AM45DL3248GT70FS datasheet, PDF

AM45DL3248GT70FS: DescriptionMemory Circuit, 2MX16, CMOS, PBGA73, 8 X 11.60 MM, FBGA-73; Categorystorage storage; File Size1MB，64 Pages; ManufacturerSPANSION; Websitehttp://www.spansion.com/; Environmental Compliance

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AM45DL3248GT70FS Overview

Memory Circuit, 2MX16, CMOS, PBGA73, 8 X 11.60 MM, FBGA-73

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	SPANSION
Parts packaging code	BGA
package instruction	LFBGA,
Contacts	73
Reach Compliance Code	compliant
Other features	SRAM IS ORGANISED AS 1M X 8-BIT/512K X 16-BIT
JESD-30 code	R-PBGA-B73
JESD-609 code	e1
length	11.6 mm
memory density	33554432 bit
Memory IC Type	MEMORY CIRCUIT
memory width	16
Humidity sensitivity level	3
Number of functions	1
Number of terminals	73
word count	2097152 words
character code	2000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	2MX16
Package body material	PLASTIC/EPOXY
encapsulated code	LFBGA
Package shape	RECTANGULAR
Package form	GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	260
Certification status	Not Qualified
Maximum seat height	1.4 mm
Maximum supply voltage (Vsup)	3.3 V
Minimum supply voltage (Vsup)	2.7 V
Nominal supply voltage (Vsup)	3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	TIN SILVER COPPER
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	40
width	8 mm

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