Microcontroller, 8-Bit, 8051 CPU, 16MHz, CMOS, PQFP44
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Philips Semiconductors (NXP Semiconductors N.V.) |
| package instruction | QFP, QFP44,.5SQ,32 |
| Reach Compliance Code | unknown |
| bit size | 8 |
| CPU series | 8051 |
| JESD-30 code | S-PQFP-G44 |
| JESD-609 code | e0 |
| Number of terminals | 44 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | QFP |
| Encapsulate equivalent code | QFP44,.5SQ,32 |
| Package shape | SQUARE |
| Package form | FLATPACK |
| power supply | 5 V |
| Certification status | Not Qualified |
| RAM (bytes) | 256 |
| rom(word) | 0 |
| speed | 16 MHz |
| Maximum slew rate | 32 mA |
| Nominal supply voltage | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | GULL WING |
| Terminal pitch | 0.8 mm |
| Terminal location | QUAD |
| P80C34EFB | P80C54EBBD | P80C34EBBD | P80C34EBP | P80C34IBA | P87C54EBBD | P87C54EBP | P87C54IBA | P87C54IBBD | |
|---|---|---|---|---|---|---|---|---|---|
| Description | Microcontroller, 8-Bit, 8051 CPU, 16MHz, CMOS, PQFP44 | Microcontroller, 8-Bit, MROM, 8051 CPU, 16MHz, CMOS, PQFP44 | Microcontroller, 8-Bit, 8051 CPU, 16MHz, CMOS, PQFP44 | Microcontroller, 8-Bit, 8051 CPU, 16MHz, CMOS, PDIP40 | Microcontroller, 8-Bit, 8051 CPU, 24MHz, CMOS, PQCC44 | Microcontroller, 8-Bit, UVPROM, 8051 CPU, 16MHz, CMOS, PQFP44 | Microcontroller, 8-Bit, UVPROM, 8051 CPU, 16MHz, CMOS, PDIP40 | Microcontroller, 8-Bit, UVPROM, 8051 CPU, 24MHz, CMOS, PQCC44 | Microcontroller, 8-Bit, UVPROM, 8051 CPU, 24MHz, CMOS, PQFP44 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Maker | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) |
| package instruction | QFP, QFP44,.5SQ,32 | QFP, QFP44,.5SQ,32 | QFP, QFP44,.5SQ,32 | DIP, DIP40,.6 | QCCJ, LDCC44,.7SQ | QFP, QFP44,.5SQ,32 | DIP, DIP40,.6 | QCCJ, LDCC44,.7SQ | QFP, QFP44,.5SQ,32 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| bit size | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| CPU series | 8051 | 8051 | 8051 | 8051 | 8051 | 8051 | 8051 | 8051 | 8051 |
| JESD-30 code | S-PQFP-G44 | S-PQFP-G44 | S-PQFP-G44 | R-PDIP-T40 | S-PQCC-J44 | S-PQFP-G44 | R-PDIP-T40 | S-PQCC-J44 | S-PQFP-G44 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| Number of terminals | 44 | 44 | 44 | 40 | 44 | 44 | 40 | 44 | 44 |
| Maximum operating temperature | 85 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | QFP | QFP | QFP | DIP | QCCJ | QFP | DIP | QCCJ | QFP |
| Encapsulate equivalent code | QFP44,.5SQ,32 | QFP44,.5SQ,32 | QFP44,.5SQ,32 | DIP40,.6 | LDCC44,.7SQ | QFP44,.5SQ,32 | DIP40,.6 | LDCC44,.7SQ | QFP44,.5SQ,32 |
| Package shape | SQUARE | SQUARE | SQUARE | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR | SQUARE | SQUARE |
| Package form | FLATPACK | FLATPACK | FLATPACK | IN-LINE | CHIP CARRIER | FLATPACK | IN-LINE | CHIP CARRIER | FLATPACK |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| RAM (bytes) | 256 | 256 | 256 | 256 | 256 | 256 | 256 | 256 | 256 |
| rom(word) | - | 16384 | - | - | - | 16384 | 16384 | 16384 | 16384 |
| speed | 16 MHz | 16 MHz | 16 MHz | 16 MHz | 24 MHz | 16 MHz | 16 MHz | 24 MHz | 24 MHz |
| Maximum slew rate | 32 mA | 32 mA | 32 mA | 32 mA | 44 mA | 32 mA | 32 mA | 44 mA | 44 mA |
| Nominal supply voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | YES | YES | NO | YES | YES | NO | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | INDUSTRIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | GULL WING | GULL WING | GULL WING | THROUGH-HOLE | J BEND | GULL WING | THROUGH-HOLE | J BEND | GULL WING |
| Terminal pitch | 0.8 mm | 0.8 mm | 0.8 mm | 2.54 mm | 1.27 mm | 0.8 mm | 2.54 mm | 1.27 mm | 0.8 mm |
| Terminal location | QUAD | QUAD | QUAD | DUAL | QUAD | QUAD | DUAL | QUAD | QUAD |
| ROM programmability | - | MROM | - | - | - | UVPROM | UVPROM | UVPROM | UVPROM |
EEWorld
subscription
account
EEWorld
service
account
Automotive
development
circle
京公网安备 11010802033920号
EEWORLD
