WE128K32N-300HQ datasheet, PDF

WE128K32N-300HQ: DescriptionEEPROM Module, 512KX8, 300ns, Parallel, CMOS, CPGA66, 1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP-66; Categorystorage storage; File Size262KB，11 Pages; ManufacturerMicrosemi; Websitehttps://www.microsemi.com

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WE128K32N-300HQ Overview

EEPROM Module, 512KX8, 300ns, Parallel, CMOS, CPGA66, 1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP-66

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	Microsemi
Objectid	1820317045
Parts packaging code	PGA
package instruction	PGA,
Contacts	66
Reach Compliance Code	compliant
ECCN code	3A001.A.2.C
compound_id	6325940
Maximum access time	300 ns
Other features	CONFIGURABLE AS 128K X 32; AUTOMATIC WRITE
Spare memory width	16
JESD-30 code	S-CPGA-P66
length	30.1 mm
memory density	4194304 bit
Memory IC Type	EEPROM MODULE
memory width	8
Number of functions	1
Number of terminals	66
word count	524288 words
character code	512000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	512KX8
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	PGA
Package shape	SQUARE
Package form	GRID ARRAY
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Programming voltage	5 V
Certification status	Not Qualified
Maximum seat height	6.22 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal form	PIN/PEG
Terminal pitch	2.54 mm
Terminal location	PERPENDICULAR
Maximum time at peak reflow temperature	NOT SPECIFIED
width	30.1 mm

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