|
74LVC32ADB |
74LVC32APW-T |
74LVC32AD-T |
74LVC32ADB-T |
74LVC32ABQ |
74LVC32AD |
935273662115 |
74LVC32APW |
Description |
OR Gate |
OR Gate |
OR Gate |
OR Gate |
OR Gate |
OR Gate |
OR Gate |
OR Gate |
Is it Rohs certified? |
conform to |
conform to |
conform to |
conform to |
conform to |
conform to |
conform to |
conform to |
Maker |
Nexperia |
Nexperia |
Nexperia |
Nexperia |
Nexperia |
Nexperia |
Nexperia |
Nexperia |
package instruction |
SSOP, SSOP14.,3 |
TSSOP, |
SOP, |
SSOP, |
VQCCN, LCC14,.1X.12,20 |
SOP, SOP14,.25 |
DHVQFN-14 |
TSSOP-14 |
Reach Compliance Code |
compliant |
compliant |
compliant |
compliant |
compliant |
compliant |
compliant |
compliant |
series |
LVC/LCX/Z |
LVC/LCX/Z |
LVC/LCX/Z |
LVC/LCX/Z |
LVC/LCX/Z |
LVC/LCX/Z |
LVC/LCX/Z |
LVC/LCX/Z |
JESD-30 code |
R-PDSO-G14 |
R-PDSO-G14 |
R-PDSO-G14 |
R-PDSO-G14 |
R-PQCC-N14 |
R-PDSO-G14 |
R-PQCC-N14 |
R-PDSO-G14 |
length |
6.2 mm |
5 mm |
8.65 mm |
6.2 mm |
3 mm |
8.65 mm |
3 mm |
5 mm |
Logic integrated circuit type |
OR GATE |
OR GATE |
OR GATE |
OR GATE |
OR GATE |
OR GATE |
OR GATE |
OR GATE |
Number of functions |
4 |
4 |
4 |
4 |
4 |
4 |
4 |
4 |
Number of entries |
2 |
2 |
2 |
2 |
2 |
2 |
2 |
2 |
Number of terminals |
14 |
14 |
14 |
14 |
14 |
14 |
14 |
14 |
Maximum operating temperature |
125 °C |
125 °C |
125 °C |
125 °C |
125 °C |
125 °C |
125 °C |
125 °C |
Minimum operating temperature |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
SSOP |
TSSOP |
SOP |
SSOP |
VQCCN |
SOP |
HVQCCN |
TSSOP |
Package shape |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
Package form |
SMALL OUTLINE, SHRINK PITCH |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE |
SMALL OUTLINE, SHRINK PITCH |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
SMALL OUTLINE |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
propagation delay (tpd) |
10.4 ns |
10.4 ns |
10.4 ns |
10.4 ns |
10.4 ns |
10.4 ns |
10.4 ns |
10.4 ns |
Maximum seat height |
2 mm |
1.1 mm |
1.75 mm |
2 mm |
1 mm |
1.75 mm |
1 mm |
1.1 mm |
Maximum supply voltage (Vsup) |
3.6 V |
3.6 V |
3.6 V |
3.6 V |
3.6 V |
3.6 V |
3.6 V |
3.6 V |
Minimum supply voltage (Vsup) |
1.2 V |
1.2 V |
1.2 V |
1.2 V |
1.2 V |
1.2 V |
1.2 V |
1.2 V |
Nominal supply voltage (Vsup) |
1.8 V |
1.8 V |
1.8 V |
1.8 V |
1.8 V |
1.8 V |
1.8 V |
1.8 V |
surface mount |
YES |
YES |
YES |
YES |
YES |
YES |
YES |
YES |
technology |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
Temperature level |
AUTOMOTIVE |
AUTOMOTIVE |
AUTOMOTIVE |
AUTOMOTIVE |
AUTOMOTIVE |
AUTOMOTIVE |
AUTOMOTIVE |
AUTOMOTIVE |
Terminal form |
GULL WING |
GULL WING |
GULL WING |
GULL WING |
NO LEAD |
GULL WING |
NO LEAD |
GULL WING |
Terminal pitch |
0.65 mm |
0.65 mm |
1.27 mm |
0.65 mm |
0.5 mm |
1.27 mm |
0.5 mm |
0.65 mm |
Terminal location |
DUAL |
DUAL |
DUAL |
DUAL |
QUAD |
DUAL |
QUAD |
DUAL |
width |
5.3 mm |
4.4 mm |
3.9 mm |
5.3 mm |
2.5 mm |
3.9 mm |
2.5 mm |
4.4 mm |
JESD-609 code |
e4 |
e4 |
e4 |
- |
e4 |
e4 |
e4 |
e4 |
Humidity sensitivity level |
1 |
1 |
1 |
- |
1 |
1 |
1 |
1 |
Peak Reflow Temperature (Celsius) |
260 |
- |
260 |
NOT SPECIFIED |
260 |
260 |
- |
260 |
Terminal surface |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
- |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Maximum time at peak reflow temperature |
30 |
- |
30 |
NOT SPECIFIED |
30 |
30 |
- |
30 |