not Qualified
Base Number Matches	-	1	1	1	1	1	1	-

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