Memory Circuit, 32KX8, CMOS, PDSO44, TSOP2-44
| Parameter Name | Attribute value |
| Is it Rohs certified? | conform to |
| Maker | Everspin Technologies |
| Parts packaging code | TSOP2 |
| package instruction | TSOP2, TSOP44,.46,32 |
| Contacts | 44 |
| Reach Compliance Code | compliant |
| ECCN code | EAR99 |
| Maximum access time | 35 ns |
| JESD-30 code | R-PDSO-G44 |
| length | 18.41 mm |
| memory density | 262144 bit |
| Memory IC Type | MEMORY CIRCUIT |
| memory width | 8 |
| Mixed memory types | N/A |
| Number of functions | 1 |
| Number of terminals | 44 |
| word count | 32768 words |
| character code | 32000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 32KX8 |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | TSOP2 |
| Encapsulate equivalent code | TSOP44,.46,32 |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE, THIN PROFILE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 3.3 V |
| Certification status | Not Qualified |
| Maximum seat height | 1.2 mm |
| Maximum standby current | 0.007 A |
| Maximum slew rate | 0.065 mA |
| Maximum supply voltage (Vsup) | 3.6 V |
| Minimum supply voltage (Vsup) | 3 V |
| Nominal supply voltage (Vsup) | 3.3 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal form | GULL WING |
| Terminal pitch | 0.8 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 10.16 mm |
| MR256A08BYS35R | MR256A08BSO35 | MR256A08BYS35 | MR256A08BCSO35 | MR256A08BCMA35R | MR256A08BCYS35 | |
|---|---|---|---|---|---|---|
| Description | Memory Circuit, 32KX8, CMOS, PDSO44, TSOP2-44 | Memory Circuit, 32KX8, CMOS, PDSO32, SOIC-32 | Memory Circuit, 32KX8, CMOS, PDSO44, TSOP2-44 | Memory Circuit, 32KX8, CMOS, PDSO32, SOIC-32 | Memory Circuit, 32KX8, CMOS, PBGA48, FBGA-48 | Memory Circuit, 32KX8, CMOS, PDSO44, TSOP2-44 |
| Is it Rohs certified? | conform to | conform to | conform to | conform to | conform to | conform to |
| Maker | Everspin Technologies | Everspin Technologies | Everspin Technologies | Everspin Technologies | Everspin Technologies | Everspin Technologies |
| Parts packaging code | TSOP2 | SOIC | TSOP2 | SOIC | BGA | TSOP2 |
| package instruction | TSOP2, TSOP44,.46,32 | SOP, SOP32,.4 | TSOP2, TSOP44,.46,32 | SOP, SOP32,.4 | LFBGA, BGA48,6X8,30 | TSOP2, TSOP44,.46,32 |
| Contacts | 44 | 32 | 44 | 32 | 48 | 44 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| Maximum access time | 35 ns | 35 ns | 35 ns | 35 ns | 35 ns | 35 ns |
| JESD-30 code | R-PDSO-G44 | R-PDSO-G32 | R-PDSO-G44 | R-PDSO-G32 | S-PBGA-B48 | R-PDSO-G44 |
| length | 18.41 mm | 20.726 mm | 18.41 mm | 20.726 mm | 8 mm | 18.41 mm |
| memory density | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit |
| Memory IC Type | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT |
| memory width | 8 | 8 | 8 | 8 | 8 | 8 |
| Mixed memory types | N/A | N/A | N/A | N/A | N/A | N/A |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 44 | 32 | 44 | 32 | 48 | 44 |
| word count | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words |
| character code | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 85 °C | 85 °C | 85 °C |
| organize | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | TSOP2 | SOP | TSOP2 | SOP | LFBGA | TSOP2 |
| Encapsulate equivalent code | TSOP44,.46,32 | SOP32,.4 | TSOP44,.46,32 | SOP32,.4 | BGA48,6X8,30 | TSOP44,.46,32 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR |
| Package form | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE | GRID ARRAY, LOW PROFILE, FINE PITCH | SMALL OUTLINE, THIN PROFILE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | 260 | NOT SPECIFIED |
| power supply | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 1.2 mm | 2.54 mm | 1.2 mm | 2.54 mm | 1.35 mm | 1.2 mm |
| Maximum standby current | 0.007 A | 0.007 A | 0.007 A | 0.007 A | 0.007 A | 0.007 A |
| Maximum slew rate | 0.065 mA | 0.065 mA | 0.065 mA | 0.075 mA | 0.065 mA | 0.065 mA |
| Maximum supply voltage (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| Minimum supply voltage (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
| Nominal supply voltage (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| surface mount | YES | YES | YES | YES | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| Terminal form | GULL WING | GULL WING | GULL WING | GULL WING | BALL | GULL WING |
| Terminal pitch | 0.8 mm | 1.25 mm | 0.8 mm | 1.25 mm | 0.75 mm | 0.8 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | BOTTOM | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | 40 | NOT SPECIFIED |
| width | 10.16 mm | 7.505 mm | 10.16 mm | 7.505 mm | 8 mm | 10.16 mm |
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