MCM69P737ZP4R datasheet, PDF - EEWORLD Datasheet

MCM69P737ZP4R: Description128KX36 CACHE SRAM, 4ns, PBGA119, PLASTIC, BGA-119; Categorystorage storage; File Size421KB，20 Pages; ManufacturerNXP; Websitehttps://www.nxp.com

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MCM69P737ZP4R Overview

128KX36 CACHE SRAM, 4ns, PBGA119, PLASTIC, BGA-119

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	NXP
Parts packaging code	BGA
package instruction	BGA, BGA119,7X17,50
Contacts	119
Reach Compliance Code	compliant
ECCN code	3A991.B.2.A
Maximum access time	4 ns
Other features	PIPELINED ARCHITECTURE
I/O type	COMMON
JESD-30 code	R-PBGA-B119
length	22 mm
memory density	4718592 bit
Memory IC Type	CACHE SRAM
memory width	36
Number of functions	1
Number of terminals	119
word count	131072 words
character code	128000
Operating mode	SYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	128KX36
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	BGA
Encapsulate equivalent code	BGA119,7X17,50
Package shape	RECTANGULAR
Package form	GRID ARRAY
Parallel/Serial	PARALLEL
power supply	2.5/3.3,3.3 V
Certification status	Not Qualified
Maximum seat height	2.4 mm
Maximum standby current	0.045 A
Minimum standby current	3.14 V
Maximum slew rate	0.375 mA
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	3.135 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	BALL
Terminal pitch	1.27 mm
Terminal location	BOTTOM
width	14 mm

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