K4D263238I-GC500 datasheet, PDF

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K4D263238I-GC500: DescriptionDDR DRAM, 4MX32, 0.7ns, CMOS, PBGA144, FBGA-144; Categorystorage storage; File Size374KB，16 Pages; ManufacturerSAMSUNG; Websitehttp://www.samsung.com/Products/Semiconductor/

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K4D263238I-GC500 Overview

DDR DRAM, 4MX32, 0.7ns, CMOS, PBGA144, FBGA-144

K4D263238I-GC500 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	SAMSUNG
Parts packaging code	BGA
package instruction	LFBGA,
Contacts	144
Reach Compliance Code	compliant
ECCN code	EAR99
access mode	FOUR BANK PAGE BURST
Maximum access time	0.7 ns
Other features	AUTO/SELF REFRESH
JESD-30 code	S-PBGA-B144
JESD-609 code	e0
length	12 mm
memory density	134217728 bit
Memory IC Type	DDR DRAM
memory width	32
Number of functions	1
Number of ports	1
Number of terminals	144
word count	4194304 words
character code	4000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	65 °C
Minimum operating temperature
organize	4MX32
Package body material	PLASTIC/EPOXY
encapsulated code	LFBGA
Package shape	SQUARE
Package form	GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	230
Certification status	Not Qualified
Maximum seat height	1.4 mm
self refresh	YES
Maximum supply voltage (Vsup)	2.625 V
Minimum supply voltage (Vsup)	2.375 V
Nominal supply voltage (Vsup)	2.5 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	30
width	12 mm

K4D263238I-GC500 Related Products

	K4D263238I-GC500	K4D263238I-GC400	K4D263238I-GC50T
Description	DDR DRAM, 4MX32, 0.7ns, CMOS, PBGA144, FBGA-144	DDR DRAM, 4MX32, 0.6ns, CMOS, PBGA144, FBGA-144	DDR DRAM, 4MX32, 0.7ns, CMOS, PBGA144, FBGA-144
Maker	SAMSUNG	SAMSUNG	SAMSUNG
Parts packaging code	BGA	BGA	BGA
package instruction	LFBGA,	LFBGA,	LFBGA,
Contacts	144	144	144
Reach Compliance Code	compliant	compliant	unknown
ECCN code	EAR99	EAR99	EAR99
access mode	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST
Maximum access time	0.7 ns	0.6 ns	0.7 ns
Other features	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH
JESD-30 code	S-PBGA-B144	S-PBGA-B144	S-PBGA-B144
length	12 mm	12 mm	12 mm
memory density	134217728 bit	134217728 bit	134217728 bit
Memory IC Type	DDR DRAM	DDR DRAM	DDR DRAM
memory width	32	32	32
Number of functions	1	1	1
Number of ports	1	1	1
Number of terminals	144	144	144
word count	4194304 words	4194304 words	4194304 words
character code	4000000	4000000	4000000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	65 °C	65 °C	65 °C
organize	4MX32	4MX32	4MX32
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	LFBGA	LFBGA	LFBGA
Package shape	SQUARE	SQUARE	SQUARE
Package form	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH
Certification status	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1.4 mm	1.4 mm	1.4 mm
self refresh	YES	YES	YES
Maximum supply voltage (Vsup)	2.625 V	2.625 V	2.625 V
Minimum supply voltage (Vsup)	2.375 V	2.375 V	2.375 V
Nominal supply voltage (Vsup)	2.5 V	2.5 V	2.5 V
surface mount	YES	YES	YES
technology	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal form	BALL	BALL	BALL
Terminal pitch	0.8 mm	0.8 mm	0.8 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM
width	12 mm	12 mm	12 mm
Is it Rohs certified?	incompatible	incompatible	-
JESD-609 code	e0	e0	-
Peak Reflow Temperature (Celsius)	230	230	-
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	-
Maximum time at peak reflow temperature	30	30	-
Base Number Matches	-	1	1

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