Flash, 64KX8, 150ns, PQCC32,
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | Intel |
package instruction | QCCJ, LDCC32,.5X.6 |
Reach Compliance Code | unknown |
Maximum access time | 150 ns |
command user interface | YES |
Data polling | NO |
JESD-30 code | R-PQCC-J32 |
JESD-609 code | e0 |
memory density | 524288 bit |
Memory IC Type | FLASH |
memory width | 8 |
Number of terminals | 32 |
word count | 65536 words |
character code | 64000 |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 64KX8 |
Package body material | PLASTIC/EPOXY |
encapsulated code | QCCJ |
Encapsulate equivalent code | LDCC32,.5X.6 |
Package shape | RECTANGULAR |
Package form | CHIP CARRIER |
Parallel/Serial | PARALLEL |
power supply | 5 V |
Certification status | Not Qualified |
Maximum standby current | 0.0001 A |
Maximum slew rate | 0.03 mA |
Nominal supply voltage (Vsup) | 5 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | J BEND |
Terminal pitch | 1.27 mm |
Terminal location | QUAD |
switch bit | NO |
type | NOR TYPE |
N28F512-150P1C4 | AP28F512-200 | AN28F512-200 | N28F512-120P1C4 | N28F512-200P1C4 | |
---|---|---|---|---|---|
Description | Flash, 64KX8, 150ns, PQCC32, | Flash, 64KX8, 200ns, PDIP32, | Flash, 64KX8, 200ns, PQCC32 | Flash, 64KX8, 120ns, PQCC32 | Flash, 64KX8, 200ns, PQCC32 |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible |
package instruction | QCCJ, LDCC32,.5X.6 | DIP, DIP32,.6 | QCCJ, LDCC32,.5X.6 | QCCJ, LDCC32,.5X.6 | QCCJ, LDCC32,.5X.6 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
Maximum access time | 150 ns | 200 ns | 200 ns | 120 ns | 200 ns |
command user interface | YES | YES | YES | YES | YES |
Data polling | NO | NO | NO | NO | NO |
JESD-30 code | R-PQCC-J32 | R-PDIP-T32 | R-PQCC-J32 | R-PQCC-J32 | R-PQCC-J32 |
JESD-609 code | e0 | e0 | e0 | e0 | e0 |
memory density | 524288 bit | 524288 bit | 524288 bit | 524288 bit | 524288 bit |
Memory IC Type | FLASH | FLASH | FLASH | FLASH | FLASH |
memory width | 8 | 8 | 8 | 8 | 8 |
Number of terminals | 32 | 32 | 32 | 32 | 32 |
word count | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words |
character code | 64000 | 64000 | 64000 | 64000 | 64000 |
Maximum operating temperature | 70 °C | 125 °C | 125 °C | 70 °C | 70 °C |
organize | 64KX8 | 64KX8 | 64KX8 | 64KX8 | 64KX8 |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | QCCJ | DIP | QCCJ | QCCJ | QCCJ |
Encapsulate equivalent code | LDCC32,.5X.6 | DIP32,.6 | LDCC32,.5X.6 | LDCC32,.5X.6 | LDCC32,.5X.6 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | CHIP CARRIER | IN-LINE | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER |
Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
power supply | 5 V | 5 V | 5 V | 5 V | 5 V |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum standby current | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A |
Maximum slew rate | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA |
Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
surface mount | YES | NO | YES | YES | YES |
technology | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | COMMERCIAL | AUTOMOTIVE | AUTOMOTIVE | COMMERCIAL | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | J BEND | THROUGH-HOLE | J BEND | J BEND | J BEND |
Terminal pitch | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm |
Terminal location | QUAD | DUAL | QUAD | QUAD | QUAD |
switch bit | NO | NO | NO | NO | NO |
type | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE |
Maker | Intel | - | Intel | Intel | Intel |