ADG783BCP datasheet, PDF - EEWORLD Datasheet

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ADG783BCP: DescriptionQUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, QCC20, 4 X 4 MM, CSP-20; CategoryAnalog mixed-signal IC The signal circuit; File Size846KB，9 Pages; ManufacturerRochester Electronics; Websitehttps://www.rocelec.com/

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ADG783BCP Overview

QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, QCC20, 4 X 4 MM, CSP-20

ADG783BCP Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	Rochester Electronics
Parts packaging code	QFN
package instruction	HVQCCN,
Contacts	20
Reach Compliance Code	unknown
Other features	CAN ALSO OPERATE AT 5V NOMINAL
Analog Integrated Circuits - Other Types	SPST
JESD-30 code	S-XQCC-N20
JESD-609 code	e0
length	4 mm
Humidity sensitivity level	3
Number of channels	1
Number of functions	4
Number of terminals	20
Nominal off-state isolation	58 dB
On-state resistance matching specifications	0.1 Ω
Maximum on-state resistance (Ron)	10 Ω
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	UNSPECIFIED
encapsulated code	HVQCCN
Package shape	SQUARE
Package form	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Celsius)	240
Certification status	COMMERCIAL
Maximum seat height	0.9 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	1.8 V
Nominal supply voltage (Vsup)	3 V
surface mount	YES
Maximum disconnect time	12 ns
Maximum connection time	20 ns
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	TIN LEAD
Terminal form	NO LEAD
Terminal pitch	0.5 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	30
width	4 mm

ADG783BCP Related Products

	ADG783BCP	ADG781BCP-REEL	ADG781BCP-REEL7	ADG782BCP-REEL7	ADG782BCP-REEL	ADG782BCP	ADG781BCP
Description	QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, QCC20, 4 X 4 MM, CSP-20	QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, QCC20, 4 X 4 MM, CSP-20	QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, QCC20, 4 X 4 MM, CSP-20	QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, QCC20, 4 X 4 MM, CSP-20	QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, QCC20, 4 X 4 MM, CSP-20	QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, QCC20, 4 X 4 MM, CSP-20	QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, QCC20, 4 X 4 MM, CSP-20
Is it lead-free?	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Parts packaging code	QFN	QFN	QFN	QFN	QFN	QFN	QFN
package instruction	HVQCCN,	HVQCCN,	HVQCCN,	4 X 4 MM, CSP-20	HVQCCN,	4 X 4 MM, CSP-20	HVQCCN,
Contacts	20	20	20	20	20	20	20
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown
Other features	CAN ALSO OPERATE AT 5V NOMINAL	CAN ALSO OPERATE AT 5V NOMINAL	CAN ALSO OPERATE AT 5V NOMINAL	CAN ALSO OPERATE AT 5V NOMINAL	CAN ALSO OPERATE AT 5V NOMINAL	CAN ALSO OPERATE AT 5V NOMINAL	CAN ALSO OPERATE AT 5V NOMINAL
Analog Integrated Circuits - Other Types	SPST	SPST	SPST	SPST	SPST	SPST	SPST
JESD-30 code	S-XQCC-N20	S-XQCC-N20	S-XQCC-N20	S-XQCC-N20	S-XQCC-N20	S-XQCC-N20	S-XQCC-N20
JESD-609 code	e0	e0	e0	e0	e0	e0	e0
length	4 mm	4 mm	4 mm	4 mm	4 mm	4 mm	4 mm
Humidity sensitivity level	3	3	3	3	3	3	3
Number of channels	1	1	1	1	1	1	1
Number of functions	4	4	4	4	4	4	4
Number of terminals	20	20	20	20	20	20	20
Nominal off-state isolation	58 dB	58 dB	58 dB	58 dB	58 dB	58 dB	58 dB
On-state resistance matching specifications	0.1 Ω	0.1 Ω	0.1 Ω	0.1 Ω	0.1 Ω	0.1 Ω	0.1 Ω
Maximum on-state resistance (Ron)	10 Ω	10 Ω	10 Ω	10 Ω	10 Ω	10 Ω	10 Ω
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
Package body material	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED
encapsulated code	HVQCCN	HVQCCN	HVQCCN	HVQCCN	HVQCCN	HVQCCN	HVQCCN
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package form	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Celsius)	240	240	240	240	240	240	240
Certification status	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Maximum seat height	0.9 mm	0.9 mm	0.9 mm	0.9 mm	0.9 mm	0.9 mm	0.9 mm
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V
Nominal supply voltage (Vsup)	3 V	3 V	3 V	3 V	3 V	3 V	3 V
surface mount	YES	YES	YES	YES	YES	YES	YES
Maximum disconnect time	12 ns	12 ns	12 ns	12 ns	12 ns	12 ns	12 ns
Maximum connection time	20 ns	20 ns	20 ns	20 ns	20 ns	20 ns	20 ns
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD
Terminal form	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD
Terminal pitch	0.5 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm
Terminal location	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD
Maximum time at peak reflow temperature	30	30	30	30	30	30	30
width	4 mm	4 mm	4 mm	4 mm	4 mm	4 mm	4 mm
Base Number Matches	-	1	1	1	1	-	-

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