RECTIFIER DIODE,600V V(RRM),SIP
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | NXP |
package instruction | R-PSFM-T2 |
Reach Compliance Code | unknown |
Configuration | SINGLE |
Diode type | RECTIFIER DIODE |
Maximum forward voltage (VF) | 1.3 V |
JESD-609 code | e0 |
Number of components | 1 |
Maximum operating temperature | 150 °C |
Maximum output current | 24 A |
Maximum repetitive peak reverse voltage | 600 V |
Maximum reverse recovery time | 0.2 µs |
surface mount | NO |
Terminal surface | Tin/Lead (Sn/Pb) |
MR2406F | MR2400FR | MR2404FR | MR2402F | MR2401F | MR2400F | MR2406FR | |
---|---|---|---|---|---|---|---|
Description | RECTIFIER DIODE,600V V(RRM),SIP | RECTIFIER DIODE,SCHOTTKY,50V V(RRM),SIP | RECTIFIER DIODE,400V V(RRM),SIP | RECTIFIER DIODE,SCHOTTKY,200V V(RRM),SIP | RECTIFIER DIODE,SCHOTTKY,100V V(RRM),SIP | RECTIFIER DIODE,SCHOTTKY,50V V(RRM),SIP | RECTIFIER DIODE,600V V(RRM),SIP |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
package instruction | R-PSFM-T2 | R-PSFM-T2 | R-PSFM-T2 | R-PSFM-T2 | R-PSFM-T2 | R-PSFM-T2 | R-PSFM-T2 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
Configuration | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE |
Diode type | RECTIFIER DIODE | RECTIFIER DIODE | RECTIFIER DIODE | RECTIFIER DIODE | RECTIFIER DIODE | RECTIFIER DIODE | RECTIFIER DIODE |
Maximum forward voltage (VF) | 1.3 V | 1.3 V | 1.3 V | 1.3 V | 1.3 V | 1.3 V | 1.3 V |
JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
Number of components | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
Maximum operating temperature | 150 °C | 150 °C | 150 °C | 150 °C | 150 °C | 150 °C | 150 °C |
Maximum output current | 24 A | 24 A | 24 A | 24 A | 24 A | 24 A | 24 A |
Maximum repetitive peak reverse voltage | 600 V | 50 V | 400 V | 200 V | 100 V | 50 V | 600 V |
Maximum reverse recovery time | 0.2 µs | 0.3 µs | 0.2 µs | 0.3 µs | 0.3 µs | 0.3 µs | 0.2 µs |
surface mount | NO | NO | NO | NO | NO | NO | NO |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Maker | NXP | - | NXP | NXP | NXP | NXP | NXP |
application | - | FAST RECOVERY POWER | FAST RECOVERY POWER | FAST RECOVERY POWER | FAST RECOVERY POWER | FAST RECOVERY POWER | FAST RECOVERY POWER |
Shell connection | - | ANODE | ANODE | CATHODE | CATHODE | CATHODE | ANODE |
Diode component materials | - | SILICON | SILICON | SILICON | SILICON | SILICON | SILICON |
JESD-30 code | - | R-PSFM-T2 | R-PSFM-T2 | R-PSFM-T2 | R-PSFM-T2 | R-PSFM-T2 | R-PSFM-T2 |
Maximum non-repetitive peak forward current | - | 300 A | 300 A | 300 A | 300 A | 300 A | 300 A |
Phase | - | 1 | 1 | 1 | 1 | 1 | 1 |
Number of terminals | - | 2 | 2 | 2 | 2 | 2 | 2 |
Minimum operating temperature | - | -65 °C | -65 °C | -65 °C | -65 °C | -65 °C | -65 °C |
Package body material | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
Package shape | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | - | FLANGE MOUNT | FLANGE MOUNT | FLANGE MOUNT | FLANGE MOUNT | FLANGE MOUNT | FLANGE MOUNT |
Peak Reflow Temperature (Celsius) | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
Certification status | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum reverse current | - | 25 µA | 25 µA | 25 µA | 25 µA | 25 µA | 25 µA |
technology | - | SCHOTTKY | - | SCHOTTKY | SCHOTTKY | SCHOTTKY | - |
Terminal form | - | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
Terminal location | - | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE |
Maximum time at peak reflow temperature | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |