E0C62L3EQ6 datasheet, PDF - EEWORLD Datasheet

E0C62L3EQ6: DescriptionIC,MICROCONTROLLER,4-BIT,E0C6200/SMC6200 CPU,CMOS,QFP,80PIN,PLASTIC; CategoryThe embedded processor and controller Microcontrollers and processors; File Size588KB，8 Pages; ManufacturerSeiko Epson Corporation

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E0C62L3EQ6 Overview

IC,MICROCONTROLLER,4-BIT,E0C6200/SMC6200 CPU,CMOS,QFP,80PIN,PLASTIC

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Seiko Epson Corporation
package instruction	QFP, QFP80,.75X1,32
Reach Compliance Code	unknown
bit size	4
CPU series	E0C6200/SMC6200
JESD-30 code	R-PQFP-G80
JESD-609 code	e0
Negative supply voltage rating	-1.5 V
Number of terminals	80
Maximum operating temperature	70 °C
Minimum operating temperature	-20 °C
Package body material	PLASTIC/EPOXY
encapsulated code	QFP
Encapsulate equivalent code	QFP80,.75X1,32
Package shape	RECTANGULAR
Package form	FLATPACK
power supply	-1.5 V
Certification status	Not Qualified
RAM (bytes)	72
rom(word)	2048
ROM programmability	MROM
speed	0.05 MHz
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	GULL WING
Terminal pitch	0.8 mm
Terminal location	QUAD

	E0C62L3EQ6	E0C62A3EQ14	E0C62A3EQ6
Description	IC,MICROCONTROLLER,4-BIT,E0C6200/SMC6200 CPU,CMOS,QFP,80PIN,PLASTIC	IC,MICROCONTROLLER,4-BIT,E0C6200/SMC6200 CPU,CMOS,QFP,80PIN,PLASTIC	IC,MICROCONTROLLER,4-BIT,E0C6200/SMC6200 CPU,CMOS,QFP,80PIN,PLASTIC
Maker	Seiko Epson Corporation	Seiko Epson Corporation	Seiko Epson Corporation
package instruction	QFP, QFP80,.75X1,32	QFP, QFP80,.55SQ,20	QFP, QFP80,.75X1,32
Reach Compliance Code	unknown	unknown	unknown
bit size	4	4	4
CPU series	E0C6200/SMC6200	E0C6200/SMC6200	E0C6200/SMC6200
JESD-30 code	R-PQFP-G80	S-PQFP-G80	R-PQFP-G80
JESD-609 code	e0	e0	e0
Negative supply voltage rating	-1.5 V	-3 V	-3 V
Number of terminals	80	80	80
Maximum operating temperature	70 °C	70 °C	70 °C
Minimum operating temperature	-20 °C	-20 °C	-20 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	QFP	QFP	QFP
Encapsulate equivalent code	QFP80,.75X1,32	QFP80,.55SQ,20	QFP80,.75X1,32
Package shape	RECTANGULAR	SQUARE	RECTANGULAR
Package form	FLATPACK	FLATPACK	FLATPACK
power supply	-1.5 V	-3 V	-3 V
Certification status	Not Qualified	Not Qualified	Not Qualified
RAM (bytes)	72	72	72
rom(word)	2048	2048	2048
ROM programmability	MROM	MROM	MROM
speed	0.05 MHz	1.2 MHz	1.2 MHz
surface mount	YES	YES	YES
technology	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	GULL WING	GULL WING	GULL WING
Terminal pitch	0.8 mm	0.5 mm	0.8 mm
Terminal location	QUAD	QUAD	QUAD
Is it Rohs certified?	incompatible	incompatible	-

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