MR256A08BCMA35R datasheet, PDF

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MR256A08BCMA35R: DescriptionMemory Circuit, 32KX8, CMOS, PBGA48, FBGA-48; Categorystorage storage; File Size1MB，24 Pages; ManufacturerEverspin Technologies; Environmental Compliance

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MR256A08BCMA35R Overview

Memory Circuit, 32KX8, CMOS, PBGA48, FBGA-48

MR256A08BCMA35R Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	Everspin Technologies
Parts packaging code	BGA
package instruction	LFBGA, BGA48,6X8,30
Contacts	48
Reach Compliance Code	compliant
ECCN code	EAR99
Maximum access time	35 ns
JESD-30 code	S-PBGA-B48
length	8 mm
memory density	262144 bit
Memory IC Type	MEMORY CIRCUIT
memory width	8
Mixed memory types	N/A
Humidity sensitivity level	3
Number of functions	1
Number of terminals	48
word count	32768 words
character code	32000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	32KX8
Package body material	PLASTIC/EPOXY
encapsulated code	LFBGA
Encapsulate equivalent code	BGA48,6X8,30
Package shape	SQUARE
Package form	GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	260
power supply	3.3 V
Certification status	Not Qualified
Maximum seat height	1.35 mm
Maximum standby current	0.007 A
Maximum slew rate	0.065 mA
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	3 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	BALL
Terminal pitch	0.75 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	40
width	8 mm

MR256A08BCMA35R Related Products

	MR256A08BCMA35R	MR256A08BSO35	MR256A08BYS35	MR256A08BYS35R	MR256A08BCSO35	MR256A08BCYS35
Description	Memory Circuit, 32KX8, CMOS, PBGA48, FBGA-48	Memory Circuit, 32KX8, CMOS, PDSO32, SOIC-32	Memory Circuit, 32KX8, CMOS, PDSO44, TSOP2-44	Memory Circuit, 32KX8, CMOS, PDSO44, TSOP2-44	Memory Circuit, 32KX8, CMOS, PDSO32, SOIC-32	Memory Circuit, 32KX8, CMOS, PDSO44, TSOP2-44
Is it Rohs certified?	conform to	conform to	conform to	conform to	conform to	conform to
Maker	Everspin Technologies	Everspin Technologies	Everspin Technologies	Everspin Technologies	Everspin Technologies	Everspin Technologies
Parts packaging code	BGA	SOIC	TSOP2	TSOP2	SOIC	TSOP2
package instruction	LFBGA, BGA48,6X8,30	SOP, SOP32,.4	TSOP2, TSOP44,.46,32	TSOP2, TSOP44,.46,32	SOP, SOP32,.4	TSOP2, TSOP44,.46,32
Contacts	48	32	44	44	32	44
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	compliant
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Maximum access time	35 ns	35 ns	35 ns	35 ns	35 ns	35 ns
JESD-30 code	S-PBGA-B48	R-PDSO-G32	R-PDSO-G44	R-PDSO-G44	R-PDSO-G32	R-PDSO-G44
length	8 mm	20.726 mm	18.41 mm	18.41 mm	20.726 mm	18.41 mm
memory density	262144 bit	262144 bit	262144 bit	262144 bit	262144 bit	262144 bit
Memory IC Type	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT
memory width	8	8	8	8	8	8
Mixed memory types	N/A	N/A	N/A	N/A	N/A	N/A
Number of functions	1	1	1	1	1	1
Number of terminals	48	32	44	44	32	44
word count	32768 words	32768 words	32768 words	32768 words	32768 words	32768 words
character code	32000	32000	32000	32000	32000	32000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	85 °C	70 °C	70 °C	70 °C	85 °C	85 °C
organize	32KX8	32KX8	32KX8	32KX8	32KX8	32KX8
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	LFBGA	SOP	TSOP2	TSOP2	SOP	TSOP2
Encapsulate equivalent code	BGA48,6X8,30	SOP32,.4	TSOP44,.46,32	TSOP44,.46,32	SOP32,.4	TSOP44,.46,32
Package shape	SQUARE	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	GRID ARRAY, LOW PROFILE, FINE PITCH	SMALL OUTLINE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE	SMALL OUTLINE, THIN PROFILE
Peak Reflow Temperature (Celsius)	260	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1.35 mm	2.54 mm	1.2 mm	1.2 mm	2.54 mm	1.2 mm
Maximum standby current	0.007 A	0.007 A	0.007 A	0.007 A	0.007 A	0.007 A
Maximum slew rate	0.065 mA	0.065 mA	0.065 mA	0.065 mA	0.075 mA	0.065 mA
Maximum supply voltage (Vsup)	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
Minimum supply voltage (Vsup)	3 V	3 V	3 V	3 V	3 V	3 V
Nominal supply voltage (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
surface mount	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	BALL	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING
Terminal pitch	0.75 mm	1.25 mm	0.8 mm	0.8 mm	1.25 mm	0.8 mm
Terminal location	BOTTOM	DUAL	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	40	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	8 mm	7.505 mm	10.16 mm	10.16 mm	7.505 mm	10.16 mm

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