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W671561P

Description
SLIC, Bipolar, PQCC28, PLASTIC, LCC-28
CategoryWireless rf/communication    Telecom circuit   
File Size1MB,42 Pages
ManufacturerWinbond Electronics Corporation
Websitehttp://www.winbond.com.tw
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W671561P Overview

SLIC, Bipolar, PQCC28, PLASTIC, LCC-28

W671561P Parametric

Parameter NameAttribute value
MakerWinbond Electronics Corporation
Parts packaging codeQLCC
package instructionQCCJ,
Contacts28
Reach Compliance Codeunknown
JESD-30 codeS-PQCC-J28
length11.5062 mm
Number of functions1
Number of terminals28
Maximum operating temperature85 °C
Minimum operating temperature
Package body materialPLASTIC/EPOXY
encapsulated codeQCCJ
Package shapeSQUARE
Package formCHIP CARRIER
Certification statusNot Qualified
Maximum seat height4.7 mm
Nominal supply voltage5 V
surface mountYES
technologyBIPOLAR
Telecom integrated circuit typesSLIC
Temperature levelOTHER
Terminal formJ BEND
Terminal pitch1.27 mm
Terminal locationQUAD
width11.5062 mm

W671561P Related Products

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Description SLIC, Bipolar, PQCC28, PLASTIC, LCC-28 SLIC, Bipolar, PQCC28, PLASTIC, LCC-28 SLIC, Bipolar, PQCC28, PLASTIC, LCC-28 SLIC, Bipolar, 7 X 7 MM, 0.65 MM PITCH, QFN-32 SLIC, Bipolar, PQCC28, PLASTIC, LCC-28 SLIC, Bipolar, 7 X 7 MM, 0.65 MM PITCH, QFN-32 SLIC, Bipolar, PQCC28, PLASTIC, LCC-28 SLIC, Bipolar, PQCC28, PLASTIC, LCC-28 SLIC, Bipolar, 7 X 7 MM, 0.65 MM PITCH, QFN-32 SLIC, Bipolar, PQCC28, PLASTIC, LCC-28
Parts packaging code QLCC QLCC QLCC QFN QLCC QFN QLCC QLCC QFN QLCC
package instruction QCCJ, QCCJ, QCCJ, HVQCCN, QCCJ, HVQCCN, QCCJ, QCCJ, HVQCCN, QCCJ,
Contacts 28 28 28 32 28 32 28 28 32 28
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknown unknown unknown
JESD-30 code S-PQCC-J28 S-PQCC-J28 S-PQCC-J28 S-XQCC-N32 S-PQCC-J28 S-XQCC-N32 S-PQCC-J28 S-PQCC-J28 S-XQCC-N32 S-PQCC-J28
length 11.5062 mm 11.5062 mm 11.5062 mm 7 mm 11.5062 mm 7 mm 11.5062 mm 11.5062 mm 7 mm 11.5062 mm
Number of functions 1 1 1 1 1 1 1 1 1 1
Number of terminals 28 28 28 32 28 32 28 28 32 28
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C 75 °C 75 °C 85 °C 85 °C 85 °C 85 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY UNSPECIFIED PLASTIC/EPOXY UNSPECIFIED PLASTIC/EPOXY PLASTIC/EPOXY UNSPECIFIED PLASTIC/EPOXY
encapsulated code QCCJ QCCJ QCCJ HVQCCN QCCJ HVQCCN QCCJ QCCJ HVQCCN QCCJ
Package shape SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
Package form CHIP CARRIER CHIP CARRIER CHIP CARRIER CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE CHIP CARRIER CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE CHIP CARRIER CHIP CARRIER CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE CHIP CARRIER
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 4.7 mm 4.7 mm 4.7 mm 0.9 mm 4.7 mm 0.9 mm 4.7 mm 4.7 mm 0.9 mm 4.7 mm
Nominal supply voltage 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount YES YES YES YES YES YES YES YES YES YES
technology BIPOLAR BIPOLAR BIPOLAR BIPOLAR BIPOLAR BIPOLAR BIPOLAR BIPOLAR BIPOLAR BIPOLAR
Telecom integrated circuit types SLIC SLIC SLIC SLIC SLIC SLIC SLIC SLIC SLIC SLIC
Temperature level OTHER INDUSTRIAL INDUSTRIAL OTHER COMMERCIAL EXTENDED COMMERCIAL EXTENDED INDUSTRIAL OTHER OTHER INDUSTRIAL
Terminal form J BEND J BEND J BEND NO LEAD J BEND NO LEAD J BEND J BEND NO LEAD J BEND
Terminal pitch 1.27 mm 1.27 mm 1.27 mm 0.65 mm 1.27 mm 0.65 mm 1.27 mm 1.27 mm 0.65 mm 1.27 mm
Terminal location QUAD QUAD QUAD QUAD QUAD QUAD QUAD QUAD QUAD QUAD
width 11.5062 mm 11.5062 mm 11.5062 mm 7 mm 11.5062 mm 7 mm 11.5062 mm 11.5062 mm 7 mm 11.5062 mm
Maker Winbond Electronics Corporation - Winbond Electronics Corporation Winbond Electronics Corporation Winbond Electronics Corporation Winbond Electronics Corporation Winbond Electronics Corporation Winbond Electronics Corporation Winbond Electronics Corporation Winbond Electronics Corporation
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