PAL1016P4-2JM datasheet, PDF - EEWORLD Datasheet

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PAL1016P4-2JM: DescriptionIC OT PLD, 3 ns, CDIP24, CERAMIC, DIP-24, Programmable Logic Device; CategoryProgrammable logic devices Programmable logic; File Size206KB，6 Pages; ManufacturerNational Semiconductor（TI ）; Websitehttp://www.ti.com

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PAL1016P4-2JM Overview

IC OT PLD, 3 ns, CDIP24, CERAMIC, DIP-24, Programmable Logic Device

PAL1016P4-2JM Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	National Semiconductor（TI ）
Objectid	1425097482
package instruction	DIP, DIP24,.3
Reach Compliance Code	unknown
compound_id	11459284
Architecture	PAL-TYPE
JESD-30 code	R-GDIP-T24
JESD-609 code	e0
Dedicated input times	16
Number of I/O lines
Number of entries	16
Output times	4
Number of product terms	32
Number of terminals	24
Maximum operating temperature	75 °C
Minimum operating temperature
organize	16 DEDICATED INPUTS, 0 I/O
Output function	COMBINATORIAL
Package body material	CERAMIC, GLASS-SEALED
encapsulated code	DIP
Encapsulate equivalent code	DIP24,.3
Package shape	RECTANGULAR
Package form	IN-LINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	-5.2 V
Programmable logic type	OT PLD
propagation delay	3 ns
Certification status	Not Qualified
Maximum seat height	5.715 mm
surface mount	NO
technology	ECL
Temperature level	COMMERCIAL EXTENDED
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	7.62 mm

PAL1016P4-2JM Related Products

	PAL1016P4-2JM	PAL1016P4-2NC	PAL10016P4-2NC	PAL10016P4-2JM	PAL1016P4-2JC	PAL10016P4-2JC
Description	IC OT PLD, 3 ns, CDIP24, CERAMIC, DIP-24, Programmable Logic Device	IC OT PLD, 2.5 ns, PDIP24, 0.300 INCH, SKINNY, PLASTIC, DIP-24, Programmable Logic Device	IC OT PLD, 2.5 ns, PDIP24, 0.300 INCH, SKINNY, PLASTIC, DIP-24, Programmable Logic Device	IC OT PLD, 3 ns, CDIP24, CERAMIC, DIP-24, Programmable Logic Device	IC OT PLD, 2.5 ns, CDIP24, CERAMIC, DIP-24, Programmable Logic Device	IC OT PLD, 2.5 ns, CDIP24, CERAMIC, DIP-24, Programmable Logic Device
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	National Semiconductor（TI ）	National Semiconductor（TI ）	National Semiconductor（TI ）	National Semiconductor（TI ）	National Semiconductor（TI ）	National Semiconductor（TI ）
package instruction	DIP, DIP24,.3	DIP, DIP24,.3	DIP, DIP24,.3	DIP, DIP24,.3	DIP, DIP24,.3	DIP, DIP24,.3
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown
Architecture	PAL-TYPE	PAL-TYPE	PAL-TYPE	PAL-TYPE	PAL-TYPE	PAL-TYPE
JESD-30 code	R-GDIP-T24	R-PDIP-T24	R-PDIP-T24	R-GDIP-T24	R-GDIP-T24	R-GDIP-T24
JESD-609 code	e0	e0	e0	e0	e0	e0
Dedicated input times	16	16	16	16	16	16
Number of entries	16	16	16	16	16	16
Output times	4	4	4	4	4	4
Number of product terms	32	32	32	32	32	32
Number of terminals	24	24	24	24	24	24
Maximum operating temperature	75 °C	75 °C	85 °C	85 °C	75 °C	85 °C
organize	16 DEDICATED INPUTS, 0 I/O	16 DEDICATED INPUTS, 0 I/O	16 DEDICATED INPUTS, 0 I/O	16 DEDICATED INPUTS, 0 I/O	16 DEDICATED INPUTS, 0 I/O	16 DEDICATED INPUTS, 0 I/O
Output function	COMBINATORIAL	COMBINATORIAL	COMBINATORIAL	COMBINATORIAL	COMBINATORIAL	COMBINATORIAL
Package body material	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED
encapsulated code	DIP	DIP	DIP	DIP	DIP	DIP
Encapsulate equivalent code	DIP24,.3	DIP24,.3	DIP24,.3	DIP24,.3	DIP24,.3	DIP24,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	-5.2 V	-5.2 V	-4.5 V	-4.5 V	-5.2 V	-4.5 V
Programmable logic type	OT PLD	OT PLD	OT PLD	OT PLD	OT PLD	OT PLD
propagation delay	3 ns	2.5 ns	2.5 ns	3 ns	2.5 ns	2.5 ns
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	5.715 mm	5.08 mm	5.08 mm	5.715 mm	5.715 mm	5.715 mm
surface mount	NO	NO	NO	NO	NO	NO
technology	ECL	ECL10K	ECL100K	ECL	ECL	ECL
Temperature level	COMMERCIAL EXTENDED	COMMERCIAL EXTENDED	OTHER	OTHER	COMMERCIAL EXTENDED	OTHER
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	7.62 mm	7.62 mm	7.62 mm	7.62 mm	7.62 mm	7.62 mm

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