SRAM Module, 2MX8, 85ns, CMOS, SIP-36
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | White Electronic Designs Corporation |
Objectid | 1908473689 |
package instruction | SIP-36 |
Reach Compliance Code | unknown |
compound_id | 294319016 |
Maximum access time | 85 ns |
JESD-30 code | R-XSMA-T36 |
memory density | 16777216 bit |
Memory IC Type | SRAM MODULE |
memory width | 8 |
Number of functions | 1 |
Number of terminals | 36 |
word count | 2097152 words |
character code | 2000000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
organize | 2MX8 |
Package body material | UNSPECIFIED |
Package shape | RECTANGULAR |
Package form | MICROELECTRONIC ASSEMBLY |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
Certification status | Not Qualified |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal form | THROUGH-HOLE |
Terminal location | SINGLE |
Maximum time at peak reflow temperature | NOT SPECIFIED |
EDI8F82048C85BSI | EDI8F82048C100BSC | EDI8F82048C70BSI | EDI8F82048C85BSC | EDI8F82048LP85BSI | EDI8F82048LP100BSC | EDI8F82048LP85BSC | EDI8F82048LP70BSI | EDI8F82048LP100BSI | |
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Description | SRAM Module, 2MX8, 85ns, CMOS, SIP-36 | SRAM Module, 2MX8, 100ns, CMOS, SIP-36 | SRAM Module, 2MX8, 70ns, CMOS, SIP-36 | SRAM Module, 2MX8, 85ns, CMOS, SIP-36 | SRAM Module, 2MX8, 85ns, CMOS, SIP-36 | SRAM Module, 2MX8, 100ns, CMOS, SIP-36 | SRAM Module, 2MX8, 85ns, CMOS, SIP-36 | SRAM Module, 2MX8, 70ns, CMOS, SIP-36 | SRAM Module, 2MX8, 100ns, CMOS, SIP-36 |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
package instruction | SIP-36 | SIP-36 | SIP-36 | SIP-36 | SIP-36 | SIP-36 | SIP-36 | SIP-36 | SIP-36 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
Maximum access time | 85 ns | 100 ns | 70 ns | 85 ns | 85 ns | 100 ns | 85 ns | 70 ns | 100 ns |
JESD-30 code | R-XSMA-T36 | R-XSMA-T36 | R-XSMA-T36 | R-XSMA-T36 | R-XSMA-T36 | R-XSMA-T36 | R-XSMA-T36 | R-XSMA-T36 | R-XSMA-T36 |
memory density | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bit |
Memory IC Type | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE |
memory width | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
Number of terminals | 36 | 36 | 36 | 36 | 36 | 36 | 36 | 36 | 36 |
word count | 2097152 words | 2097152 words | 2097152 words | 2097152 words | 2097152 words | 2097152 words | 2097152 words | 2097152 words | 2097152 words |
character code | 2000000 | 2000000 | 2000000 | 2000000 | 2000000 | 2000000 | 2000000 | 2000000 | 2000000 |
Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
Maximum operating temperature | 85 °C | 70 °C | 85 °C | 70 °C | 85 °C | 70 °C | 70 °C | 85 °C | 85 °C |
Minimum operating temperature | -40 °C | - | -40 °C | - | -40 °C | - | - | -40 °C | -40 °C |
organize | 2MX8 | 2MX8 | 2MX8 | 2MX8 | 2MX8 | 2MX8 | 2MX8 | 2MX8 | 2MX8 |
Package body material | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
surface mount | NO | NO | NO | NO | NO | NO | NO | NO | NO |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL |
Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
Terminal location | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE |
Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
Maker | White Electronic Designs Corporation | - | - | White Electronic Designs Corporation | - | White Electronic Designs Corporation | White Electronic Designs Corporation | White Electronic Designs Corporation | White Electronic Designs Corporation |