EEWORLDEEWORLDEEWORLD

Part Number

Search
 PDF

TC7PG17FU(TE85L,F)

Description
IC,LOGIC GATE,DUAL BUFFER,CMOS,TSSOP,6PIN,PLASTIC
Categorylogic    logic   
File Size143KB,6 Pages
ManufacturerToshiba Semiconductor
Websitehttp://toshiba-semicon-storage.com/
Environmental Compliance
Download Datasheet Parametric Compare View All

TC7PG17FU(TE85L,F) Overview

IC,LOGIC GATE,DUAL BUFFER,CMOS,TSSOP,6PIN,PLASTIC

TC7PG17FU(TE85L,F) Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerToshiba Semiconductor
package instructionTSSOP, TSSOP6,.08
Reach Compliance Codeunknown
JESD-30 codeR-PDSO-G6
Load capacitance (CL)30 pF
Logic integrated circuit typeBUFFER
MaximumI(ol)0.003 A
Number of terminals6
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeTSSOP
Encapsulate equivalent codeTSSOP6,.08
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE, SHRINK PITCH
method of packingTAPE AND REEL
power supply1.2/3.3 V
Prop。Delay @ Nom-Sup58.1 ns
Certification statusNot Qualified
Schmitt triggerYES
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formGULL WING
Terminal pitch0.635 mm
Terminal locationDUAL

TC7PG17FU(TE85L,F) Related Products

TC7PG17FU(TE85L,F) TC7PG17FU(TE85L)
Description IC,LOGIC GATE,DUAL BUFFER,CMOS,TSSOP,6PIN,PLASTIC IC,LOGIC GATE,DUAL BUFFER,CMOS,TSSOP,6PIN,PLASTIC
Is it Rohs certified? conform to incompatible
Maker Toshiba Semiconductor Toshiba Semiconductor
package instruction TSSOP, TSSOP6,.08 TSSOP, TSSOP6,.08
Reach Compliance Code unknown unknown
JESD-30 code R-PDSO-G6 R-PDSO-G6
Load capacitance (CL) 30 pF 30 pF
Logic integrated circuit type BUFFER BUFFER
MaximumI(ol) 0.003 A 0.003 A
Number of terminals 6 6
Maximum operating temperature 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TSSOP TSSOP
Encapsulate equivalent code TSSOP6,.08 TSSOP6,.08
Package shape RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
method of packing TAPE AND REEL TAPE AND REEL
power supply 1.2/3.3 V 1.2/3.3 V
Prop。Delay @ Nom-Sup 58.1 ns 58.1 ns
Certification status Not Qualified Not Qualified
Schmitt trigger YES YES
surface mount YES YES
technology CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL
Terminal form GULL WING GULL WING
Terminal pitch 0.635 mm 0.635 mm
Terminal location DUAL DUAL

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号