IC,MICROPROGRAM SEQUENCER,TTL,DIP,20PIN,CERAMIC
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | National Semiconductor(TI ) |
Reach Compliance Code | compliant |
JESD-30 code | R-XDIP-T20 |
JESD-609 code | e0 |
Number of terminals | 20 |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
Package body material | CERAMIC |
encapsulated code | DIP |
Encapsulate equivalent code | DIP20,.3 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
power supply | 5 V |
Certification status | Not Qualified |
Filter level | 38535Q/M;38534H;883B |
Nominal supply voltage | 5 V |
surface mount | NO |
technology | TTL |
Temperature level | MILITARY |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
uPs/uCs/peripheral integrated circuit type | BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER |
IDM2911AJM/883 | IDM2909ANC | IDM2909AJC | IDM2909AJM | IDM2909AJM/883 | IDM2911AJC | IDM2911AJM/883B | IDM2911AJM | IDM2911ANC | |
---|---|---|---|---|---|---|---|---|---|
Description | IC,MICROPROGRAM SEQUENCER,TTL,DIP,20PIN,CERAMIC | IC 4-BIT, MICROPROGRAM SEQUENCER, PDIP28, PLASTIC, DIP-28, Bit-Slice Processor | IC,MICROPROGRAM SEQUENCER,TTL,DIP,28PIN,CERAMIC | IC,MICROPROGRAM SEQUENCER,TTL,DIP,28PIN,CERAMIC | IC,MICROPROGRAM SEQUENCER,TTL,DIP,28PIN,CERAMIC | IC,MICROPROGRAM SEQUENCER,TTL,DIP,20PIN,CERAMIC | IC 4-BIT, MICROPROGRAM SEQUENCER, DIP20, DIP-20, Bit-Slice Processor | IC,MICROPROGRAM SEQUENCER,TTL,DIP,20PIN,CERAMIC | IC 4-BIT, MICROPROGRAM SEQUENCER, PDIP20, PLASTIC, DIP-20, Bit-Slice Processor |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
Maker | National Semiconductor(TI ) | National Semiconductor(TI ) | National Semiconductor(TI ) | National Semiconductor(TI ) | National Semiconductor(TI ) | National Semiconductor(TI ) | National Semiconductor(TI ) | National Semiconductor(TI ) | National Semiconductor(TI ) |
Reach Compliance Code | compliant | unknown | compliant | compliant | compliant | compliant | unknown | compliant | unknown |
JESD-30 code | R-XDIP-T20 | R-PDIP-T28 | R-XDIP-T28 | R-XDIP-T28 | R-XDIP-T28 | R-XDIP-T20 | R-XDIP-T20 | R-XDIP-T20 | R-PDIP-T20 |
JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
Number of terminals | 20 | 28 | 28 | 28 | 28 | 20 | 20 | 20 | 20 |
Maximum operating temperature | 125 °C | 70 °C | 70 °C | 125 °C | 125 °C | 70 °C | 125 °C | 125 °C | 70 °C |
Minimum operating temperature | -55 °C | - | - | -55 °C | -55 °C | - | -55 °C | -55 °C | - |
Package body material | CERAMIC | PLASTIC/EPOXY | CERAMIC | CERAMIC | CERAMIC | CERAMIC | UNSPECIFIED | CERAMIC | PLASTIC/EPOXY |
encapsulated code | DIP | DIP | DIP | DIP | DIP | DIP | DIP | DIP | DIP |
Encapsulate equivalent code | DIP20,.3 | DIP28,.6 | DIP28,.6 | DIP28,.6 | DIP28,.6 | DIP20,.3 | DIP20,.3 | DIP20,.3 | DIP20,.3 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Nominal supply voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
surface mount | NO | NO | NO | NO | NO | NO | NO | NO | NO |
technology | TTL | TTL | TTL | TTL | TTL | TTL | BIPOLAR | TTL | TTL |
Temperature level | MILITARY | COMMERCIAL | COMMERCIAL | MILITARY | MILITARY | COMMERCIAL | MILITARY | MILITARY | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
uPs/uCs/peripheral integrated circuit type | BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER | BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER | BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER | BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER | BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER | BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER | BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER | BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER | BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER |