F-217
GMI–30–2–1.27–G–10
GMI–10–2–1.27–G–10
(1.00 mm) .0394"
GMI SERIES
LOW PROFILE ONE-PIECE ARRAY
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?GMI
Insulator Material:
Black LCP
Contact Material:
Copper Alloy
Plating:
Au over 50 µ" (1.27 µm) Ni
Operating Temp Range:
Testing Now!
Current Rating:
Testing Now!
RoHS Compliant:
Yes
Up to
400 pins
Dual compression
or single compression
with solder balls
APPLICATION
(1.27 mm) .050"
with style –2 or
(2.00 mm) .079"
with style –1
PROCESSING
Lead-Free Solderable:
Yes
SMT Lead Coplanarity:
(0.05 mm) .002" (10-20)
(0.08 mm) .003" (30)
HIGH-SPEED CHANNEL PERFORMANCE
GMI @ 1.27 mm Stack Height
Rating based on Samtec reference channel.
For full SI performance data visit Samtec.com
or contact SIG@samtec.com
RECOGNITIONS
For complete scope of
recognitions see
www.samtec.com/quality
FILE NO. E111594
45
G b p s
GMI
POSITIONS
PER ROW
STYLE
BOARD
SPACING
PLATING
ROWS
SOLDER
TYPE
(Style –1 only)
OTHER
OPTION
(Style –1 only)
APPLICATION
–10, –20,
–30, –40
= Single
Compression
with Solder
Ball
–1
= (1.27 mm)
.050"
Board space
(Style –2 only)
–1.27
= 10 µ"
(0.25 µm)
Gold in
contact area
–G
–10
= Ten
Rows
= Dual
Compression
–2
= (2.00 mm)
.079"
Board space
(Style –1 only)
(0.90)
.035
DIA
–2.00
= Lead-Free
96.5% Sn/
3% Ag/.5% Cu
–2
= Pick &
Place Pad
–P
Dual compression or single
compression with solder balls
(No. of positions x (1.00) .03937)
+ (6.80) .268
10
01
(12.00)
.472
(9.00)
.354
(1.10)
.043
DIA
(1.10)
.043
DIA
(1.00)
.03937
(1.00)
.03937
(1.27)
.050
(1.42)
.056
(0.30)
.012
TYP
BOTH
SIDES
(No. of positions x
(1.00) .03937) +
(4.00) .157
(2.00)
.079
Note:
Some lengths,
styles and options are
non-standard, non-returnable.
10 X 10
DUAL COMPRESSION
(STYLE –2)
20 X 10
SINGLE COMPRESSION WITH SOLDER BALLS
(STYLE –1)
WWW.SAMTEC.COM
Due to technical progress, all designs, specifications and components are subject to change without notice.
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