IDM2911ANC datasheet, PDF - EEWORLD Datasheet

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IDM2911ANC: DescriptionIC 4-BIT, MICROPROGRAM SEQUENCER, PDIP20, PLASTIC, DIP-20, Bit-Slice Processor; CategoryThe embedded processor and controller Microcontrollers and processors; File Size358KB，10 Pages; ManufacturerNational Semiconductor（TI ）; Websitehttp://www.ti.com

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IDM2911ANC Overview

IC 4-BIT, MICROPROGRAM SEQUENCER, PDIP20, PLASTIC, DIP-20, Bit-Slice Processor

IDM2911ANC Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	National Semiconductor（TI ）
package instruction	PLASTIC, DIP-20
Reach Compliance Code	unknown
External data bus width	4
JESD-30 code	R-PDIP-T20
JESD-609 code	e0
length	26.075 mm
Number of terminals	20
Maximum operating temperature	70 °C
Minimum operating temperature
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP20,.3
Package shape	RECTANGULAR
Package form	IN-LINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Certification status	Not Qualified
Maximum seat height	5.08 mm
Maximum slew rate	130 mA
Maximum supply voltage	5.25 V
Minimum supply voltage	4.75 V
Nominal supply voltage	5 V
surface mount	NO
technology	TTL
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	7.62 mm
uPs/uCs/peripheral integrated circuit type	BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER

IDM2911ANC Related Products

	IDM2911ANC	IDM2909ANC	IDM2909AJC	IDM2909AJM	IDM2909AJM/883	IDM2911AJC	IDM2911AJM/883B	IDM2911AJM	IDM2911AJM/883
Description	IC 4-BIT, MICROPROGRAM SEQUENCER, PDIP20, PLASTIC, DIP-20, Bit-Slice Processor	IC 4-BIT, MICROPROGRAM SEQUENCER, PDIP28, PLASTIC, DIP-28, Bit-Slice Processor	IC,MICROPROGRAM SEQUENCER,TTL,DIP,28PIN,CERAMIC	IC,MICROPROGRAM SEQUENCER,TTL,DIP,28PIN,CERAMIC	IC,MICROPROGRAM SEQUENCER,TTL,DIP,28PIN,CERAMIC	IC,MICROPROGRAM SEQUENCER,TTL,DIP,20PIN,CERAMIC	IC 4-BIT, MICROPROGRAM SEQUENCER, DIP20, DIP-20, Bit-Slice Processor	IC,MICROPROGRAM SEQUENCER,TTL,DIP,20PIN,CERAMIC	IC,MICROPROGRAM SEQUENCER,TTL,DIP,20PIN,CERAMIC
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	National Semiconductor（TI ）	National Semiconductor（TI ）	National Semiconductor（TI ）	National Semiconductor（TI ）	National Semiconductor（TI ）	National Semiconductor（TI ）	National Semiconductor（TI ）	National Semiconductor（TI ）	National Semiconductor（TI ）
Reach Compliance Code	unknown	unknown	compliant	compliant	compliant	compliant	unknown	compliant	compliant
JESD-30 code	R-PDIP-T20	R-PDIP-T28	R-XDIP-T28	R-XDIP-T28	R-XDIP-T28	R-XDIP-T20	R-XDIP-T20	R-XDIP-T20	R-XDIP-T20
JESD-609 code	e0	e0	e0	e0	e0	e0	e0	e0	e0
Number of terminals	20	28	28	28	28	20	20	20	20
Maximum operating temperature	70 °C	70 °C	70 °C	125 °C	125 °C	70 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-	-	-	-55 °C	-55 °C	-	-55 °C	-55 °C	-55 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC	CERAMIC	CERAMIC	CERAMIC	UNSPECIFIED	CERAMIC	CERAMIC
encapsulated code	DIP	DIP	DIP	DIP	DIP	DIP	DIP	DIP	DIP
Encapsulate equivalent code	DIP20,.3	DIP28,.6	DIP28,.6	DIP28,.6	DIP28,.6	DIP20,.3	DIP20,.3	DIP20,.3	DIP20,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE
power supply	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Nominal supply voltage	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	NO	NO	NO	NO	NO	NO	NO
technology	TTL	TTL	TTL	TTL	TTL	TTL	BIPOLAR	TTL	TTL
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	MILITARY	MILITARY	COMMERCIAL	MILITARY	MILITARY	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
uPs/uCs/peripheral integrated circuit type	BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER	BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER	BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER	BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER	BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER	BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER	BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER	BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER	BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER

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