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MPC8568VTANGGA

Description
32-BIT, 800MHz, RISC PROCESSOR, PBGA1023, 33 X 33 MM, 2.75 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, FCPBGA-1023
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size2MB,139 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
Download Datasheet Parametric View All

MPC8568VTANGGA Overview

32-BIT, 800MHz, RISC PROCESSOR, PBGA1023, 33 X 33 MM, 2.75 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, FCPBGA-1023

MPC8568VTANGGA Parametric

Parameter NameAttribute value
MakerNXP
Parts packaging codeBGA
package instructionBGA,
Contacts1023
Reach Compliance Codeunknown
ECCN code3A001.A.3
Address bus width
bit size32
boundary scanYES
maximum clock frequency166 MHz
External data bus width
FormatFLOATING POINT
Integrated cacheYES
JESD-30 codeS-PBGA-B1023
JESD-609 codee2
length33 mm
low power modeYES
Number of terminals1023
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Package shapeSQUARE
Package formGRID ARRAY
Certification statusNot Qualified
Maximum seat height2.75 mm
speed800 MHz
Maximum supply voltage1.155 V
Minimum supply voltage1.045 V
Nominal supply voltage1.1 V
surface mountYES
technologyCMOS
Terminal surfaceTIN SILVER
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
width33 mm
uPs/uCs/peripheral integrated circuit typeMICROPROCESSOR, RISC
Freescale Semiconductor
Technical Data
Document Number: MPC8568EEC
Rev. 1, 10/2010
MPC8568E/MPC8567E
PowerQUICC III
Integrated Processor
Hardware Specifications
Due to feature similarities, this document covers both the
MPC8568E and MPC8567E features. For simplicity,
MPC8568 may only be mentioned throughout the document.
The MPC8567E feature differences are as follows:
• The MPC8567E PCI-Express supports x1/x2/x4, but
does not have x8 support.
• Does not have eTSEC1, eTSEC2, or TLU
Note that both the MPC8568E and MPC8567E have their
own pin assignment tables.
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Contents
MPC8568E Overview . . . . . . . . . . . . . . . . . . . . . . . . . 2
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . 10
Power Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 14
Input Clocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
RESET Initialization . . . . . . . . . . . . . . . . . . . . . . . . . 18
DDR and DDR2 SDRAM . . . . . . . . . . . . . . . . . . . . . 18
DUART . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Ethernet Interface and MII Management . . . . . . . . . . 26
Local Bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
JTAG . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
I
2
C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
PCI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
High-Speed Serial Interfaces (HSSI) . . . . . . . . . . . . . 61
PCI Express . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70
Serial RapidIO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78
Timers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89
PIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90
SPI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91
TDM/SI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92
UTOPIA/POS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94
HDLC, BISYNC, Transparent and
Synchronous UART . . . . . . . . . . . . . . . . . . . . . . . . . . 96
Package and Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . 99
Clocking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 121
Thermal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 125
System Design Information . . . . . . . . . . . . . . . . . . . 130
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . 136
Document Revision History . . . . . . . . . . . . . . . . . . 138
© 2010 Freescale Semiconductor, Inc. All rights reserved.
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