SAB8086-1-P datasheet, PDF - EEWORLD Datasheet

SAB8086-1-P: DescriptionMicroprocessor, 16-Bit, 10MHz, NMOS, PDIP40, PLASTIC, DIP-40; CategoryThe embedded processor and controller Microcontrollers and processors; File Size813KB，37 Pages; ManufacturerInfineon; Websitehttp://www.infineon.com/

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SAB8086-1-P Overview

Microprocessor, 16-Bit, 10MHz, NMOS, PDIP40, PLASTIC, DIP-40

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Infineon
Parts packaging code	DIP
package instruction	PLASTIC, DIP-40
Contacts	40
Reach Compliance Code	not_compliant
Address bus width	20
bit size	16
boundary scan	NO
maximum clock frequency	10 MHz
External data bus width	16
Format	FIXED POINT
Integrated cache	NO
JESD-30 code	R-PDIP-T40
JESD-609 code	e0
length	50.9 mm
low power mode	NO
Number of terminals	40
Maximum operating temperature	70 °C
Minimum operating temperature
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP40,.6
Package shape	RECTANGULAR
Package form	IN-LINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Certification status	Not Qualified
Maximum seat height	5.1 mm
speed	10 MHz
Maximum slew rate	360 mA
Maximum supply voltage	5.25 V
Minimum supply voltage	4.75 V
Nominal supply voltage	5 V
surface mount	NO
technology	NMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	15.24 mm
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR

	SAB8086-1-P	SAB8086-2-P
Description	Microprocessor, 16-Bit, 10MHz, NMOS, PDIP40, PLASTIC, DIP-40	Microprocessor, 16-Bit, 8MHz, NMOS, PDIP40, PLASTIC, DIP-40
Is it Rohs certified?	incompatible	incompatible
Maker	Infineon	Infineon
Parts packaging code	DIP	DIP
package instruction	PLASTIC, DIP-40	PLASTIC, DIP-40
Contacts	40	40
Reach Compliance Code	not_compliant	not_compliant
Address bus width	20	20
bit size	16	16
boundary scan	NO	NO
maximum clock frequency	10 MHz	8 MHz
External data bus width	16	16
Format	FIXED POINT	FIXED POINT
Integrated cache	NO	NO
JESD-30 code	R-PDIP-T40	R-PDIP-T40
JESD-609 code	e0	e0
length	50.9 mm	50.9 mm
low power mode	NO	NO
Number of terminals	40	40
Maximum operating temperature	70 °C	70 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	DIP
Encapsulate equivalent code	DIP40,.6	DIP40,.6
Package shape	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED
power supply	5 V	5 V
Certification status	Not Qualified	Not Qualified
Maximum seat height	5.1 mm	5.1 mm
speed	10 MHz	8 MHz
Maximum slew rate	360 mA	350 mA
Maximum supply voltage	5.25 V	5.25 V
Minimum supply voltage	4.75 V	4.75 V
Nominal supply voltage	5 V	5 V
surface mount	NO	NO
technology	NMOS	NMOS
Temperature level	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED
width	15.24 mm	15.24 mm
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR	MICROPROCESSOR

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