WEDPS512K32V-12BC datasheet, PDF

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WEDPS512K32V-12BC: DescriptionSRAM Module, 512KX32, 12ns, CMOS, PBGA143, 16 X 18 MM, PLASTIC, BGA-143; Categorystorage storage; File Size173KB，7 Pages; ManufacturerWhite Electronic Designs Corporation; Websitehttp://www.wedc.com/

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WEDPS512K32V-12BC Overview

SRAM Module, 512KX32, 12ns, CMOS, PBGA143, 16 X 18 MM, PLASTIC, BGA-143

WEDPS512K32V-12BC Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	White Electronic Designs Corporation
package instruction	16 X 18 MM, PLASTIC, BGA-143
Reach Compliance Code	unknown
Maximum access time	12 ns
Other features	ALSO CONFIGURABLE AS 2M X 8
Spare memory width	16
I/O type	COMMON
JESD-30 code	R-PBGA-B143
length	18 mm
memory density	16777216 bit
Memory IC Type	SRAM MODULE
memory width	32
Number of functions	1
Number of terminals	143
word count	524288 words
character code	512000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	512KX32
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	BGA
Encapsulate equivalent code	BGA143,12X12,50
Package shape	RECTANGULAR
Package form	GRID ARRAY
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	3.3 V
Certification status	Not Qualified
Maximum seat height	2.21 mm
Maximum standby current	0.12 A
Minimum standby current	3 V
Maximum slew rate	0.4 mA
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	3 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	BALL
Terminal pitch	1.27 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	16 mm

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White Electronic Designs

WEDPS512K32V-XBX

512Kx32 SRAM 3.3V MULTI-CHIP PACKAGE

FEATURES

Access Times of 12, 15, 17, 20ns

Packaging

• 143 PBGA, 16mm x 18mm, 288mm

Organized as 512Kx32; User Conﬁgurable as

1Mx16 or 2Mx8

Commercial, Industrial and Military Temperature

Ranges

Low Voltage Operation:

• 3.3V ± 10% Power Supply

This product is subject to change without notice.

Low Power Data Retention 'L' Option

TTL Compatible Inputs and Outputs

Fully Static Operation:

• No clock or refresh required.

Three State Output.

PIN CONFIGURATION FOR WEDPS512K32V-XBX

Top View

CS2#

D10

WE2#

GND

VCC

CS1#

WE1#

GND

D11

GND

VCC

GND

VCC

D14

D12

GND

VCC

GND

D15

D13

GND

VCC

vcc

GND

VCC

vcc

VCC

CS4#

VCC

GND

WE3#

GND

VCC

D24

D26

VCC

GND

D17

D19

GND

A18

D25

D27

VCC

GND

D16

D18

A10

A17

OE#

WE4#

VCC

GND

CS3#

A14

A11

A16

A15

D31

D28

VCC

GND

D23

D20

A13

A12

GND

D30

D29

VCC

GND

D22

D21

vcc

Pin Description

I/O

0-31

0-18

1-4

OE#

GND

Data Inputs/Outputs

Address Inputs

Write Enables

Chip Selects

Output Enable

Power Supply

Ground

Not Connected

# CS

OE#

0-18

Block Diagram

# CS

512K X 8

I/O

0 - 7

I/O

8 - 15

I/O

16 - 23

I/O

24 - 31

June 2004

Rev. 5

White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com

WEDPS512K32V-12BC Related Products

	WEDPS512K32V-12BC	WEDPS512K32V-17BC	WEDPS512K32V-17BI	WEDPS512K32V-15BC	WEDPS512K32V-20BM	WEDPS512K32V-20BI	WEDPS512K32V-20BC	WEDPS512K32V-15BM	WEDPS512K32V-17BM
Description	SRAM Module, 512KX32, 12ns, CMOS, PBGA143, 16 X 18 MM, PLASTIC, BGA-143	SRAM Module, 512KX32, 17ns, CMOS, PBGA143, 16 X 18 MM, PLASTIC, BGA-143	SRAM Module, 512KX32, 17ns, CMOS, PBGA143, 16 X 18 MM, PLASTIC, BGA-143	SRAM Module, 512KX32, 15ns, CMOS, PBGA143, 16 X 18 MM, PLASTIC, BGA-143	SRAM Module, 512KX32, 20ns, CMOS, PBGA143, 16 X 18 MM, PLASTIC, BGA-143	SRAM Module, 512KX32, 20ns, CMOS, PBGA143, 16 X 18 MM, PLASTIC, BGA-143	SRAM Module, 512KX32, 20ns, CMOS, PBGA143, 16 X 18 MM, PLASTIC, BGA-143	SRAM Module, 512KX32, 15ns, CMOS, PBGA143, 16 X 18 MM, PLASTIC, BGA-143	SRAM Module, 512KX32, 17ns, CMOS, PBGA143, 16 X 18 MM, PLASTIC, BGA-143
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
package instruction	16 X 18 MM, PLASTIC, BGA-143	16 X 18 MM, PLASTIC, BGA-143	16 X 18 MM, PLASTIC, BGA-143	16 X 18 MM, PLASTIC, BGA-143	16 X 18 MM, PLASTIC, BGA-143	16 X 18 MM, PLASTIC, BGA-143	16 X 18 MM, PLASTIC, BGA-143	16 X 18 MM, PLASTIC, BGA-143	16 X 18 MM, PLASTIC, BGA-143
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
Maximum access time	12 ns	17 ns	17 ns	15 ns	20 ns	20 ns	20 ns	15 ns	17 ns
Other features	ALSO CONFIGURABLE AS 2M X 8	ALSO CONFIGURABLE AS 2M X 8	ALSO CONFIGURABLE AS 2M X 8	ALSO CONFIGURABLE AS 2M X 8	ALSO CONFIGURABLE AS 2M X 8	ALSO CONFIGURABLE AS 2M X 8	ALSO CONFIGURABLE AS 2M X 8	ALSO CONFIGURABLE AS 2M X 8	ALSO CONFIGURABLE AS 2M X 8
Spare memory width	16	16	16	16	16	16	16	16	16
I/O type	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 code	R-PBGA-B143	R-PBGA-B143	R-PBGA-B143	R-PBGA-B143	R-PBGA-B143	R-PBGA-B143	R-PBGA-B143	R-PBGA-B143	R-PBGA-B143
length	18 mm	18 mm	18 mm	18 mm	18 mm	18 mm	18 mm	18 mm	18 mm
memory density	16777216 bit	16777216 bit	16777216 bit	16777216 bit	16777216 bit	16777216 bit	16777216 bit	16777216 bit	16777216 bit
Memory IC Type	SRAM MODULE	SRAM MODULE	SRAM MODULE	SRAM MODULE	SRAM MODULE	SRAM MODULE	SRAM MODULE	SRAM MODULE	SRAM MODULE
memory width	32	32	32	32	32	32	32	32	32
Number of functions	1	1	1	1	1	1	1	1	1
Number of terminals	143	143	143	143	143	143	143	143	143
word count	524288 words	524288 words	524288 words	524288 words	524288 words	524288 words	524288 words	524288 words	524288 words
character code	512000	512000	512000	512000	512000	512000	512000	512000	512000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	85 °C	70 °C	125 °C	85 °C	70 °C	125 °C	125 °C
Minimum operating temperature	-	-	-40 °C	-	-55 °C	-40 °C	-	-55 °C	-55 °C
organize	512KX32	512KX32	512KX32	512KX32	512KX32	512KX32	512KX32	512KX32	512KX32
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA
Encapsulate equivalent code	BGA143,12X12,50	BGA143,12X12,50	BGA143,12X12,50	BGA143,12X12,50	BGA143,12X12,50	BGA143,12X12,50	BGA143,12X12,50	BGA143,12X12,50	BGA143,12X12,50
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	2.21 mm	2.21 mm	2.21 mm	2.21 mm	2.21 mm	2.21 mm	2.21 mm	2.21 mm	2.21 mm
Maximum standby current	0.12 A	0.12 A	0.12 A	0.12 A	0.12 A	0.12 A	0.12 A	0.12 A	0.12 A
Minimum standby current	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V
Maximum slew rate	0.4 mA	0.4 mA	0.4 mA	0.4 mA	0.4 mA	0.4 mA	0.4 mA	0.4 mA	0.4 mA
Maximum supply voltage (Vsup)	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
Minimum supply voltage (Vsup)	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V
Nominal supply voltage (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
surface mount	YES	YES	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	INDUSTRIAL	COMMERCIAL	MILITARY	INDUSTRIAL	COMMERCIAL	MILITARY	MILITARY
Terminal form	BALL	BALL	BALL	BALL	BALL	BALL	BALL	BALL	BALL
Terminal pitch	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	16 mm	16 mm	16 mm	16 mm	16 mm	16 mm	16 mm	16 mm	16 mm
Maker	White Electronic Designs Corporation	-	-	White Electronic Designs Corporation	White Electronic Designs Corporation	White Electronic Designs Corporation	White Electronic Designs Corporation	White Electronic Designs Corporation	White Electronic Designs Corporation

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