Microprocessor, 16-Bit, 8MHz, NMOS, PDIP40, PLASTIC, DIP-40
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | Infineon |
Parts packaging code | DIP |
package instruction | PLASTIC, DIP-40 |
Contacts | 40 |
Reach Compliance Code | not_compliant |
Address bus width | 20 |
bit size | 16 |
boundary scan | NO |
maximum clock frequency | 8 MHz |
External data bus width | 16 |
Format | FIXED POINT |
Integrated cache | NO |
JESD-30 code | R-PDIP-T40 |
JESD-609 code | e0 |
length | 50.9 mm |
low power mode | NO |
Number of terminals | 40 |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
Package body material | PLASTIC/EPOXY |
encapsulated code | DIP |
Encapsulate equivalent code | DIP40,.6 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
power supply | 5 V |
Certification status | Not Qualified |
Maximum seat height | 5.1 mm |
speed | 8 MHz |
Maximum slew rate | 350 mA |
Maximum supply voltage | 5.25 V |
Minimum supply voltage | 4.75 V |
Nominal supply voltage | 5 V |
surface mount | NO |
technology | NMOS |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 15.24 mm |
uPs/uCs/peripheral integrated circuit type | MICROPROCESSOR |
SAB8086-2-P | SAB8086-1-P | |
---|---|---|
Description | Microprocessor, 16-Bit, 8MHz, NMOS, PDIP40, PLASTIC, DIP-40 | Microprocessor, 16-Bit, 10MHz, NMOS, PDIP40, PLASTIC, DIP-40 |
Is it Rohs certified? | incompatible | incompatible |
Maker | Infineon | Infineon |
Parts packaging code | DIP | DIP |
package instruction | PLASTIC, DIP-40 | PLASTIC, DIP-40 |
Contacts | 40 | 40 |
Reach Compliance Code | not_compliant | not_compliant |
Address bus width | 20 | 20 |
bit size | 16 | 16 |
boundary scan | NO | NO |
maximum clock frequency | 8 MHz | 10 MHz |
External data bus width | 16 | 16 |
Format | FIXED POINT | FIXED POINT |
Integrated cache | NO | NO |
JESD-30 code | R-PDIP-T40 | R-PDIP-T40 |
JESD-609 code | e0 | e0 |
length | 50.9 mm | 50.9 mm |
low power mode | NO | NO |
Number of terminals | 40 | 40 |
Maximum operating temperature | 70 °C | 70 °C |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | DIP | DIP |
Encapsulate equivalent code | DIP40,.6 | DIP40,.6 |
Package shape | RECTANGULAR | RECTANGULAR |
Package form | IN-LINE | IN-LINE |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED |
power supply | 5 V | 5 V |
Certification status | Not Qualified | Not Qualified |
Maximum seat height | 5.1 mm | 5.1 mm |
speed | 8 MHz | 10 MHz |
Maximum slew rate | 350 mA | 360 mA |
Maximum supply voltage | 5.25 V | 5.25 V |
Minimum supply voltage | 4.75 V | 4.75 V |
Nominal supply voltage | 5 V | 5 V |
surface mount | NO | NO |
technology | NMOS | NMOS |
Temperature level | COMMERCIAL | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE | THROUGH-HOLE |
Terminal pitch | 2.54 mm | 2.54 mm |
Terminal location | DUAL | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED |
width | 15.24 mm | 15.24 mm |
uPs/uCs/peripheral integrated circuit type | MICROPROCESSOR | MICROPROCESSOR |