IDT70T3319S166BFI datasheet, PDF

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IDT70T3319S166BFI: DescriptionDual-Port SRAM, 256KX18, 12ns, PBGA208, 15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, FINE PITCH, BGA-208; Categorystorage storage; File Size472KB，28 Pages; ManufacturerIDT (Integrated Device Technology)

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IDT70T3319S166BFI Overview

Dual-Port SRAM, 256KX18, 12ns, PBGA208, 15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, FINE PITCH, BGA-208

IDT70T3319S166BFI Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	IDT (Integrated Device Technology)
Parts packaging code	BGA
package instruction	TFBGA,
Contacts	208
Reach Compliance Code	compliant
ECCN code	3A991.B.2.A
Maximum access time	12 ns
Other features	FLOW-THROUGH OR PIPELINED ARCHITECTURE
JESD-30 code	S-PBGA-B208
JESD-609 code	e0
length	15 mm
memory density	4718592 bit
Memory IC Type	DUAL-PORT SRAM
memory width	18
Humidity sensitivity level	3
Number of functions	1
Number of terminals	208
word count	262144 words
character code	256000
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	256KX18
Package body material	PLASTIC/EPOXY
encapsulated code	TFBGA
Package shape	SQUARE
Package form	GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	225
Certification status	Not Qualified
Maximum seat height	1.2 mm
Maximum supply voltage (Vsup)	2.6 V
Minimum supply voltage (Vsup)	2.4 V
Nominal supply voltage (Vsup)	2.5 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	20
width	15 mm

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Description	Dual-Port SRAM, 256KX18, 12ns, PBGA208, 15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, FINE PITCH, BGA-208	Dual-Port SRAM, 512KX18, 12ns, CMOS, PQFP144, 20 X 20 MM, 1.40 MM HEIGHT, TQFP-144	Dual-Port SRAM, 512KX18, 12ns, PBGA208, 15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, FINE PITCH, BGA-208	Dual-Port SRAM, 128KX18, 12ns, PBGA208, 15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, FINE PITCH, BGA-208	Dual-Port SRAM, 256KX18, 10ns, PQFP144, 20 X 20 MM, 1.40 MM HEIGHT, TQFP-144	Dual-Port SRAM, 512KX18, 10ns, PQFP144, 20 X 20 MM, 1.40 MM HEIGHT, TQFP-144	Dual-Port SRAM, 128KX18, 10ns, PQFP144, 20 X 20 MM, 1.40 MM HEIGHT, TQFP-144	Dual-Port SRAM, 512KX18, 10ns, PBGA208, 15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, FINE PITCH, BGA-208	Dual-Port SRAM, 256KX18, 10ns, PBGA208, 15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, FINE PITCH, BGA-208	Dual-Port SRAM, 128KX18, 10ns, PBGA208, 15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, FINE PITCH, BGA-208
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Parts packaging code	BGA	QFP	BGA	BGA	QFP	QFP	QFP	BGA	BGA	BGA
package instruction	TFBGA,	20 X 20 MM, 1.40 MM HEIGHT, TQFP-144	TFBGA,	TFBGA,	20 X 20 MM, 1.40 MM HEIGHT, TQFP-144	20 X 20 MM, 1.40 MM HEIGHT, TQFP-144	20 X 20 MM, 1.40 MM HEIGHT, TQFP-144	TFBGA,	TFBGA,	TFBGA,
Contacts	208	144	208	208	144	144	144	208	208	208
Reach Compliance Code	compliant	not_compliant	compliant	compliant	compliant	compliant	compliant	compliant	compliant	compliant
ECCN code	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A
Maximum access time	12 ns	12 ns	12 ns	12 ns	10 ns	10 ns	10 ns	10 ns	10 ns	10 ns
Other features	FLOW-THROUGH OR PIPELINED ARCHITECTURE	FLOW-THROUGH OR PIPELINED ARCHITECTURE	FLOW-THROUGH OR PIPELINED ARCHITECTURE	FLOW-THROUGH OR PIPELINED ARCHITECTURE	FLOW-THROUGH OR PIPELINED ARCHITECTURE	FLOW-THROUGH OR PIPELINED ARCHITECTURE	FLOW-THROUGH OR PIPELINED ARCHITECTURE	FLOW-THROUGH OR PIPELINED ARCHITECTURE	FLOW-THROUGH OR PIPELINED ARCHITECTURE	FLOW-THROUGH OR PIPELINED ARCHITECTURE
JESD-30 code	S-PBGA-B208	S-PQFP-G144	S-PBGA-B208	S-PBGA-B208	S-PQFP-G144	S-PQFP-G144	S-PQFP-G144	S-PBGA-B208	S-PBGA-B208	S-PBGA-B208
JESD-609 code	e0	e0	e0	e0	e0	e0	e0	e0	e0	e0
length	15 mm	20 mm	15 mm	15 mm	20 mm	20 mm	20 mm	15 mm	15 mm	15 mm
memory density	4718592 bit	9437184 bit	9437184 bit	2359296 bit	4718592 bit	9437184 bit	2359296 bit	9437184 bit	4718592 bit	2359296 bit
Memory IC Type	DUAL-PORT SRAM	DUAL-PORT SRAM	DUAL-PORT SRAM	DUAL-PORT SRAM	DUAL-PORT SRAM	DUAL-PORT SRAM	DUAL-PORT SRAM	DUAL-PORT SRAM	DUAL-PORT SRAM	DUAL-PORT SRAM
memory width	18	18	18	18	18	18	18	18	18	18
Number of functions	1	1	1	1	1	1	1	1	1	1
Number of terminals	208	144	208	208	144	144	144	208	208	208
word count	262144 words	524288 words	524288 words	131072 words	262144 words	524288 words	131072 words	524288 words	262144 words	131072 words
character code	256000	512000	512000	128000	256000	512000	128000	512000	256000	128000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
organize	256KX18	512KX18	512KX18	128KX18	256KX18	512KX18	128KX18	512KX18	256KX18	128KX18
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	TFBGA	LFQFP	TFBGA	TFBGA	LFQFP	LFQFP	LFQFP	TFBGA	TFBGA	TFBGA
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package form	GRID ARRAY, THIN PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	225	225	225	225	225	225	225	225	225	225
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1.2 mm	1.6 mm	1.2 mm	1.2 mm	1.6 mm	1.6 mm	1.6 mm	1.2 mm	1.2 mm	1.2 mm
Maximum supply voltage (Vsup)	2.6 V	2.6 V	2.6 V	2.6 V	2.6 V	2.6 V	2.6 V	2.6 V	2.6 V	2.6 V
Minimum supply voltage (Vsup)	2.4 V	2.4 V	2.4 V	2.4 V	2.4 V	2.4 V	2.4 V	2.4 V	2.4 V	2.4 V
Nominal supply voltage (Vsup)	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V
surface mount	YES	YES	YES	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn85Pb15)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	BALL	GULL WING	BALL	BALL	GULL WING	GULL WING	GULL WING	BALL	BALL	BALL
Terminal pitch	0.8 mm	0.5 mm	0.8 mm	0.8 mm	0.5 mm	0.5 mm	0.5 mm	0.8 mm	0.8 mm	0.8 mm
Terminal location	BOTTOM	QUAD	BOTTOM	BOTTOM	QUAD	QUAD	QUAD	BOTTOM	BOTTOM	BOTTOM
Maximum time at peak reflow temperature	20	30	20	20	20	20	20	20	20	20
width	15 mm	20 mm	15 mm	15 mm	20 mm	20 mm	20 mm	15 mm	15 mm	15 mm
Is it lead-free?	Contains lead	-	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead
Maker	IDT (Integrated Device Technology)	-	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)
Humidity sensitivity level	3	4	3	3	-	-	-	3	3	3

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