P80C34EBP datasheet, PDF - EEWORLD Datasheet

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P80C34EBP: DescriptionMicrocontroller, 8-Bit, 8051 CPU, 16MHz, CMOS, PDIP40; CategoryThe embedded processor and controller Microcontrollers and processors; File Size2MB，27 Pages; ManufacturerPhilips Semiconductors (NXP Semiconductors N.V.); Websitehttps://www.nxp.com/

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P80C34EBP Overview

Microcontroller, 8-Bit, 8051 CPU, 16MHz, CMOS, PDIP40

P80C34EBP Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Philips Semiconductors (NXP Semiconductors N.V.)
package instruction	DIP, DIP40,.6
Reach Compliance Code	unknown
bit size	8
CPU series	8051
JESD-30 code	R-PDIP-T40
JESD-609 code	e0
Number of terminals	40
Maximum operating temperature	70 °C
Minimum operating temperature
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP40,.6
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	5 V
Certification status	Not Qualified
RAM (bytes)	256
rom(word)	0
speed	16 MHz
Maximum slew rate	32 mA
Nominal supply voltage	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL

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P80C34EBP Related Products

	P80C34EBP	P80C54EBBD	P80C34EBBD	P80C34EFB	P80C34IBA	P87C54EBBD	P87C54EBP	P87C54IBA	P87C54IBBD
Description	Microcontroller, 8-Bit, 8051 CPU, 16MHz, CMOS, PDIP40	Microcontroller, 8-Bit, MROM, 8051 CPU, 16MHz, CMOS, PQFP44	Microcontroller, 8-Bit, 8051 CPU, 16MHz, CMOS, PQFP44	Microcontroller, 8-Bit, 8051 CPU, 16MHz, CMOS, PQFP44	Microcontroller, 8-Bit, 8051 CPU, 24MHz, CMOS, PQCC44	Microcontroller, 8-Bit, UVPROM, 8051 CPU, 16MHz, CMOS, PQFP44	Microcontroller, 8-Bit, UVPROM, 8051 CPU, 16MHz, CMOS, PDIP40	Microcontroller, 8-Bit, UVPROM, 8051 CPU, 24MHz, CMOS, PQCC44	Microcontroller, 8-Bit, UVPROM, 8051 CPU, 24MHz, CMOS, PQFP44
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	Philips Semiconductors (NXP Semiconductors N.V.)	Philips Semiconductors (NXP Semiconductors N.V.)	Philips Semiconductors (NXP Semiconductors N.V.)	Philips Semiconductors (NXP Semiconductors N.V.)	Philips Semiconductors (NXP Semiconductors N.V.)	Philips Semiconductors (NXP Semiconductors N.V.)	Philips Semiconductors (NXP Semiconductors N.V.)	Philips Semiconductors (NXP Semiconductors N.V.)	Philips Semiconductors (NXP Semiconductors N.V.)
package instruction	DIP, DIP40,.6	QFP, QFP44,.5SQ,32	QFP, QFP44,.5SQ,32	QFP, QFP44,.5SQ,32	QCCJ, LDCC44,.7SQ	QFP, QFP44,.5SQ,32	DIP, DIP40,.6	QCCJ, LDCC44,.7SQ	QFP, QFP44,.5SQ,32
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
bit size	8	8	8	8	8	8	8	8	8
CPU series	8051	8051	8051	8051	8051	8051	8051	8051	8051
JESD-30 code	R-PDIP-T40	S-PQFP-G44	S-PQFP-G44	S-PQFP-G44	S-PQCC-J44	S-PQFP-G44	R-PDIP-T40	S-PQCC-J44	S-PQFP-G44
JESD-609 code	e0	e0	e0	e0	e0	e0	e0	e0	e0
Number of terminals	40	44	44	44	44	44	40	44	44
Maximum operating temperature	70 °C	70 °C	70 °C	85 °C	70 °C	70 °C	70 °C	70 °C	70 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	QFP	QFP	QFP	QCCJ	QFP	DIP	QCCJ	QFP
Encapsulate equivalent code	DIP40,.6	QFP44,.5SQ,32	QFP44,.5SQ,32	QFP44,.5SQ,32	LDCC44,.7SQ	QFP44,.5SQ,32	DIP40,.6	LDCC44,.7SQ	QFP44,.5SQ,32
Package shape	RECTANGULAR	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	RECTANGULAR	SQUARE	SQUARE
Package form	IN-LINE	FLATPACK	FLATPACK	FLATPACK	CHIP CARRIER	FLATPACK	IN-LINE	CHIP CARRIER	FLATPACK
power supply	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
RAM (bytes)	256	256	256	256	256	256	256	256	256
rom(word)	-	16384	-	-	-	16384	16384	16384	16384
speed	16 MHz	16 MHz	16 MHz	16 MHz	24 MHz	16 MHz	16 MHz	24 MHz	24 MHz
Maximum slew rate	32 mA	32 mA	32 mA	32 mA	44 mA	32 mA	32 mA	44 mA	44 mA
Nominal supply voltage	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	YES	YES	YES	YES	YES	NO	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	INDUSTRIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	GULL WING	GULL WING	GULL WING	J BEND	GULL WING	THROUGH-HOLE	J BEND	GULL WING
Terminal pitch	2.54 mm	0.8 mm	0.8 mm	0.8 mm	1.27 mm	0.8 mm	2.54 mm	1.27 mm	0.8 mm
Terminal location	DUAL	QUAD	QUAD	QUAD	QUAD	QUAD	DUAL	QUAD	QUAD
ROM programmability	-	MROM	-	-	-	UVPROM	UVPROM	UVPROM	UVPROM

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