IC,DSP,24-BIT,CMOS,QFP,132PIN,CERAMIC
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | NXP |
package instruction | QFP, QFP132,1.2SQ |
Reach Compliance Code | unknown |
bit size | 24 |
Format | FIXED-POINT |
JESD-30 code | S-XQFP-G132 |
JESD-609 code | e0 |
Number of terminals | 132 |
Maximum operating temperature | 105 °C |
Minimum operating temperature | -40 °C |
Package body material | CERAMIC |
encapsulated code | QFP |
Encapsulate equivalent code | QFP132,1.2SQ |
Package shape | SQUARE |
Package form | FLATPACK |
power supply | 5 V |
Certification status | Not Qualified |
RAM (number of words) | 512 |
Nominal supply voltage | 5 V |
surface mount | YES |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | GULL WING |
Terminal pitch | 0.635 mm |
Terminal location | QUAD |
DSP56001AFE27 | DSP56001ARC33 | DSP56001AFC33 | DSP56001AFC27 | |
---|---|---|---|---|
Description | IC,DSP,24-BIT,CMOS,QFP,132PIN,CERAMIC | IC,DSP,24-BIT,CMOS,PGA,88PIN,CERAMIC | IC,DSP,24-BIT,CMOS,QFP,132PIN,PLASTIC | IC,DSP,24-BIT,CMOS,QFP,132PIN,PLASTIC |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible |
Maker | NXP | NXP | NXP | NXP |
package instruction | QFP, QFP132,1.2SQ | PGA, PGA88,13X13MOD | BQFP, SPQFP132,1.2SQ | BQFP, SPQFP132,1.2SQ |
Reach Compliance Code | unknown | unknown | unknown | unknown |
bit size | 24 | 24 | 24 | 24 |
Format | FIXED-POINT | FIXED-POINT | FIXED-POINT | FIXED-POINT |
JESD-30 code | S-XQFP-G132 | S-XPGA-P88 | S-PQFP-G132 | S-PQFP-G132 |
JESD-609 code | e0 | e0 | e0 | e0 |
Number of terminals | 132 | 88 | 132 | 132 |
Maximum operating temperature | 105 °C | 105 °C | 105 °C | 105 °C |
Minimum operating temperature | -40 °C | -40 °C | -40 °C | -40 °C |
Package body material | CERAMIC | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | QFP | PGA | BQFP | BQFP |
Encapsulate equivalent code | QFP132,1.2SQ | PGA88,13X13MOD | SPQFP132,1.2SQ | SPQFP132,1.2SQ |
Package shape | SQUARE | SQUARE | SQUARE | SQUARE |
Package form | FLATPACK | GRID ARRAY | FLATPACK | FLATPACK |
power supply | 5 V | 5 V | 5 V | 5 V |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
RAM (number of words) | 512 | 512 | 512 | 512 |
Nominal supply voltage | 5 V | 5 V | 5 V | 5 V |
surface mount | YES | NO | YES | YES |
technology | CMOS | CMOS | CMOS | CMOS |
Temperature level | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | GULL WING | PIN/PEG | GULL WING | GULL WING |
Terminal pitch | 0.635 mm | 2.54 mm | 0.635 mm | 0.635 mm |
Terminal location | QUAD | PERPENDICULAR | QUAD | QUAD |