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IDT70T3339S200BF

Description
Dual-Port SRAM, 512KX18, 10ns, PBGA208, 15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, FINE PITCH, BGA-208
Categorystorage    storage   
File Size472KB,28 Pages
ManufacturerIDT (Integrated Device Technology)
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IDT70T3339S200BF Overview

Dual-Port SRAM, 512KX18, 10ns, PBGA208, 15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, FINE PITCH, BGA-208

IDT70T3339S200BF Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerIDT (Integrated Device Technology)
Parts packaging codeBGA
package instructionTFBGA,
Contacts208
Reach Compliance Codecompliant
ECCN code3A991.B.2.A
Maximum access time10 ns
Other featuresFLOW-THROUGH OR PIPELINED ARCHITECTURE
JESD-30 codeS-PBGA-B208
JESD-609 codee0
length15 mm
memory density9437184 bit
Memory IC TypeDUAL-PORT SRAM
memory width18
Humidity sensitivity level3
Number of functions1
Number of terminals208
word count524288 words
character code512000
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize512KX18
Package body materialPLASTIC/EPOXY
encapsulated codeTFBGA
Package shapeSQUARE
Package formGRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)225
Certification statusNot Qualified
Maximum seat height1.2 mm
Maximum supply voltage (Vsup)2.6 V
Minimum supply voltage (Vsup)2.4 V
Nominal supply voltage (Vsup)2.5 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formBALL
Terminal pitch0.8 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature20
width15 mm

IDT70T3339S200BF Related Products

IDT70T3339S200BF IDT70T3339S166DDI IDT70T3339S166BFI IDT70T3399S166BFI IDT70T3319S166BFI IDT70T3319S200DD IDT70T3339S200DD IDT70T3399S200DD IDT70T3319S200BF IDT70T3399S200BF
Description Dual-Port SRAM, 512KX18, 10ns, PBGA208, 15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, FINE PITCH, BGA-208 Dual-Port SRAM, 512KX18, 12ns, CMOS, PQFP144, 20 X 20 MM, 1.40 MM HEIGHT, TQFP-144 Dual-Port SRAM, 512KX18, 12ns, PBGA208, 15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, FINE PITCH, BGA-208 Dual-Port SRAM, 128KX18, 12ns, PBGA208, 15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, FINE PITCH, BGA-208 Dual-Port SRAM, 256KX18, 12ns, PBGA208, 15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, FINE PITCH, BGA-208 Dual-Port SRAM, 256KX18, 10ns, PQFP144, 20 X 20 MM, 1.40 MM HEIGHT, TQFP-144 Dual-Port SRAM, 512KX18, 10ns, PQFP144, 20 X 20 MM, 1.40 MM HEIGHT, TQFP-144 Dual-Port SRAM, 128KX18, 10ns, PQFP144, 20 X 20 MM, 1.40 MM HEIGHT, TQFP-144 Dual-Port SRAM, 256KX18, 10ns, PBGA208, 15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, FINE PITCH, BGA-208 Dual-Port SRAM, 128KX18, 10ns, PBGA208, 15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, FINE PITCH, BGA-208
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible
Parts packaging code BGA QFP BGA BGA BGA QFP QFP QFP BGA BGA
package instruction TFBGA, 20 X 20 MM, 1.40 MM HEIGHT, TQFP-144 TFBGA, TFBGA, TFBGA, 20 X 20 MM, 1.40 MM HEIGHT, TQFP-144 20 X 20 MM, 1.40 MM HEIGHT, TQFP-144 20 X 20 MM, 1.40 MM HEIGHT, TQFP-144 TFBGA, TFBGA,
Contacts 208 144 208 208 208 144 144 144 208 208
Reach Compliance Code compliant not_compliant compliant compliant compliant compliant compliant compliant compliant compliant
ECCN code 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A
Maximum access time 10 ns 12 ns 12 ns 12 ns 12 ns 10 ns 10 ns 10 ns 10 ns 10 ns
Other features FLOW-THROUGH OR PIPELINED ARCHITECTURE FLOW-THROUGH OR PIPELINED ARCHITECTURE FLOW-THROUGH OR PIPELINED ARCHITECTURE FLOW-THROUGH OR PIPELINED ARCHITECTURE FLOW-THROUGH OR PIPELINED ARCHITECTURE FLOW-THROUGH OR PIPELINED ARCHITECTURE FLOW-THROUGH OR PIPELINED ARCHITECTURE FLOW-THROUGH OR PIPELINED ARCHITECTURE FLOW-THROUGH OR PIPELINED ARCHITECTURE FLOW-THROUGH OR PIPELINED ARCHITECTURE
JESD-30 code S-PBGA-B208 S-PQFP-G144 S-PBGA-B208 S-PBGA-B208 S-PBGA-B208 S-PQFP-G144 S-PQFP-G144 S-PQFP-G144 S-PBGA-B208 S-PBGA-B208
JESD-609 code e0 e0 e0 e0 e0 e0 e0 e0 e0 e0
length 15 mm 20 mm 15 mm 15 mm 15 mm 20 mm 20 mm 20 mm 15 mm 15 mm
memory density 9437184 bit 9437184 bit 9437184 bit 2359296 bit 4718592 bit 4718592 bit 9437184 bit 2359296 bit 4718592 bit 2359296 bit
Memory IC Type DUAL-PORT SRAM DUAL-PORT SRAM DUAL-PORT SRAM DUAL-PORT SRAM DUAL-PORT SRAM DUAL-PORT SRAM DUAL-PORT SRAM DUAL-PORT SRAM DUAL-PORT SRAM DUAL-PORT SRAM
memory width 18 18 18 18 18 18 18 18 18 18
Number of functions 1 1 1 1 1 1 1 1 1 1
Number of terminals 208 144 208 208 208 144 144 144 208 208
word count 524288 words 524288 words 524288 words 131072 words 262144 words 262144 words 524288 words 131072 words 262144 words 131072 words
character code 512000 512000 512000 128000 256000 256000 512000 128000 256000 128000
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 70 °C 85 °C 85 °C 85 °C 85 °C 70 °C 70 °C 70 °C 70 °C 70 °C
organize 512KX18 512KX18 512KX18 128KX18 256KX18 256KX18 512KX18 128KX18 256KX18 128KX18
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TFBGA LFQFP TFBGA TFBGA TFBGA LFQFP LFQFP LFQFP TFBGA TFBGA
Package shape SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
Package form GRID ARRAY, THIN PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) 225 225 225 225 225 225 225 225 225 225
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 1.2 mm 1.6 mm 1.2 mm 1.2 mm 1.2 mm 1.6 mm 1.6 mm 1.6 mm 1.2 mm 1.2 mm
Maximum supply voltage (Vsup) 2.6 V 2.6 V 2.6 V 2.6 V 2.6 V 2.6 V 2.6 V 2.6 V 2.6 V 2.6 V
Minimum supply voltage (Vsup) 2.4 V 2.4 V 2.4 V 2.4 V 2.4 V 2.4 V 2.4 V 2.4 V 2.4 V 2.4 V
Nominal supply voltage (Vsup) 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V
surface mount YES YES YES YES YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn85Pb15) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form BALL GULL WING BALL BALL BALL GULL WING GULL WING GULL WING BALL BALL
Terminal pitch 0.8 mm 0.5 mm 0.8 mm 0.8 mm 0.8 mm 0.5 mm 0.5 mm 0.5 mm 0.8 mm 0.8 mm
Terminal location BOTTOM QUAD BOTTOM BOTTOM BOTTOM QUAD QUAD QUAD BOTTOM BOTTOM
Maximum time at peak reflow temperature 20 30 20 20 20 20 20 20 20 20
width 15 mm 20 mm 15 mm 15 mm 15 mm 20 mm 20 mm 20 mm 15 mm 15 mm
Is it lead-free? Contains lead - Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead
Maker IDT (Integrated Device Technology) - IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
Humidity sensitivity level 3 4 3 3 3 - - - 3 3
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