|
W3013BCL-TR |
W3013BCL |
Description |
RF and Baseband Circuit, PDSO20, TSSOP-20 |
RF and Baseband Circuit, PDSO20, TSSOP-20 |
Maker |
Broadcom |
Broadcom |
package instruction |
TSSOP, |
TSSOP, |
Reach Compliance Code |
compliant |
compliant |
JESD-30 code |
R-PDSO-G20 |
R-PDSO-G20 |
JESD-609 code |
e0 |
e0 |
length |
6.5 mm |
6.5 mm |
Number of functions |
1 |
1 |
Number of terminals |
20 |
20 |
Maximum operating temperature |
85 °C |
85 °C |
Minimum operating temperature |
-35 °C |
-35 °C |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
TSSOP |
TSSOP |
Package shape |
RECTANGULAR |
RECTANGULAR |
Package form |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
Peak Reflow Temperature (Celsius) |
240 |
240 |
Certification status |
Not Qualified |
Not Qualified |
Maximum seat height |
1.1 mm |
1.1 mm |
Nominal supply voltage |
2.7 V |
2.7 V |
surface mount |
YES |
YES |
Telecom integrated circuit types |
RF AND BASEBAND CIRCUIT |
RF AND BASEBAND CIRCUIT |
Temperature level |
OTHER |
OTHER |
Terminal surface |
TIN LEAD |
TIN LEAD |
Terminal form |
GULL WING |
GULL WING |
Terminal pitch |
0.65 mm |
0.65 mm |
Terminal location |
DUAL |
DUAL |
Maximum time at peak reflow temperature |
30 |
30 |
width |
4.4 mm |
4.4 mm |