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W671552Y

Description
SLIC, Bipolar, 7 X 7 MM, 0.65 MM PITCH, QFN-32
CategoryWireless rf/communication    Telecom circuit   
File Size1MB,42 Pages
ManufacturerWinbond Electronics Corporation
Websitehttp://www.winbond.com.tw
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W671552Y Overview

SLIC, Bipolar, 7 X 7 MM, 0.65 MM PITCH, QFN-32

W671552Y Parametric

Parameter NameAttribute value
MakerWinbond Electronics Corporation
Parts packaging codeQFN
package instructionHVQCCN,
Contacts32
Reach Compliance Codeunknown
JESD-30 codeS-XQCC-N32
length7 mm
Number of functions1
Number of terminals32
Maximum operating temperature75 °C
Minimum operating temperature
Package body materialUNSPECIFIED
encapsulated codeHVQCCN
Package shapeSQUARE
Package formCHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Certification statusNot Qualified
Maximum seat height0.9 mm
Nominal supply voltage5 V
surface mountYES
technologyBIPOLAR
Telecom integrated circuit typesSLIC
Temperature levelCOMMERCIAL EXTENDED
Terminal formNO LEAD
Terminal pitch0.65 mm
Terminal locationQUAD
width7 mm

W671552Y Related Products

W671552Y W671520P W671540P W671561P W671561Y W671552P W671570P W671571P W671571Y W671530P
Description SLIC, Bipolar, 7 X 7 MM, 0.65 MM PITCH, QFN-32 SLIC, Bipolar, PQCC28, PLASTIC, LCC-28 SLIC, Bipolar, PQCC28, PLASTIC, LCC-28 SLIC, Bipolar, PQCC28, PLASTIC, LCC-28 SLIC, Bipolar, 7 X 7 MM, 0.65 MM PITCH, QFN-32 SLIC, Bipolar, PQCC28, PLASTIC, LCC-28 SLIC, Bipolar, PQCC28, PLASTIC, LCC-28 SLIC, Bipolar, PQCC28, PLASTIC, LCC-28 SLIC, Bipolar, 7 X 7 MM, 0.65 MM PITCH, QFN-32 SLIC, Bipolar, PQCC28, PLASTIC, LCC-28
Parts packaging code QFN QLCC QLCC QLCC QFN QLCC QLCC QLCC QFN QLCC
package instruction HVQCCN, QCCJ, QCCJ, QCCJ, HVQCCN, QCCJ, QCCJ, QCCJ, HVQCCN, QCCJ,
Contacts 32 28 28 28 32 28 28 28 32 28
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknown unknown unknown
JESD-30 code S-XQCC-N32 S-PQCC-J28 S-PQCC-J28 S-PQCC-J28 S-XQCC-N32 S-PQCC-J28 S-PQCC-J28 S-PQCC-J28 S-XQCC-N32 S-PQCC-J28
length 7 mm 11.5062 mm 11.5062 mm 11.5062 mm 7 mm 11.5062 mm 11.5062 mm 11.5062 mm 7 mm 11.5062 mm
Number of functions 1 1 1 1 1 1 1 1 1 1
Number of terminals 32 28 28 28 32 28 28 28 32 28
Maximum operating temperature 75 °C 85 °C 85 °C 85 °C 85 °C 75 °C 85 °C 85 °C 85 °C 85 °C
Package body material UNSPECIFIED PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY UNSPECIFIED PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY UNSPECIFIED PLASTIC/EPOXY
encapsulated code HVQCCN QCCJ QCCJ QCCJ HVQCCN QCCJ QCCJ QCCJ HVQCCN QCCJ
Package shape SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
Package form CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE CHIP CARRIER CHIP CARRIER CHIP CARRIER CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE CHIP CARRIER CHIP CARRIER CHIP CARRIER CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE CHIP CARRIER
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 0.9 mm 4.7 mm 4.7 mm 4.7 mm 0.9 mm 4.7 mm 4.7 mm 4.7 mm 0.9 mm 4.7 mm
Nominal supply voltage 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount YES YES YES YES YES YES YES YES YES YES
technology BIPOLAR BIPOLAR BIPOLAR BIPOLAR BIPOLAR BIPOLAR BIPOLAR BIPOLAR BIPOLAR BIPOLAR
Telecom integrated circuit types SLIC SLIC SLIC SLIC SLIC SLIC SLIC SLIC SLIC SLIC
Temperature level COMMERCIAL EXTENDED INDUSTRIAL INDUSTRIAL OTHER OTHER COMMERCIAL EXTENDED INDUSTRIAL OTHER OTHER INDUSTRIAL
Terminal form NO LEAD J BEND J BEND J BEND NO LEAD J BEND J BEND J BEND NO LEAD J BEND
Terminal pitch 0.65 mm 1.27 mm 1.27 mm 1.27 mm 0.65 mm 1.27 mm 1.27 mm 1.27 mm 0.65 mm 1.27 mm
Terminal location QUAD QUAD QUAD QUAD QUAD QUAD QUAD QUAD QUAD QUAD
width 7 mm 11.5062 mm 11.5062 mm 11.5062 mm 7 mm 11.5062 mm 11.5062 mm 11.5062 mm 7 mm 11.5062 mm
Maker Winbond Electronics Corporation - Winbond Electronics Corporation Winbond Electronics Corporation Winbond Electronics Corporation Winbond Electronics Corporation Winbond Electronics Corporation Winbond Electronics Corporation Winbond Electronics Corporation Winbond Electronics Corporation

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