AT17F080-10BJI datasheet, PDF - EEWORLD Datasheet

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AT17F080-10BJI: DescriptionConfiguration Memory, 8MX1, Serial, CMOS, PQCC44, PLASTIC, LCC-44; Categorystorage storage; File Size154KB，18 Pages; ManufacturerAtmel (Microchip)

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AT17F080-10BJI Overview

Configuration Memory, 8MX1, Serial, CMOS, PQCC44, PLASTIC, LCC-44

AT17F080-10BJI Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Atmel (Microchip)
Parts packaging code	LCC
package instruction	QCCJ, LDCC44,.7SQ
Contacts	44
Reach Compliance Code	compliant
ECCN code	EAR99
Maximum clock frequency (fCLK)	33 MHz
JESD-30 code	S-PQCC-J44
JESD-609 code	e0
length	16.5862 mm
memory density	8388608 bit
Memory IC Type	CONFIGURATION MEMORY
memory width	1
Humidity sensitivity level	2
Number of functions	1
Number of terminals	44
word count	8388608 words
character code	8000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	8MX1
Package body material	PLASTIC/EPOXY
encapsulated code	QCCJ
Encapsulate equivalent code	LDCC44,.7SQ
Package shape	SQUARE
Package form	CHIP CARRIER
Parallel/Serial	SERIAL
Peak Reflow Temperature (Celsius)	225
power supply	3/3.3 V
Certification status	Not Qualified
Maximum seat height	4.572 mm
Maximum standby current	0.0002 A
Maximum slew rate	0.005 mA
Maximum supply voltage (Vsup)	3.63 V
Minimum supply voltage (Vsup)	2.97 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	J BEND
Terminal pitch	1.27 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED
width	16.5862 mm

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Description	Configuration Memory, 8MX1, Serial, CMOS, PQCC44, PLASTIC, LCC-44	Configuration Memory, 8MX1, Serial, CMOS, PQCC44, PLASTIC, LCC-44	Ceramic Capacitor, Multilayer, Ceramic, 16V, 20% +Tol, 20% -Tol, X7R, 15% TC, 0.002uF, Surface Mount, 2221, CHIP	Configuration Memory, 4MX1, Serial, CMOS, PQCC20, PLASTIC, LCC-20	Configuration Memory, 8MX1, Serial, CMOS, 6 X 6 MM, 1.04 MM HEIGHT, 1.27 MM PITCH, LAP-8	Configuration Memory, 8MX1, Serial, CMOS, PQCC20, PLASTIC, LCC-20	Configuration Memory, 8MX1, Serial, CMOS, PQCC20, PLASTIC, LCC-20	Configuration Memory, 4MX1, Serial, CMOS, PQCC20, PLASTIC, LCC-20	Configuration Memory, 8MX1, Serial, CMOS, PQFP44, 10 X 10 MM, 0.80 MM PITCH, PLASTIC, TQFP-44	Configuration Memory, 8MX1, Serial, CMOS, PQFP44, 10 X 10 MM, 0.80 MM PITCH, PLASTIC, TQFP-44
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
package instruction	QCCJ, LDCC44,.7SQ	QCCJ, LDCC44,.7SQ	, 2221	QCCJ, LDCC20,.4SQ	SON, SOLCC8,.25	QCCJ, LDCC20,.4SQ	QCCJ, LDCC20,.4SQ	QCCJ, LDCC20,.4SQ	TQFP, TQFP44,.47SQ,32	TQFP, TQFP44,.47SQ,32
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	compliant	compliant	compliant	compliant	compli
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
JESD-609 code	e0	e0	e0	e0	e0	e0	e0	e0	e0	e0
Number of terminals	44	44	2	20	8	20	20	20	44	44
Maximum operating temperature	85 °C	70 °C	125 °C	70 °C	70 °C	70 °C	85 °C	85 °C	85 °C	70 °C
Package shape	SQUARE	SQUARE	RECTANGULAR PACKAGE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
surface mount	YES	YES	YES	YES	YES	YES	YES	YES	YES	YES
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Maker	Atmel (Microchip)	Atmel (Microchip)	-	Atmel (Microchip)	Atmel (Microchip)	Atmel (Microchip)	Atmel (Microchip)	Atmel (Microchip)	Atmel (Microchip)	Atmel (Microchip)
Parts packaging code	LCC	LCC	-	QLCC	SOIC	QLCC	QLCC	QLCC	QFP	QFP
Contacts	44	44	-	20	8	20	20	20	44	44
Maximum clock frequency (fCLK)	33 MHz	33 MHz	-	33 MHz	33 MHz	33 MHz	33 MHz	33 MHz	33 MHz	33 MHz
JESD-30 code	S-PQCC-J44	S-PQCC-J44	-	S-PQCC-J20	S-XDSO-N8	S-PQCC-J20	S-PQCC-J20	S-PQCC-J20	S-PQFP-G44	S-PQFP-G44
length	16.5862 mm	16.5862 mm	-	8.965 mm	5.99 mm	8.965 mm	8.965 mm	8.965 mm	10 mm	10 mm
memory density	8388608 bit	8388608 bit	-	4194304 bit	8388608 bit	8388608 bit	8388608 bit	4194304 bit	8388608 bit	8388608 bi
Memory IC Type	CONFIGURATION MEMORY	CONFIGURATION MEMORY	-	CONFIGURATION MEMORY	CONFIGURATION MEMORY	CONFIGURATION MEMORY	CONFIGURATION MEMORY	CONFIGURATION MEMORY	CONFIGURATION MEMORY	CONFIGURATION MEMORY
memory width	1	1	-	1	1	1	1	1	1	1
Humidity sensitivity level	2	2	-	2	3	2	2	2	-	-
Number of functions	1	1	-	1	1	1	1	1	1	1
word count	8388608 words	8388608 words	-	4194304 words	8388608 words	8388608 words	8388608 words	4194304 words	8388608 words	8388608 words
character code	8000000	8000000	-	4000000	8000000	8000000	8000000	4000000	8000000	8000000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	-	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
organize	8MX1	8MX1	-	4MX1	8MX1	8MX1	8MX1	4MX1	8MX1	8MX1
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	-	PLASTIC/EPOXY	UNSPECIFIED	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	QCCJ	QCCJ	-	QCCJ	SON	QCCJ	QCCJ	QCCJ	TQFP	TQFP
Encapsulate equivalent code	LDCC44,.7SQ	LDCC44,.7SQ	-	LDCC20,.4SQ	SOLCC8,.25	LDCC20,.4SQ	LDCC20,.4SQ	LDCC20,.4SQ	TQFP44,.47SQ,32	TQFP44,.47SQ,32
Package form	CHIP CARRIER	CHIP CARRIER	-	CHIP CARRIER	SMALL OUTLINE	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER	FLATPACK, THIN PROFILE	FLATPACK, THIN PROFILE
Parallel/Serial	SERIAL	SERIAL	-	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL
Peak Reflow Temperature (Celsius)	225	225	-	225	240	225	225	225	NOT SPECIFIED	NOT SPECIFIED
power supply	3/3.3 V	3/3.3 V	-	3/3.3 V	3/3.3 V	3/3.3 V	3/3.3 V	3/3.3 V	3/3.3 V	3/3.3 V
Certification status	Not Qualified	Not Qualified	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	4.572 mm	4.572 mm	-	4.572 mm	1.14 mm	4.572 mm	4.572 mm	4.572 mm	1.2 mm	1.2 mm
Maximum standby current	0.0002 A	0.0002 A	-	0.0001 A	0.0002 A	0.0002 A	0.0002 A	0.0001 A	0.0002 A	0.0002 A
Maximum slew rate	0.005 mA	0.005 mA	-	0.005 mA	0.005 mA	0.005 mA	0.005 mA	0.005 mA	0.005 mA	0.005 mA
Maximum supply voltage (Vsup)	3.63 V	3.63 V	-	3.63 V	3.63 V	3.63 V	3.63 V	3.63 V	3.63 V	3.63 V
Minimum supply voltage (Vsup)	2.97 V	2.97 V	-	2.97 V	2.97 V	2.97 V	2.97 V	2.97 V	2.97 V	2.97 V
Nominal supply voltage (Vsup)	3.3 V	3.3 V	-	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
technology	CMOS	CMOS	-	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	COMMERCIAL	-	COMMERCIAL	COMMERCIAL	COMMERCIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	COMMERCIAL
Terminal form	J BEND	J BEND	-	J BEND	NO LEAD	J BEND	J BEND	J BEND	GULL WING	GULL WING
Terminal pitch	1.27 mm	1.27 mm	-	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	0.8 mm	0.8 mm
Terminal location	QUAD	QUAD	-	QUAD	DUAL	QUAD	QUAD	QUAD	QUAD	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	16.5862 mm	16.5862 mm	-	8.965 mm	5.99 mm	8.965 mm	8.965 mm	8.965 mm	10 mm	10 mm

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