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SMBG5941B

Description
Zener Diode, 47V V(Z), 5%, 1.25W, Silicon, Unidirectional, DO-215AA, PLASTIC, SMBG, 2 PIN
CategoryDiscrete semiconductor    diode   
File Size172KB,3 Pages
ManufacturerMicrosemi
Websitehttps://www.microsemi.com
Download Datasheet Parametric View All

SMBG5941B Overview

Zener Diode, 47V V(Z), 5%, 1.25W, Silicon, Unidirectional, DO-215AA, PLASTIC, SMBG, 2 PIN

SMBG5941B Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerMicrosemi
package instructionR-PDSO-G2
Reach Compliance Codeunknown
ECCN codeEAR99
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeZENER DIODE
JEDEC-95 codeDO-215AA
JESD-30 codeR-PDSO-G2
JESD-609 codee0
Humidity sensitivity level1
Number of components1
Number of terminals2
Maximum operating temperature150 °C
Minimum operating temperature-65 °C
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
polarityUNIDIRECTIONAL
Maximum power dissipation1.25 W
Nominal reference voltage47 V
surface mountYES
technologyZENER
Terminal surfaceTIN LEAD
Terminal formGULL WING
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
Maximum voltage tolerance5%
Working test current8 mA
SMBG5913 thru SMBG5956B
SMBJ5913 thru SMBJ5956B
SILICON 3.0 Watt ZENER DIODES
SCOTTSDALE DIVISION
DESCRIPTION
The SMBJ5913-5956B or SMBG5913-5956B series of surface mount 3.0
watt Zeners provides voltage regulation in a selection from 3.3 to 200
volts with different tolerances as identified by suffix letter on the part
number. This series is equivalent to the JEDEC registered 1N5913 thru
1N5956B with identical electrical characteristics except it is rated at 3.0 W
instead of 1.5 W with the lower thermal resistance features of the surface
mount packaging. It is available in J-bend design (SMBJ) with the DO-
214AA package for greater PC board mounting density or in Gull-wing
design (SMBG) in the DO-215AA for visible solder connections.
Microsemi also offers numerous other Zener products to meet higher and
lower power applications.
IMPORTANT:
For the most current data, consult
MICROSEMI’s
website:
http://www.microsemi.com
APPEARANCE
WWW .
Microsemi
.C
OM
NOTE: All SMB series are
equivalent to prior SMS package
identifications.
FEATURES
Surface mount equivalent to 1N5913 to 1N5956B
Ideal for high-density and low-profile mounting
Zener voltage available 3.3V to 200V
Standard voltage tolerances are plus/minus 5%
with B suffix and 10 % with A suffix identification
Tight tolerances available in plus or minus 2% or
1% with C or D suffix respectively
Options for screening in accordance with MIL-PRF-
19500 for JAN, JANTX, JANTXV, and JANS are
available by adding MQ, MX, MV, or MSP prefixes
respectively to part numbers.
APPLICATIONS / BENEFITS
Regulates voltage over a broad operating
current and temperature range
Wide selection from 3.3 to 200 V
Popular DO-214AA or DO-215AA packages
and footprints for either high density J-bend or
Gull-wing designs for visible solder joints
Nonsensitive to ESD per MIL-STD-750 Method
1020
Withstands high surge stresses (see Figure 2)
Moisture classification: Level 1 per IPC/JEDEC
J-STD-020B with no dry pack required
MECHANICAL AND PACKAGING
CASE: Void-free transfer molded thermosetting
epoxy body meeting UL94V-0
TERMINALS: Gull-wing or C-bend (modified J-
bend) leads, tin-lead plated solderable per MIL-
STD-750, method 2026
POLARITY: Cathode indicated by band. Diode
to be operated with banded end positive with
respect to opposite end for Zener regulation
MARKING: Includes part number without prefix
(e.g. 5913B, 5948C, 5956D, etc.)
TAPE & REEL option: Standard per EIA-481-2
with 12 mm tape, 750 per 7 inch reel or 2500
per 13 inch reel
(add “TR” suffix to part number)
WEIGHT: 0.1 grams
See package dimensions on last page
MAXIMUM RATINGS
Power dissipation at 25
º
C: 3.0 watts (also see
derating in Figure 1).
Operating and Storage temperature: -65
º
C to
+150
º
C
Thermal Resistance: 25
º
C/W junction to lead, or
90
º
C/W junction to ambient when mounted on
FR4 PC board (1oz Cu) with recommended
footprint (see last page)
Steady-State Power: 3 watts at T
L
< 75
o
C, or
1.38 watts at T
A
= 25
º
C when mounted on FR4
PC board with recommended footprint (also see
Figure 1)
Forward voltage @200 mA: 1.2 volts (maximum)
Solder Temperatures: 260
º
C for 10 s (maximum)
SMBG & J5913 thru 5956B
Copyright
2002
6-04-2003 REV C
Microsemi
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503
Page 1

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