K8P2815UQB-DI4D0 datasheet, PDF

K8P2815UQB-DI4D0: DescriptionFlash, 8MX16, 70ns, PBGA64, 13 X 11 MM, 1 MM PITCH, FBGA-80/64; Categorystorage storage; File Size1MB，56 Pages; ManufacturerSAMSUNG; Websitehttp://www.samsung.com/Products/Semiconductor/; Environmental Compliance

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K8P2815UQB-DI4D0 Overview

Flash, 8MX16, 70ns, PBGA64, 13 X 11 MM, 1 MM PITCH, FBGA-80/64

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	SAMSUNG
Parts packaging code	BGA
package instruction	13 X 11 MM, 1 MM PITCH, FBGA-80/64
Contacts	64
Reach Compliance Code	unknown
ECCN code	3A991.B.1.A
Maximum access time	70 ns
startup block	BOTTOM/TOP
command user interface	YES
Universal Flash Interface	YES
Data polling	YES
JESD-30 code	R-PBGA-B64
length	13 mm
memory density	134217728 bit
Memory IC Type	FLASH
memory width	16
Number of functions	1
Number of departments/size	16,254
Number of terminals	64
word count	8388608 words
character code	8000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	8MX16
Package body material	PLASTIC/EPOXY
encapsulated code	TBGA
Encapsulate equivalent code	BGA80,8X12,32
Package shape	RECTANGULAR
Package form	GRID ARRAY, THIN PROFILE
page size	8 words
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	3/3.3 V
Programming voltage	2.7 V
Certification status	Not Qualified
ready/busy	YES
Maximum seat height	1.2 mm
Department size	4K,32K
Maximum standby current	0.00003 A
Maximum slew rate	0.055 mA
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	2.7 V
Nominal supply voltage (Vsup)	3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	BALL
Terminal pitch	1 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
switch bit	YES
type	NOR TYPE
width	11 mm

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