SCN68661BA1F28 datasheet, PDF - EEWORLD Datasheet

Datasheet> All Categories > The embedded processor and controller> Microcontrollers and processors> SCN68661BA1F28

SCN68661BA1F28: DescriptionIC 1 CHANNEL(S), 1M bps, SERIAL COMM CONTROLLER, CDIP28, 0.600 INCH, CERAMIC, DIP-28, Serial IO/Communication Controller; CategoryThe embedded processor and controller Microcontrollers and processors; File Size695KB，19 Pages; ManufacturerNXP; Websitehttps://www.nxp.com

Download Datasheet Parametric Compare View All

SCN68661BA1F28 Overview

IC 1 CHANNEL(S), 1M bps, SERIAL COMM CONTROLLER, CDIP28, 0.600 INCH, CERAMIC, DIP-28, Serial IO/Communication Controller

SCN68661BA1F28 Parametric

Parameter Name	Attribute value
Maker	NXP
Parts packaging code	DIP
package instruction	DIP,
Contacts	28
Reach Compliance Code	unknown
Other features	MODEM CONTROL I/OS USABLE AS GENERAL PURPOSE I/OS
Address bus width	2
boundary scan	NO
letter of agreement	ASYNC, BIT; SYNC, BYTE; BISYNC
Data encoding/decoding methods	NRZ
Maximum data transfer rate	0.125 MBps
External data bus width	8
JESD-30 code	R-GDIP-T28
length	37.15 mm
low power mode	NO
Number of DMA channels
Number of I/O lines
Number of serial I/Os	1
Number of terminals	28
On-chip data RAM width
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	CERAMIC, GLASS-SEALED
encapsulated code	DIP
Package shape	RECTANGULAR
Package form	IN-LINE
Certification status	Not Qualified
RAM (number of words)	0
Maximum seat height	5.72 mm
Maximum slew rate	150 mA
Maximum supply voltage	5.25 V
Minimum supply voltage	4.75 V
Nominal supply voltage	5 V
surface mount	NO
technology	NMOS
Temperature level	INDUSTRIAL
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
width	15.24 mm
uPs/uCs/peripheral integrated circuit type	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

Preview

Download Datasheet

View All

SCN68661BA1F28 Related Products

	SCN68661BA1F28	SCN68661CA1F28	SCN68661CC1A28	SCN68661CC1N28	SCN68661AC1N28	SCN68661AC1A28	SCN68661BC1N28	SCN68661CC1F28	SCN68661BC1A28
Description	IC 1 CHANNEL(S), 1M bps, SERIAL COMM CONTROLLER, CDIP28, 0.600 INCH, CERAMIC, DIP-28, Serial IO/Communication Controller	IC 1 CHANNEL(S), 1M bps, SERIAL COMM CONTROLLER, CDIP28, 0.600 INCH, CERAMIC, DIP-28, Serial IO/Communication Controller	IC 1 CHANNEL(S), 1M bps, SERIAL COMM CONTROLLER, PQCC28, PLASTIC, LCC-28, Serial IO/Communication Controller	IC 1 CHANNEL(S), 1M bps, SERIAL COMM CONTROLLER, PDIP28, 0.600 INCH, PLASTIC, DIP-28, Serial IO/Communication Controller	IC 1 CHANNEL(S), 1M bps, SERIAL COMM CONTROLLER, PDIP28, 0.600 INCH, PLASTIC, DIP-28, Serial IO/Communication Controller	IC 1 CHANNEL(S), 1M bps, SERIAL COMM CONTROLLER, PQCC28, PLASTIC, LCC-28, Serial IO/Communication Controller	IC 1 CHANNEL(S), 1M bps, SERIAL COMM CONTROLLER, PDIP28, 0.600 INCH, PLASTIC, DIP-28, Serial IO/Communication Controller	IC 1 CHANNEL(S), 1M bps, SERIAL COMM CONTROLLER, CDIP28, 0.600 INCH, CERAMIC, DIP-28, Serial IO/Communication Controller	IC 1 CHANNEL(S), 1M bps, SERIAL COMM CONTROLLER, PQCC28, PLASTIC, LCC-28, Serial IO/Communication Controller
Parts packaging code	DIP	DIP	QLCC	DIP	DIP	QLCC	DIP	DIP	QLCC
package instruction	DIP,	DIP,	QCCJ,	DIP,	DIP,	QCCJ,	DIP,	DIP,	QCCJ,
Contacts	28	28	28	28	28	28	28	28	28
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
Other features	MODEM CONTROL I/OS USABLE AS GENERAL PURPOSE I/OS	MODEM CONTROL I/OS USABLE AS GENERAL PURPOSE I/OS	MODEM CONTROL I/OS USABLE AS GENERAL PURPOSE I/OS	MODEM CONTROL I/OS USABLE AS GENERAL PURPOSE I/OS	MODEM CONTROL I/OS USABLE AS GENERAL PURPOSE I/OS	MODEM CONTROL I/OS USABLE AS GENERAL PURPOSE I/OS	MODEM CONTROL I/OS USABLE AS GENERAL PURPOSE I/OS	MODEM CONTROL I/OS USABLE AS GENERAL PURPOSE I/OS	MODEM CONTROL I/OS USABLE AS GENERAL PURPOSE I/OS
Address bus width	2	2	2	2	2	2	2	2	2
boundary scan	NO	NO	NO	NO	NO	NO	NO	NO	NO
letter of agreement	ASYNC, BIT; SYNC, BYTE; BISYNC	ASYNC, BIT; SYNC, BYTE; BISYNC	ASYNC, BIT; SYNC, BYTE; BISYNC	ASYNC, BIT; SYNC, BYTE; BISYNC	ASYNC, BIT; SYNC, BYTE; BISYNC	ASYNC, BIT; SYNC, BYTE; BISYNC	ASYNC, BIT; SYNC, BYTE; BISYNC	ASYNC, BIT; SYNC, BYTE; BISYNC	ASYNC, BIT; SYNC, BYTE; BISYNC
Data encoding/decoding methods	NRZ	NRZ	NRZ	NRZ	NRZ	NRZ	NRZ	NRZ	NRZ
Maximum data transfer rate	0.125 MBps	0.125 MBps	0.125 MBps	0.125 MBps	0.125 MBps	0.125 MBps	0.125 MBps	0.125 MBps	0.125 MBps
External data bus width	8	8	8	8	8	8	8	8	8
JESD-30 code	R-GDIP-T28	R-GDIP-T28	S-PQCC-J28	R-PDIP-T28	R-PDIP-T28	S-PQCC-J28	R-PDIP-T28	R-GDIP-T28	S-PQCC-J28
length	37.15 mm	37.15 mm	11.5062 mm	36.51 mm	36.51 mm	11.5062 mm	36.51 mm	37.15 mm	11.5062 mm
low power mode	NO	NO	NO	NO	NO	NO	NO	NO	NO
Number of serial I/Os	1	1	1	1	1	1	1	1	1
Number of terminals	28	28	28	28	28	28	28	28	28
Maximum operating temperature	85 °C	85 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
Package body material	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY
encapsulated code	DIP	DIP	QCCJ	DIP	DIP	QCCJ	DIP	DIP	QCCJ
Package shape	RECTANGULAR	RECTANGULAR	SQUARE	RECTANGULAR	RECTANGULAR	SQUARE	RECTANGULAR	RECTANGULAR	SQUARE
Package form	IN-LINE	IN-LINE	CHIP CARRIER	IN-LINE	IN-LINE	CHIP CARRIER	IN-LINE	IN-LINE	CHIP CARRIER
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	5.72 mm	5.72 mm	4.57 mm	5.08 mm	5.08 mm	4.57 mm	5.08 mm	5.72 mm	4.57 mm
Maximum slew rate	150 mA	150 mA	150 mA	150 mA	150 mA	150 mA	150 mA	150 mA	150 mA
Maximum supply voltage	5.25 V	5.25 V	5.25 V	5.25 V	5.25 V	5.25 V	5.25 V	5.25 V	5.25 V
Minimum supply voltage	4.75 V	4.75 V	4.75 V	4.75 V	4.75 V	4.75 V	4.75 V	4.75 V	4.75 V
Nominal supply voltage	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	YES	NO	NO	YES	NO	NO	YES
technology	NMOS	NMOS	NMOS	NMOS	NMOS	NMOS	NMOS	NMOS	NMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal form	THROUGH-HOLE	THROUGH-HOLE	J BEND	THROUGH-HOLE	THROUGH-HOLE	J BEND	THROUGH-HOLE	THROUGH-HOLE	J BEND
Terminal pitch	2.54 mm	2.54 mm	1.27 mm	2.54 mm	2.54 mm	1.27 mm	2.54 mm	2.54 mm	1.27 mm
Terminal location	DUAL	DUAL	QUAD	DUAL	DUAL	QUAD	DUAL	DUAL	QUAD
width	15.24 mm	15.24 mm	11.5062 mm	15.24 mm	15.24 mm	11.5062 mm	15.24 mm	15.24 mm	11.5062 mm
uPs/uCs/peripheral integrated circuit type	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
Maker	NXP	NXP	NXP	NXP	-	-	-	NXP	-
Base Number Matches	-	1	1	1	1	1	1	-	1

Recommended Resources

Wiring of zinc oxide arrester with series gap four-star connection

High stability voltage stabilizing circuit diagram

Application of linear integrated circuits in speed control systems

High reliability frequency selective switch circuit

Mains overvoltage and undervoltage automatic indication protection circuit

Shortcut: E0 E1 E2 E3 E4 E5 E6 E7 E8 E9 EA EB EC ED EE EF EG EH EI EJ EK EL EM EN EO EP EQ ER ES ET EU EV EW EX EY EZ F0 F1 F2 F3 F4 F5 F6 F7 F8 F9 FA FB FC FD FE FF FG FH FI FJ FK FL FM FN FO FP FQ FR FS FT FU FV FW FX FY FZ G0 G1 G2 G3 G4 G5 G6 G7 G8 G9 GA GB GC GD GE GF GG GH GI GJ GK GL GM GN GO GP GQ GR GS GT GU GV GW GX GZ H0 H1 H2 H3 H4 H5 H6 H7 H8 HA HB HC HD HE HF HG HH HI HJ HK HL HM HN HO HP HQ HR HS HT HU HV HW HX HY HZ I1 I2 I3 I4 I5 I6 I7 IA IB IC ID IE IF IG IH II IK IL IM IN IO IP IQ IR IS IT IU IV IW IX J0 J1 J2 J6 J7 JA JB JC JD JE JF JG JH JJ JK JL JM JN JP JQ JR JS JT JV JW JX JZ K0 K1 K2 K3 K4 K5 K6 K7 K8 K9 KA KB KC KD KE KF KG KH KI KJ KK KL KM KN KO KP KQ KR KS KT KU KV KW KX KY KZ

Popular Components