RISC Microprocessor, 32-Bit, 400MHz, CMOS, PBGA256, 27 X 27 MM, LEAD FREE, PLASTIC, BGA-256
Parameter Name | Attribute value |
Is it lead-free? | Lead free |
Is it Rohs certified? | conform to |
Maker | IBM |
Parts packaging code | BGA |
package instruction | LBGA, BGA256,20X20,50 |
Contacts | 256 |
Reach Compliance Code | unknown |
ECCN code | 3A001.A.3 |
Address bus width | 32 |
bit size | 32 |
boundary scan | YES |
maximum clock frequency | 133 MHz |
External data bus width | 64 |
Format | FLOATING POINT |
Integrated cache | YES |
JESD-30 code | S-PBGA-B256 |
length | 27 mm |
low power mode | YES |
Humidity sensitivity level | 3 |
Number of terminals | 256 |
Package body material | PLASTIC/EPOXY |
encapsulated code | LBGA |
Encapsulate equivalent code | BGA256,20X20,50 |
Package shape | SQUARE |
Package form | GRID ARRAY, LOW PROFILE |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
power supply | 1.8/2.5,1.85 V |
Certification status | Not Qualified |
Maximum seat height | 1.666 mm |
speed | 400 MHz |
Maximum supply voltage | 1.9 V |
Minimum supply voltage | 1.8 V |
Nominal supply voltage | 1.85 V |
surface mount | YES |
technology | CMOS |
Terminal form | BALL |
Terminal pitch | 1.27 mm |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 27 mm |
uPs/uCs/peripheral integrated circuit type | MICROPROCESSOR, RISC |
IBM25PPC750CXRKQ2024T | IBM25PPC750CXRKQ4024T | IBM25PPC750CXRKQ0124T | IBM25PPC750CXRKQ0324T | IBM25PPC750CXRKQ5024T | IBM25PPC750CXRKQ5524T | IBM25PPC750CXRKQ1024T | |
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Description | RISC Microprocessor, 32-Bit, 400MHz, CMOS, PBGA256, 27 X 27 MM, LEAD FREE, PLASTIC, BGA-256 | RISC Microprocessor, 32-Bit, 466MHz, CMOS, PBGA256, 27 X 27 MM, LEAD FREE, PLASTIC, BGA-256 | RISC Microprocessor, 32-Bit, 333MHz, CMOS, PBGA256, 27 X 27 MM, LEAD FREE, PLASTIC, BGA-256 | RISC Microprocessor, 32-Bit, 333MHz, CMOS, PBGA256, 27 X 27 MM, LEAD FREE, PLASTIC, BGA-256 | RISC Microprocessor, 32-Bit, 500MHz, CMOS, PBGA256, 27 X 27 MM, LEAD FREE, PLASTIC, BGA-256 | RISC Microprocessor, 32-Bit, 533MHz, CMOS, PBGA256, 27 X 27 MM, LEAD FREE, PLASTIC, BGA-256 | RISC Microprocessor, 32-Bit, 366MHz, CMOS, PBGA256, 27 X 27 MM, LEAD FREE, PLASTIC, BGA-256 |
Is it Rohs certified? | conform to | conform to | conform to | conform to | conform to | conform to | conform to |
Parts packaging code | BGA | BGA | BGA | BGA | BGA | BGA | BGA |
package instruction | LBGA, BGA256,20X20,50 | LBGA, BGA256,20X20,50 | LBGA, BGA256,20X20,50 | LBGA, BGA256,20X20,50 | LBGA, BGA256,20X20,50 | LBGA, BGA256,20X20,50 | LBGA, BGA256,20X20,50 |
Contacts | 256 | 256 | 256 | 256 | 256 | 256 | 256 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknow |
ECCN code | 3A001.A.3 | 3A001.A.3 | 3A001.A.3 | 3A001.A.3 | 3A001.A.3 | 3A001.A.3 | 3A001.A.3 |
Address bus width | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
bit size | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
boundary scan | YES | YES | YES | YES | YES | YES | YES |
maximum clock frequency | 133 MHz | 133 MHz | 133 MHz | 133 MHz | 133 MHz | 133 MHz | 133 MHz |
External data bus width | 64 | 64 | 64 | 64 | 64 | 64 | 64 |
Format | FLOATING POINT | FLOATING POINT | FLOATING POINT | FLOATING POINT | FLOATING POINT | FLOATING POINT | FLOATING POINT |
Integrated cache | YES | YES | YES | YES | YES | YES | YES |
JESD-30 code | S-PBGA-B256 | S-PBGA-B256 | S-PBGA-B256 | S-PBGA-B256 | S-PBGA-B256 | S-PBGA-B256 | S-PBGA-B256 |
length | 27 mm | 27 mm | 27 mm | 27 mm | 27 mm | 27 mm | 27 mm |
low power mode | YES | YES | YES | YES | YES | YES | YES |
Number of terminals | 256 | 256 | 256 | 256 | 256 | 256 | 256 |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | LBGA | LBGA | LBGA | LBGA | LBGA | LBGA | LBGA |
Encapsulate equivalent code | BGA256,20X20,50 | BGA256,20X20,50 | BGA256,20X20,50 | BGA256,20X20,50 | BGA256,20X20,50 | BGA256,20X20,50 | BGA256,20X20,50 |
Package shape | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
Package form | GRID ARRAY, LOW PROFILE | GRID ARRAY, LOW PROFILE | GRID ARRAY, LOW PROFILE | GRID ARRAY, LOW PROFILE | GRID ARRAY, LOW PROFILE | GRID ARRAY, LOW PROFILE | GRID ARRAY, LOW PROFILE |
power supply | 1.8/2.5,1.85 V | 1.8/2.5,1.85 V | 1.8/2.5,1.85 V | 1.8/2.5,1.85 V | 1.8/2.5,1.9 V | 1.8/2.5,1.9 V | 1.8/2.5,1.85 V |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum seat height | 1.666 mm | 1.666 mm | 1.666 mm | 1.666 mm | 1.666 mm | 1.666 mm | 1.666 mm |
speed | 400 MHz | 466 MHz | 333 MHz | 333 MHz | 500 MHz | 533 MHz | 366 MHz |
Maximum supply voltage | 1.9 V | 1.9 V | 1.9 V | 1.9 V | 1.95 V | 1.95 V | 1.9 V |
Minimum supply voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.85 V | 1.85 V | 1.8 V |
Nominal supply voltage | 1.85 V | 1.85 V | 1.85 V | 1.85 V | 1.9 V | 1.9 V | 1.85 V |
surface mount | YES | YES | YES | YES | YES | YES | YES |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Terminal form | BALL | BALL | BALL | BALL | BALL | BALL | BALL |
Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
Terminal location | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
width | 27 mm | 27 mm | 27 mm | 27 mm | 27 mm | 27 mm | 27 mm |
uPs/uCs/peripheral integrated circuit type | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC |
Is it lead-free? | Lead free | - | Lead free | Lead free | - | Lead free | Lead free |
Maker | IBM | IBM | IBM | IBM | IBM | - | IBM |
Humidity sensitivity level | 3 | 3 | 3 | 3 | - | 3 | 3 |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED |
Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED |
Base Number Matches | - | 1 | 1 | 1 | 1 | 1 | - |