EEWORLDEEWORLDEEWORLD

Part Number

Search

KMM5338100AKVG-8

Description
Fast Page DRAM Module, 8MX33, 80ns, CMOS, SIMM-72
Categorystorage    storage   
File Size169KB,6 Pages
ManufacturerSAMSUNG
Websitehttp://www.samsung.com/Products/Semiconductor/
Download Datasheet Parametric Compare View All

KMM5338100AKVG-8 Overview

Fast Page DRAM Module, 8MX33, 80ns, CMOS, SIMM-72

KMM5338100AKVG-8 Parametric

Parameter NameAttribute value
MakerSAMSUNG
Parts packaging codeSIMM
package instruction,
Contacts72
Reach Compliance Codeunknown
ECCN codeEAR99
access modeFAST PAGE
Maximum access time80 ns
Other featuresRAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
Spare memory width16
JESD-30 codeR-XSMA-N72
memory density276824064 bit
Memory IC TypeFAST PAGE DRAM MODULE
memory width33
Number of functions1
Number of ports1
Number of terminals72
word count8388608 words
character code8000000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize8MX33
Output characteristics3-STATE
Package body materialUNSPECIFIED
Package shapeRECTANGULAR
Package formMICROELECTRONIC ASSEMBLY
Certification statusNot Qualified
refresh cycle2048
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formNO LEAD
Terminal locationSINGLE

KMM5338100AKVG-8 Related Products

KMM5338100AKVG-8 KMM5338100AKV-6 KMM5338100AKVG-5 KMM5338100AKVG-7 KMM5338100AKV-8 KMM5338100AKVG-6 KMM5338100AKV-5 KMM5338100AKV-7
Description Fast Page DRAM Module, 8MX33, 80ns, CMOS, SIMM-72 Fast Page DRAM Module, 8MX33, 60ns, CMOS, SIMM-72 Fast Page DRAM Module, 8MX33, 50ns, CMOS, SIMM-72 Fast Page DRAM Module, 8MX33, 70ns, CMOS, SIMM-72 Fast Page DRAM Module, 8MX33, 80ns, CMOS, SIMM-72 Fast Page DRAM Module, 8MX33, 60ns, CMOS, SIMM-72 Fast Page DRAM Module, 8MX33, 50ns, CMOS, SIMM-72 Fast Page DRAM Module, 8MX33, 70ns, CMOS, SIMM-72
Maker SAMSUNG SAMSUNG SAMSUNG SAMSUNG SAMSUNG SAMSUNG SAMSUNG SAMSUNG
Parts packaging code SIMM SIMM SIMM SIMM SIMM SIMM SIMM SIMM
Contacts 72 72 72 72 72 72 72 72
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknow
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
access mode FAST PAGE FAST PAGE FAST PAGE FAST PAGE FAST PAGE FAST PAGE FAST PAGE FAST PAGE
Maximum access time 80 ns 60 ns 50 ns 70 ns 80 ns 60 ns 50 ns 70 ns
Other features RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
Spare memory width 16 16 16 16 16 16 16 16
JESD-30 code R-XSMA-N72 R-XSMA-N72 R-XSMA-N72 R-XSMA-N72 R-XSMA-N72 R-XSMA-N72 R-XSMA-N72 R-XSMA-N72
memory density 276824064 bit 276824064 bit 276824064 bit 276824064 bit 276824064 bit 276824064 bit 276824064 bit 276824064 bi
Memory IC Type FAST PAGE DRAM MODULE FAST PAGE DRAM MODULE FAST PAGE DRAM MODULE FAST PAGE DRAM MODULE FAST PAGE DRAM MODULE FAST PAGE DRAM MODULE FAST PAGE DRAM MODULE FAST PAGE DRAM MODULE
memory width 33 33 33 33 33 33 33 33
Number of functions 1 1 1 1 1 1 1 1
Number of ports 1 1 1 1 1 1 1 1
Number of terminals 72 72 72 72 72 72 72 72
word count 8388608 words 8388608 words 8388608 words 8388608 words 8388608 words 8388608 words 8388608 words 8388608 words
character code 8000000 8000000 8000000 8000000 8000000 8000000 8000000 8000000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
organize 8MX33 8MX33 8MX33 8MX33 8MX33 8MX33 8MX33 8MX33
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Package body material UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
refresh cycle 2048 2048 2048 2048 2048 2048 2048 2048
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount NO NO NO NO NO NO NO NO
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal form NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD
Terminal location SINGLE SINGLE SINGLE SINGLE SINGLE SINGLE SINGLE SINGLE
Digital Temperature Sensors
describe With the Wireless Patient Temperature Application Note, use the temperature sensing evaluation board to provide up to ±0.1°C accuracy. Reference Design Design Difficulties of Wireless Patient...
Jacktang Microcontroller MCU
PCB experience (spent many years to compile in the forum) Download it if needed
PCB experience (spent many years compiling on the forum) Hahaha, good stuff, maybe someone needs it?...
捷配pcb打样快 PCB Design
[Fudan Micro FM33LC046N Review] + Unboxing
First of all, I would like to thank EEWORLD platform and Fudan Micro for giving me this evaluation opportunity When I got the board a few years ago, I downloaded the documentation and routines for the...
叫我阿深就好 Domestic Chip Exchange
[GD32E231 DIY Contest] 1. Good emulator
[i=s]This post was last edited by ddllxxrr on 2019-5-3 09:33[/i] Today, I had some time to start tinkering at home. I thought I had to install the emulation driver, but when I plugged it in, it told m...
ddllxxrr GD32 MCU
Follow TI's high voltage technology experts to learn about the advantages of capacitive isolation technology!
Texas Instruments' reinforced isolation technology is achieved by connecting a thick silicon dioxide capacitor bank in series. Each channel uses high voltage isolation capacitors on both dies. [align=...
alan000345 TI Technology Forum
New driver MM32F103 test (VIII) I2C
[size=3] Today I learned how to use the I2C module in the routine. I couldn't find a ready-made AT24Cxx module, so I found a PCF8574T module that I had made with a perforated board before, so I used i...
lising Motor Drive Control(Motor Control)

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号