SMD Switching Diode
CDSU400BS-HF
RoHS Device
Halogen Free
Features
- High Speed.
- Designed for mounting on small surface.
- Extremely thin/leadless package.
- Low leakage current.
- High mounting capability, strong surge
withstand, high reliability.
0.039(1.00)
0.031(0.80)
0603/SOD-523F
0.071(1.80)
0.063(1.60)
Mechanical data
- Case: 0603/SOD-523F standard package,
molded plastic.
- Terminals: Gold plated, solderable per
MIL-STD-750,method 2026.
- Polarity: Indicated by cathode band.
- Mounting position: Any.
- Weight: 0.003 gram(approx.).
0.028(0.70) Typ.
0.014(0.35) Typ.
0.033(0.85)
0.027(0.70)
0.012 (0.30) Typ.
Dimensions in inches and (millimeter)
Maximum Rating
( at T
A
= 25 C unless otherwise noted )
Parameter
Repetitive peak reverse voltage
Reverse voltage
Average forward current
Forward current , surge peak
Repetitive peak forward current
Power Dissipation
Storage temperature
Junction temperature
8.3 ms single half sine-wave superimposed
on rate load ( JEDEC method )
Conditions
Symbol Min Typ Max Unit
V
RRM
V
R
I
O
I
FSM
I
FRM
P
D
T
STG
Tj
-55
1.5
225
150
+150
+150
100
100
100
V
V
mA
A
mA
mW
°C
°C
Electrical Characteristics
( at T
A
= 25 °C unless otherwise noted )
Parameter
Forward voltage
Reverse current
Capacitance between terminals
Reverse recovery time
I
F
= 100 mA
V
R
= 80 V
f = 1MHz, and 0.5VDC reverse voltage
V
R
= 6V, I
F
= 10 mA, R
L
=50 ohms
Conditions
Symbol Min Typ Max Unit
V
F
I
R
C
T
Trr
1.0
0.1
3
4
V
uA
pF
nS
REV:A
Company reserves the right to improve product design , functions and reliability without notice.
QW-G0017
Page 1
Comchip Technology CO., LTD.
SMD Switching Diode
RATING AND CHARACTERISTIC CURVES (CDSU400BS-HF)
Fig. 1 - Forward characteristics
1000
100
Fig. 2 - Reverse characteristics
Reverse current, (μA)
Forward current, (mA )
100
10
150°C
125°C
150°C
1
100°C
10
125°C
100°C
0.1
75°C
50°C
25°C
1
75°C
25°C
0.01
0.1
0
0.2
0.4
0.6
0.8
1.0
0.001
0
30
60
90
120
150
Forward voltage, (V)
Reverse voltage, (V)
Fig. 3 - Capacitance between
terminals characteristics
Capacitance between terminals,(pF)
1.0
Fig. 4 - Current derating curve
Average forward current, ( % )
f=1MHz
T
A
=25°C
0.8
Mounting on glass epoxy PCBs
100
80
60
0.6
0.4
40
20
0
0.2
0
0
10
20
30
40
0
25
50
75
100
125
150
Reverse voltage, (V)
Ambient temperature, ( °C)
REV:A
QW-G0017
Page 2
Comchip Technology CO., LTD.
SMD Switching Diode
Reel Taping Specification
P
0
P
1
d
Index hole
E
T
F
B
P
A
W
C
12
0
o
D
2
D
1
D
W
1
Trailer
.......
.......
10 pitches (min)
Device
.......
.......
.......
.......
Leader
.......
.......
10 pitches (min)
End
Start
Direction of Feed
SYMBOL
A
1.00 ± 0.10
B
1.85 ± 0.10
C
1.00 ± 0.10
d
1.55 ± 0.05
D
178 ± 1
7.008 ± 0.04
D
1
60.0 MIN.
2.362 MIN.
D
2
13.0 ± 0.20
0.512 ± 0.008
0603
(SOD-523F)
(mm)
(inch)
SYMBOL
0.039 ± 0.004 0.073 ± 0.004 0.039 ± 0.004 0.061 ± 0.002
E
1.75 ± 0.10
F
3.50 ± 0.05
P
4.00 ± 0.10
P
0
4.00 ± 0.10
P
1
2.00 ± 0.05
T
0.23 ± 0.05
W
8.00 ± 0.20
W
1
13.5 MAX.
0.531 MAX.
0603
(SOD-523F)
(mm)
(inch)
0.069 ± 0.004 0.138 ± 0.002 0.157 ± 0.004 0.157 ± 0.004 0.079 ± 0.004 0.009 ± 0.002 0.315 ± 0.008
REV:A
QW-G0017
Page 3
Comchip Technology CO., LTD.
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