|
MT4C4M4B1DW-7 |
MT4C4M4A1DW-6 |
MT4C4M4A1DW-7 |
MT4C4M4B1DW-6 |
Description |
Fast Page DRAM, 4MX4, 70ns, CMOS, PDSO24, 0.400 INCH, PLASTIC, SOJ-28/24 |
Fast Page DRAM, 4MX4, 60ns, CMOS, PDSO24, 0.400 INCH, PLASTIC, SOJ-28/24 |
Fast Page DRAM, 4MX4, 70ns, CMOS, PDSO24, 0.400 INCH, PLASTIC, SOJ-28/24 |
Fast Page DRAM, 4MX4, 60ns, CMOS, PDSO24, 0.400 INCH, PLASTIC, SOJ-28/24 |
Is it lead-free? |
Contains lead |
Contains lead |
Contains lead |
Contains lead |
Is it Rohs certified? |
incompatible |
incompatible |
incompatible |
incompatible |
Maker |
Micron Technology |
Micron Technology |
Micron Technology |
Micron Technology |
Parts packaging code |
SOJ |
SOJ |
SOJ |
SOJ |
package instruction |
0.400 INCH, PLASTIC, SOJ-28/24 |
0.400 INCH, PLASTIC, SOJ-28/24 |
0.400 INCH, PLASTIC, SOJ-28/24 |
0.400 INCH, PLASTIC, SOJ-28/24 |
Contacts |
24 |
24 |
24 |
24 |
Reach Compliance Code |
not_compliant |
_compli |
not_compliant |
unknown |
ECCN code |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
access mode |
FAST PAGE |
FAST PAGE |
FAST PAGE |
FAST PAGE |
Maximum access time |
70 ns |
60 ns |
70 ns |
60 ns |
Other features |
RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH |
RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH |
RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH |
RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH |
I/O type |
COMMON |
COMMON |
COMMON |
COMMON |
JESD-30 code |
R-PDSO-J24 |
R-PDSO-J24 |
R-PDSO-J24 |
R-PDSO-J24 |
JESD-609 code |
e0 |
e0 |
e0 |
e0 |
length |
18.44 mm |
18.44 mm |
18.44 mm |
18.44 mm |
memory density |
16777216 bit |
16777216 bi |
16777216 bit |
16777216 bit |
Memory IC Type |
FAST PAGE DRAM |
FAST PAGE DRAM |
FAST PAGE DRAM |
FAST PAGE DRAM |
memory width |
4 |
4 |
4 |
4 |
Number of functions |
1 |
1 |
1 |
1 |
Number of ports |
1 |
1 |
1 |
1 |
Number of terminals |
24 |
24 |
24 |
24 |
word count |
4194304 words |
4194304 words |
4194304 words |
4194304 words |
character code |
4000000 |
4000000 |
4000000 |
4000000 |
Operating mode |
ASYNCHRONOUS |
ASYNCHRONOUS |
ASYNCHRONOUS |
ASYNCHRONOUS |
Maximum operating temperature |
70 °C |
70 °C |
70 °C |
70 °C |
organize |
4MX4 |
4MX4 |
4MX4 |
4MX4 |
Output characteristics |
3-STATE |
3-STATE |
3-STATE |
3-STATE |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
SOJ |
SOJ |
SOJ |
SOJ |
Encapsulate equivalent code |
SOJ24/28,.44 |
SOJ24/28,.44 |
SOJ24/28,.44 |
SOJ24/28,.44 |
Package shape |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
Package form |
SMALL OUTLINE |
SMALL OUTLINE |
SMALL OUTLINE |
SMALL OUTLINE |
Peak Reflow Temperature (Celsius) |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
power supply |
5 V |
5 V |
5 V |
5 V |
Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
refresh cycle |
2048 |
4096 |
4096 |
2048 |
Maximum seat height |
3.68 mm |
3.68 mm |
3.68 mm |
3.68 mm |
self refresh |
NO |
NO |
NO |
NO |
Maximum standby current |
0.001 A |
0.001 A |
0.001 A |
0.001 A |
Maximum slew rate |
0.11 mA |
0.09 mA |
0.08 mA |
0.12 mA |
Maximum supply voltage (Vsup) |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
Minimum supply voltage (Vsup) |
4.5 V |
4.5 V |
4.5 V |
4.5 V |
Nominal supply voltage (Vsup) |
5 V |
5 V |
5 V |
5 V |
surface mount |
YES |
YES |
YES |
YES |
technology |
CMOS |
CMOS |
CMOS |
CMOS |
Temperature level |
COMMERCIAL |
COMMERCIAL |
COMMERCIAL |
COMMERCIAL |
Terminal surface |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Terminal form |
J BEND |
J BEND |
J BEND |
J BEND |
Terminal pitch |
1.27 mm |
1.27 mm |
1.27 mm |
1.27 mm |
Terminal location |
DUAL |
DUAL |
DUAL |
DUAL |
Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
width |
10.21 mm |
10.21 mm |
10.21 mm |
10.21 mm |