RN2113ACT datasheet, PDF - EEWORLD Datasheet

RN2113ACT: DescriptionSwitching Applications Inverter Circuit Applications Interface Circuit Applications Driver Circuit Applications; CategoryDiscrete semiconductor The transistor; File Size149KB，6 Pages; ManufacturerToshiba Semiconductor; Websitehttp://toshiba-semicon-storage.com/

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RN2113ACT Overview

Switching Applications Inverter Circuit Applications Interface Circuit Applications Driver Circuit Applications

Parameter Name	Attribute value
Maker	Toshiba Semiconductor
package instruction	CHIP CARRIER, R-XBCC-N3
Contacts	3
Reach Compliance Code	unknow
ECCN code	EAR99
Other features	BUILT-IN BIAS RESISTOR
Shell connection	COLLECTOR
Maximum collector current (IC)	0.08 A
Collector-emitter maximum voltage	50 V
Configuration	SINGLE WITH BUILT-IN RESISTOR
Minimum DC current gain (hFE)	120
JESD-30 code	R-XBCC-N3
Number of components	1
Number of terminals	3
Package body material	UNSPECIFIED
Package shape	RECTANGULAR
Package form	CHIP CARRIER
Polarity/channel type	PNP
Certification status	Not Qualified
surface mount	YES
Terminal form	NO LEAD
Terminal location	BOTTOM
transistor applications	SWITCHING
Transistor component materials	SILICON

	RN2113ACT	RN2112ACT
Description	Switching Applications Inverter Circuit Applications Interface Circuit Applications Driver Circuit Applications	Switching Applications Inverter Circuit Applications Interface Circuit Applications Driver Circuit Applications
Maker	Toshiba Semiconductor	Toshiba Semiconductor
package instruction	CHIP CARRIER, R-XBCC-N3	CHIP CARRIER, R-XBCC-N3
Contacts	3	3
Reach Compliance Code	unknow	unknow
ECCN code	EAR99	EAR99
Other features	BUILT-IN BIAS RESISTOR	BUILT-IN BIAS RESISTOR
Shell connection	COLLECTOR	COLLECTOR
Maximum collector current (IC)	0.08 A	0.08 A
Collector-emitter maximum voltage	50 V	50 V
Configuration	SINGLE WITH BUILT-IN RESISTOR	SINGLE WITH BUILT-IN RESISTOR
Minimum DC current gain (hFE)	120	120
JESD-30 code	R-XBCC-N3	R-XBCC-N3
Number of components	1	1
Number of terminals	3	3
Package body material	UNSPECIFIED	UNSPECIFIED
Package shape	RECTANGULAR	RECTANGULAR
Package form	CHIP CARRIER	CHIP CARRIER
Polarity/channel type	PNP	PNP
Certification status	Not Qualified	Not Qualified
surface mount	YES	YES
Terminal form	NO LEAD	NO LEAD
Terminal location	BOTTOM	BOTTOM
transistor applications	SWITCHING	SWITCHING
Transistor component materials	SILICON	SILICON

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