HY234100G-200 datasheet, PDF - EEWORLD Datasheet

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HY234100G-200: DescriptionMASK ROM, 512KX8, 200ns, CMOS, PDSO40, 0.525 INCH, PLASTIC, SOP-40; Categorystorage storage; File Size114KB，7 Pages; ManufacturerSK Hynix; Websitehttp://www.hynix.com/eng/

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HY234100G-200 Overview

MASK ROM, 512KX8, 200ns, CMOS, PDSO40, 0.525 INCH, PLASTIC, SOP-40

HY234100G-200 Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	SK Hynix
Parts packaging code	SOIC
package instruction	SOP, SOP40,.56
Contacts	40
Reach Compliance Code	compliant
ECCN code	EAR99
Maximum access time	200 ns
Spare memory width	16
JESD-30 code	R-PDSO-G40
JESD-609 code	e0
length	18.517 mm
memory density	4194304 bit
Memory IC Type	MASK ROM
memory width	8
Number of functions	1
Number of terminals	40
word count	524288 words
character code	512000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	512KX8
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	SOP
Encapsulate equivalent code	SOP40,.56
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Certification status	Not Qualified
Maximum standby current	0.00005 A
Maximum slew rate	0.04 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	GULL WING
Terminal pitch	1.27 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	11.24 mm

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HY234100G-200 Related Products

	HY234100G-200	HY234100P-150	HY234100P-200	HY234100G-150
Description	MASK ROM, 512KX8, 200ns, CMOS, PDSO40, 0.525 INCH, PLASTIC, SOP-40	MASK ROM, 512KX8, 150ns, CMOS, PDIP40, 0.600 INCH, PLASITIC, DIP-40	MASK ROM, 512KX8, 200ns, CMOS, PDIP40, 0.600 INCH, PLASITIC, DIP-40	MASK ROM, 512KX8, 150ns, CMOS, PDSO40, 0.525 INCH, PLASTIC, SOP-40
Is it lead-free?	Contains lead	Contains lead	Contains lead	Contains lead
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible
Parts packaging code	SOIC	DIP	DIP	SOIC
package instruction	SOP, SOP40,.56	DIP, DIP40,.6	DIP, DIP40,.6	SOP, SOP40,.56
Contacts	40	40	40	40
Reach Compliance Code	compliant	compliant	compliant	compliant
ECCN code	EAR99	EAR99	EAR99	EAR99
Maximum access time	200 ns	150 ns	200 ns	150 ns
Spare memory width	16	16	16	16
JESD-30 code	R-PDSO-G40	R-PDIP-T40	R-PDIP-T40	R-PDSO-G40
JESD-609 code	e0	e0	e0	e0
length	18.517 mm	52.451 mm	52.451 mm	18.517 mm
memory density	4194304 bit	4194304 bit	4194304 bit	4194304 bit
Memory IC Type	MASK ROM	MASK ROM	MASK ROM	MASK ROM
memory width	8	8	8	8
Number of functions	1	1	1	1
Number of terminals	40	40	40	40
word count	524288 words	524288 words	524288 words	524288 words
character code	512000	512000	512000	512000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C
organize	512KX8	512KX8	512KX8	512KX8
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	SOP	DIP	DIP	SOP
Encapsulate equivalent code	SOP40,.56	DIP40,.6	DIP40,.6	SOP40,.56
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE	IN-LINE	IN-LINE	SMALL OUTLINE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum standby current	0.00005 A	0.00005 A	0.00005 A	0.00005 A
Maximum slew rate	0.04 mA	0.04 mA	0.04 mA	0.04 mA
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V
surface mount	YES	NO	NO	YES
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	GULL WING	THROUGH-HOLE	THROUGH-HOLE	GULL WING
Terminal pitch	1.27 mm	2.54 mm	2.54 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	11.24 mm	15.24 mm	15.24 mm	11.24 mm

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