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S29CD016J0MFFI123

Description
Flash, 512KX32, 54ns, PBGA80, 13 X 11 MM, 1 MM PITCH, LEAD FREE, FORTIFIED, BGA-80
Categorystorage    storage   
File Size932KB,81 Pages
ManufacturerSPANSION
Websitehttp://www.spansion.com/
Environmental Compliance  
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S29CD016J0MFFI123 Overview

Flash, 512KX32, 54ns, PBGA80, 13 X 11 MM, 1 MM PITCH, LEAD FREE, FORTIFIED, BGA-80

S29CD016J0MFFI123 Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerSPANSION
Parts packaging codeBGA
package instructionLBGA, BGA80,8X10,40
Contacts80
Reach Compliance Codeunknown
ECCN codeEAR99
Maximum access time54 ns
Other featuresSYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; TOP BOOT BLOCK
startup blockTOP
command user interfaceYES
Universal Flash InterfaceYES
Data pollingYES
JESD-30 codeR-PBGA-B80
JESD-609 codee1
length13 mm
memory density16777216 bit
Memory IC TypeFLASH
memory width32
Humidity sensitivity level3
Number of functions1
Number of departments/size16,30
Number of terminals80
word count524288 words
character code512000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize512KX32
Package body materialPLASTIC/EPOXY
encapsulated codeLBGA
Encapsulate equivalent codeBGA80,8X10,40
Package shapeRECTANGULAR
Package formGRID ARRAY, LOW PROFILE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)260
power supply1.8/2.6,2.6 V
Programming voltage2.7 V
Certification statusNot Qualified
ready/busyYES
Maximum seat height1.4 mm
Department size2K,16K
Maximum standby current0.00006 A
Maximum slew rate0.09 mA
Maximum supply voltage (Vsup)2.75 V
Minimum supply voltage (Vsup)2.5 V
Nominal supply voltage (Vsup)2.6 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature40
switch bitYES
typeNOR TYPE
width11 mm
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