|
SCN68661BC1N28 |
SCN68661CA1F28 |
SCN68661CC1A28 |
SCN68661CC1N28 |
SCN68661AC1N28 |
SCN68661AC1A28 |
SCN68661CC1F28 |
SCN68661BC1A28 |
SCN68661BA1F28 |
Description |
IC 1 CHANNEL(S), 1M bps, SERIAL COMM CONTROLLER, PDIP28, 0.600 INCH, PLASTIC, DIP-28, Serial IO/Communication Controller |
IC 1 CHANNEL(S), 1M bps, SERIAL COMM CONTROLLER, CDIP28, 0.600 INCH, CERAMIC, DIP-28, Serial IO/Communication Controller |
IC 1 CHANNEL(S), 1M bps, SERIAL COMM CONTROLLER, PQCC28, PLASTIC, LCC-28, Serial IO/Communication Controller |
IC 1 CHANNEL(S), 1M bps, SERIAL COMM CONTROLLER, PDIP28, 0.600 INCH, PLASTIC, DIP-28, Serial IO/Communication Controller |
IC 1 CHANNEL(S), 1M bps, SERIAL COMM CONTROLLER, PDIP28, 0.600 INCH, PLASTIC, DIP-28, Serial IO/Communication Controller |
IC 1 CHANNEL(S), 1M bps, SERIAL COMM CONTROLLER, PQCC28, PLASTIC, LCC-28, Serial IO/Communication Controller |
IC 1 CHANNEL(S), 1M bps, SERIAL COMM CONTROLLER, CDIP28, 0.600 INCH, CERAMIC, DIP-28, Serial IO/Communication Controller |
IC 1 CHANNEL(S), 1M bps, SERIAL COMM CONTROLLER, PQCC28, PLASTIC, LCC-28, Serial IO/Communication Controller |
IC 1 CHANNEL(S), 1M bps, SERIAL COMM CONTROLLER, CDIP28, 0.600 INCH, CERAMIC, DIP-28, Serial IO/Communication Controller |
Parts packaging code |
DIP |
DIP |
QLCC |
DIP |
DIP |
QLCC |
DIP |
QLCC |
DIP |
package instruction |
DIP, |
DIP, |
QCCJ, |
DIP, |
DIP, |
QCCJ, |
DIP, |
QCCJ, |
DIP, |
Contacts |
28 |
28 |
28 |
28 |
28 |
28 |
28 |
28 |
28 |
Reach Compliance Code |
unknown |
unknown |
unknown |
unknown |
unknown |
unknown |
unknown |
unknown |
unknown |
Other features |
MODEM CONTROL I/OS USABLE AS GENERAL PURPOSE I/OS |
MODEM CONTROL I/OS USABLE AS GENERAL PURPOSE I/OS |
MODEM CONTROL I/OS USABLE AS GENERAL PURPOSE I/OS |
MODEM CONTROL I/OS USABLE AS GENERAL PURPOSE I/OS |
MODEM CONTROL I/OS USABLE AS GENERAL PURPOSE I/OS |
MODEM CONTROL I/OS USABLE AS GENERAL PURPOSE I/OS |
MODEM CONTROL I/OS USABLE AS GENERAL PURPOSE I/OS |
MODEM CONTROL I/OS USABLE AS GENERAL PURPOSE I/OS |
MODEM CONTROL I/OS USABLE AS GENERAL PURPOSE I/OS |
Address bus width |
2 |
2 |
2 |
2 |
2 |
2 |
2 |
2 |
2 |
boundary scan |
NO |
NO |
NO |
NO |
NO |
NO |
NO |
NO |
NO |
letter of agreement |
ASYNC, BIT; SYNC, BYTE; BISYNC |
ASYNC, BIT; SYNC, BYTE; BISYNC |
ASYNC, BIT; SYNC, BYTE; BISYNC |
ASYNC, BIT; SYNC, BYTE; BISYNC |
ASYNC, BIT; SYNC, BYTE; BISYNC |
ASYNC, BIT; SYNC, BYTE; BISYNC |
ASYNC, BIT; SYNC, BYTE; BISYNC |
ASYNC, BIT; SYNC, BYTE; BISYNC |
ASYNC, BIT; SYNC, BYTE; BISYNC |
Data encoding/decoding methods |
NRZ |
NRZ |
NRZ |
NRZ |
NRZ |
NRZ |
NRZ |
NRZ |
NRZ |
Maximum data transfer rate |
0.125 MBps |
0.125 MBps |
0.125 MBps |
0.125 MBps |
0.125 MBps |
0.125 MBps |
0.125 MBps |
0.125 MBps |
0.125 MBps |
External data bus width |
8 |
8 |
8 |
8 |
8 |
8 |
8 |
8 |
8 |
JESD-30 code |
R-PDIP-T28 |
R-GDIP-T28 |
S-PQCC-J28 |
R-PDIP-T28 |
R-PDIP-T28 |
S-PQCC-J28 |
R-GDIP-T28 |
S-PQCC-J28 |
R-GDIP-T28 |
length |
36.51 mm |
37.15 mm |
11.5062 mm |
36.51 mm |
36.51 mm |
11.5062 mm |
37.15 mm |
11.5062 mm |
37.15 mm |
low power mode |
NO |
NO |
NO |
NO |
NO |
NO |
NO |
NO |
NO |
Number of serial I/Os |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
Number of terminals |
28 |
28 |
28 |
28 |
28 |
28 |
28 |
28 |
28 |
Maximum operating temperature |
70 °C |
85 °C |
70 °C |
70 °C |
70 °C |
70 °C |
70 °C |
70 °C |
85 °C |
Package body material |
PLASTIC/EPOXY |
CERAMIC, GLASS-SEALED |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
CERAMIC, GLASS-SEALED |
PLASTIC/EPOXY |
CERAMIC, GLASS-SEALED |
encapsulated code |
DIP |
DIP |
QCCJ |
DIP |
DIP |
QCCJ |
DIP |
QCCJ |
DIP |
Package shape |
RECTANGULAR |
RECTANGULAR |
SQUARE |
RECTANGULAR |
RECTANGULAR |
SQUARE |
RECTANGULAR |
SQUARE |
RECTANGULAR |
Package form |
IN-LINE |
IN-LINE |
CHIP CARRIER |
IN-LINE |
IN-LINE |
CHIP CARRIER |
IN-LINE |
CHIP CARRIER |
IN-LINE |
Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Maximum seat height |
5.08 mm |
5.72 mm |
4.57 mm |
5.08 mm |
5.08 mm |
4.57 mm |
5.72 mm |
4.57 mm |
5.72 mm |
Maximum slew rate |
150 mA |
150 mA |
150 mA |
150 mA |
150 mA |
150 mA |
150 mA |
150 mA |
150 mA |
Maximum supply voltage |
5.25 V |
5.25 V |
5.25 V |
5.25 V |
5.25 V |
5.25 V |
5.25 V |
5.25 V |
5.25 V |
Minimum supply voltage |
4.75 V |
4.75 V |
4.75 V |
4.75 V |
4.75 V |
4.75 V |
4.75 V |
4.75 V |
4.75 V |
Nominal supply voltage |
5 V |
5 V |
5 V |
5 V |
5 V |
5 V |
5 V |
5 V |
5 V |
surface mount |
NO |
NO |
YES |
NO |
NO |
YES |
NO |
YES |
NO |
technology |
NMOS |
NMOS |
NMOS |
NMOS |
NMOS |
NMOS |
NMOS |
NMOS |
NMOS |
Temperature level |
COMMERCIAL |
INDUSTRIAL |
COMMERCIAL |
COMMERCIAL |
COMMERCIAL |
COMMERCIAL |
COMMERCIAL |
COMMERCIAL |
INDUSTRIAL |
Terminal form |
THROUGH-HOLE |
THROUGH-HOLE |
J BEND |
THROUGH-HOLE |
THROUGH-HOLE |
J BEND |
THROUGH-HOLE |
J BEND |
THROUGH-HOLE |
Terminal pitch |
2.54 mm |
2.54 mm |
1.27 mm |
2.54 mm |
2.54 mm |
1.27 mm |
2.54 mm |
1.27 mm |
2.54 mm |
Terminal location |
DUAL |
DUAL |
QUAD |
DUAL |
DUAL |
QUAD |
DUAL |
QUAD |
DUAL |
width |
15.24 mm |
15.24 mm |
11.5062 mm |
15.24 mm |
15.24 mm |
11.5062 mm |
15.24 mm |
11.5062 mm |
15.24 mm |
uPs/uCs/peripheral integrated circuit type |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
Base Number Matches |
1 |
1 |
1 |
1 |
1 |
1 |
- |
1 |
- |
Maker |
- |
NXP |
NXP |
NXP |
- |
- |
NXP |
- |
NXP |