S29GL032N90FFIR23 datasheet, PDF

S29GL032N90FFIR23: DescriptionFlash, 2MX16, 90ns, PBGA64, 13 X 11 MM, LEAD FREE, FBGA-64; Categorystorage storage; File Size3MB，77 Pages; ManufacturerSPANSION; Websitehttp://www.spansion.com/; Environmental Compliance

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S29GL032N90FFIR23 Overview

Flash, 2MX16, 90ns, PBGA64, 13 X 11 MM, LEAD FREE, FBGA-64

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	SPANSION
Parts packaging code	BGA
package instruction	13 X 11 MM, LEAD FREE, FBGA-64
Contacts	64
Reach Compliance Code	unknown
ECCN code	3A991.B.1.A
Maximum access time	90 ns
Spare memory width	8
command user interface	YES
Universal Flash Interface	YES
Data polling	YES
JESD-30 code	R-PBGA-B64
JESD-609 code	e1
length	13 mm
memory density	33554432 bit
Memory IC Type	FLASH
memory width	16
Humidity sensitivity level	3
Number of functions	1
Number of departments/size	64
Number of terminals	64
word count	2097152 words
character code	2000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	2MX16
Package body material	PLASTIC/EPOXY
encapsulated code	LBGA
Encapsulate equivalent code	BGA64,8X8,40
Package shape	RECTANGULAR
Package form	GRID ARRAY, LOW PROFILE
page size	8/16 words
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	260
power supply	3.3 V
Programming voltage	3 V
Certification status	Not Qualified
ready/busy	YES
Maximum seat height	1.4 mm
Department size	64K
Maximum standby current	0.000005 A
Maximum slew rate	0.06 mA
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	3 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Terminal form	BALL
Terminal pitch	1 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	40
switch bit	YES
type	NOR TYPE
width	11 mm

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