Decade Counter, Synchronous, Up Direction, CMOS, PDIP16
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | RCA |
package instruction | DIP, DIP16,.3 |
Reach Compliance Code | unknown |
Counting direction | UP |
JESD-30 code | R-PDIP-T16 |
JESD-609 code | e0 |
Load/preset input | YES |
Logic integrated circuit type | DECADE COUNTER |
Operating mode | SYNCHRONOUS |
Number of functions | 1 |
Number of terminals | 16 |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
Package body material | PLASTIC/EPOXY |
encapsulated code | DIP |
Encapsulate equivalent code | DIP16,.3 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
surface mount | NO |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
CD4018AEX | CD4018AD/3 | CD4018AFX | CD4018AF/3 | CD4018AK/3 | |
---|---|---|---|---|---|
Description | Decade Counter, Synchronous, Up Direction, CMOS, PDIP16 | Decade Counter, Synchronous, Up Direction, CMOS, CDIP16 | Decade Counter, Synchronous, Up Direction, CMOS, CDIP16 | Decade Counter, Synchronous, Up Direction, CMOS, CDIP16 | Decade Counter, Synchronous, Up Direction, CMOS, CDFP16 |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible |
package instruction | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DFP, FL16,.3 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
Counting direction | UP | UP | UP | UP | UP |
JESD-30 code | R-PDIP-T16 | R-XDIP-T16 | R-XDIP-T16 | R-XDIP-T16 | R-XDFP-F16 |
JESD-609 code | e0 | e0 | e0 | e0 | e0 |
Load/preset input | YES | YES | YES | YES | YES |
Logic integrated circuit type | DECADE COUNTER | DECADE COUNTER | DECADE COUNTER | DECADE COUNTER | DECADE COUNTER |
Operating mode | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
Number of functions | 1 | 1 | 1 | 1 | 1 |
Number of terminals | 16 | 16 | 16 | 16 | 16 |
Maximum operating temperature | 85 °C | 125 °C | 125 °C | 125 °C | 125 °C |
Minimum operating temperature | -40 °C | -55 °C | -55 °C | -55 °C | -55 °C |
Package body material | PLASTIC/EPOXY | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
encapsulated code | DIP | DIP | DIP | DIP | DFP |
Encapsulate equivalent code | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | FL16,.3 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE | FLATPACK |
surface mount | NO | NO | NO | NO | YES |
technology | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | INDUSTRIAL | MILITARY | MILITARY | MILITARY | MILITARY |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | FLAT |
Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm |
Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL |
Maker | RCA | RCA | RCA | RCA | - |
Certification status | - | Not Qualified | - | Not Qualified | Not Qualified |
Filter level | - | MIL-STD-883 Class B (Modified) | - | MIL-STD-883 Class B (Modified) | MIL-STD-883 Class B (Modified) |