IC,MICROCONTROLLER,4-BIT,E0C6200/SMC6200 CPU,CMOS,QFP,80PIN,PLASTIC
Parameter Name | Attribute value |
Maker | Seiko Epson Corporation |
package instruction | QFP, QFP80,.75X1,32 |
Reach Compliance Code | unknown |
bit size | 4 |
CPU series | E0C6200/SMC6200 |
JESD-30 code | R-PQFP-G80 |
JESD-609 code | e0 |
Negative supply voltage rating | -3 V |
Number of terminals | 80 |
Maximum operating temperature | 70 °C |
Minimum operating temperature | -20 °C |
Package body material | PLASTIC/EPOXY |
encapsulated code | QFP |
Encapsulate equivalent code | QFP80,.75X1,32 |
Package shape | RECTANGULAR |
Package form | FLATPACK |
power supply | -3 V |
Certification status | Not Qualified |
RAM (bytes) | 72 |
rom(word) | 2048 |
ROM programmability | MROM |
speed | 1.2 MHz |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | GULL WING |
Terminal pitch | 0.8 mm |
Terminal location | QUAD |
E0C62A3EQ6 | E0C62A3EQ14 | E0C62L3EQ6 | |
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Description | IC,MICROCONTROLLER,4-BIT,E0C6200/SMC6200 CPU,CMOS,QFP,80PIN,PLASTIC | IC,MICROCONTROLLER,4-BIT,E0C6200/SMC6200 CPU,CMOS,QFP,80PIN,PLASTIC | IC,MICROCONTROLLER,4-BIT,E0C6200/SMC6200 CPU,CMOS,QFP,80PIN,PLASTIC |
Maker | Seiko Epson Corporation | Seiko Epson Corporation | Seiko Epson Corporation |
package instruction | QFP, QFP80,.75X1,32 | QFP, QFP80,.55SQ,20 | QFP, QFP80,.75X1,32 |
Reach Compliance Code | unknown | unknown | unknown |
bit size | 4 | 4 | 4 |
CPU series | E0C6200/SMC6200 | E0C6200/SMC6200 | E0C6200/SMC6200 |
JESD-30 code | R-PQFP-G80 | S-PQFP-G80 | R-PQFP-G80 |
JESD-609 code | e0 | e0 | e0 |
Negative supply voltage rating | -3 V | -3 V | -1.5 V |
Number of terminals | 80 | 80 | 80 |
Maximum operating temperature | 70 °C | 70 °C | 70 °C |
Minimum operating temperature | -20 °C | -20 °C | -20 °C |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | QFP | QFP | QFP |
Encapsulate equivalent code | QFP80,.75X1,32 | QFP80,.55SQ,20 | QFP80,.75X1,32 |
Package shape | RECTANGULAR | SQUARE | RECTANGULAR |
Package form | FLATPACK | FLATPACK | FLATPACK |
power supply | -3 V | -3 V | -1.5 V |
Certification status | Not Qualified | Not Qualified | Not Qualified |
RAM (bytes) | 72 | 72 | 72 |
rom(word) | 2048 | 2048 | 2048 |
ROM programmability | MROM | MROM | MROM |
speed | 1.2 MHz | 1.2 MHz | 0.05 MHz |
surface mount | YES | YES | YES |
technology | CMOS | CMOS | CMOS |
Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | GULL WING | GULL WING | GULL WING |
Terminal pitch | 0.8 mm | 0.5 mm | 0.8 mm |
Terminal location | QUAD | QUAD | QUAD |
Is it Rohs certified? | - | incompatible | incompatible |